公开(公告)号：US20240164183A1

公开(公告)日：2024-05-16

申请号：US17780530

申请日：2021-07-28

Applicant: BOE Technology Group Co., Ltd.

Inventor： Chunyan XIE ,  Paoming TSAI ,  Song ZHANG ,  Li JIA ,  Tao GAO

IPC: H10K59/80 ,  H10K59/131

CPC classification number: H10K59/873 ,  H10K59/131

Abstract: Disclosed are a display substrate and a display apparatus. The display substrate includes a display region, an opening region located in the display region, and a frame region located between the display region and the opening region. The frame region at least includes a first isolation region, and the first isolation region includes at least one signal line group and at least one organic insulation layer which are stacked. At least two first isolation grooves are disposed in the at least one organic insulation layer, the at least two first isolation grooves are disposed at intervals along a direction away from the opening region, and an orthographic projection of the signal line group in the frame region is located between orthographic projections of the at least two first isolation grooves in the frame region.

公开(公告)号：US20230397450A1

公开(公告)日：2023-12-07

申请号：US18450716

申请日：2023-08-16

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Tao WANG ,  Song ZHANG

IPC: H10K50/84 ,  H10K71/00

CPC classification number: H10K50/841 ,  H10K71/00

Abstract: The present disclosure discloses an OLED package structure, a display panel and a method for preparing a package structure. The OLED package structure includes a substrate, an OLED disposed on the substrate, and a reinforcement hole disposed on at least one of the substrate and the OLED and extending along a side of the OLED towards the substrate; and an encapsulation layer covering the OLED, and at least a portion of the encapsulation layer extending into the reinforcement hole. Therefore, the reliability of the package structure can be increased, the adhesive strength of the package layer can be increased, peeling or package failure can be prevented, and the service life of the package structure can be improved.

公开(公告)号：US20220393121A1

公开(公告)日：2022-12-08

申请号：US17773022

申请日：2021-06-11

Applicant: BOE Technology Group Co., Ltd.

Inventor： Penghao GU ,  Yonghong ZHOU ,  Hao GAO ,  Song ZHANG

IPC: H01L51/00 ,  H01L51/56

Abstract: A supporting member of flexible display module and a preparation method therefor, the flexible display module, and a display device. The supporting member includes a substrate made of a metal material, a first planarization layer, and a second planarization layer; a plurality of through holes are formed on the substrate; the plurality of through holes run through a first surface and a second surface of the substrate which are opposite to each other; the first planarization layer is provided on the first surface; the second planarization layer is provided on the second surface and is filled into the plurality of through holes. The preparation method for the supporting member includes: forming a first planarization layer on a first surface of a substrate made of a metal material; forming a plurality of through holes on the substrate; and forming a second planarization layer on the second surface of the substrate.

公开(公告)号：US20220384540A1

公开(公告)日：2022-12-01

申请号：US16980836

申请日：2020-04-17

Applicant: BOE Technology Group Co., Ltd.

Inventor： Chengjie QIN ,  Rui HONG ,  Chunyan XIE ,  Tao WANG ,  Song ZHANG

IPC: H01L27/32 ,  H01L51/56 ,  H01L51/52

Abstract: Provided are a display substrate and a preparation method thereof, and a display apparatus. The display substrate includes a display area, a mounting hole located in the display area, and an encapsulation region located between the display area and the mounting hole. The encapsulation region includes an insulating layer, an encapsulation pixel definition layer arranged on the insulating layer, and a partition structure layer arranged on the encapsulation pixel definition layer. The encapsulation pixel definition layer includes multiple spaced protrusions, the partition structure layer includes multiple spaced columns, the columns are arranged on the protrusions, a functional layer is arranged on the multiple spaced columns, and the functional layer is broken by the columns.

公开(公告)号：US20220209189A1

公开(公告)日：2022-06-30

申请号：US17695666

申请日：2022-03-15

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Youwei WANG ,  Song ZHANG ,  Peng CAI

IPC: H01L51/52 ,  H01L27/32 ,  H01L51/56

Abstract: Provided are a display substrate, a method for manufacturing the display substrate, and a display device. The display substrate includes a display area, the display area including an opening area and an effective display area outside the opening area, wherein the display substrate includes: an array structure layer located in the effective display area; an isolation structure provided on a surface of the array structure layer surrounding the opening area, wherein the isolation structure has a first sidewall with an slope angle of greater than or equal to 90°; a first inorganic thin film covering the isolation structure.

公开(公告)号：US20210359253A1

公开(公告)日：2021-11-18

申请号：US16328498

申请日：2018-08-17

Applicant: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Quanqin SUN ,  Song ZHANG ,  Ang XIAO ,  Duanming LI

IPC: H01L51/52 ,  H01L51/00 ,  H01L51/56

Abstract: An encapsulation method of a display panel, a display panel and a display device are disclosed. The encapsulation method of the display panel includes: forming at least one thin film encapsulation inorganic material layer on a thin film encapsulation region of a display substrate; forming a photoresist pattern on the at least one thin film encapsulation inorganic material layer; and etching the at least one thin film encapsulation inorganic material layer by using the photoresist pattern as a mask to form a thin film encapsulation inorganic layer including a first opening pattern.

公开(公告)号：US20210343981A1

公开(公告)日：2021-11-04

申请号：US16604304

申请日：2018-11-23

Applicant: BOE TECHNOLOGY GROUP CO., LTD,

Inventor： Chunyan XIE ,  Song ZHANG

IPC: H01L51/52 ,  H01L51/56 ,  H01L27/32

Abstract: A display substrate and a manufacture method thereof, and a display device are provided. The display substrate includes a display region, the display region includes an organic functional layer, an encapsulation layer, and a first barrier wall; the display region has a first opening, the first barrier wall surrounds an outer edge of the first opening, the organic functional layer surrounds the first barrier wall, and the encapsulation layer covers the organic functional layer and the first barrier wall; the encapsulation layer includes a first portion and a second portion, the first portion is configured to cover a portion of the organic functional layer close to the first opening; a second portion is configured to cover a side of the first barrier wall adjacent to the organic functional layer, the first portion forms an obtuse angle with the second portion.

公开(公告)号：US20210328187A1

公开(公告)日：2021-10-21

申请号：US17362437

申请日：2021-06-29

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Dawei WANG ,  Song ZHANG

IPC: H01L51/52

Abstract: The present disclosure provides an OLED display motherboard and a method for manufacturing the same, a method for manufacturing the OLED display panel, and an OLED display device thereof. The OLED display motherboard includes a base substrate having a display region and a non-display region surrounding the display region, a TFT and an OLED device located within the display region of the base substrate, at least two crack stop slits located within the non-display region of the base substrate, an extending direction of the crack stop slit being the same as an extending direction of an edge of the display region of the base substrate, and adjacent crack stop slits being separated by a crack stop slit step, and an encapsulation layer covering the crack stop slit and the OLED device. A portion of the encapsulation layer has a non-uniform thickness.

公开(公告)号：US20210226162A1

公开(公告)日：2021-07-22

申请号：US16652712

申请日：2019-09-23

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Lingzhi QIAN ,  Rui HONG ,  Song ZHANG ,  Penghao GU

IPC: H01L51/52 ,  H01L51/56 ,  H01L33/56

Abstract: An encapsulation structure, an electronic apparatus, and an encapsulation method are provided. The encapsulation structure includes: a base substrate, an organic encapsulation layer and a barrier dam that are on the base substrate. The barrier dam is disposed outside the organic encapsulation layer; and the barrier dam includes an upper surface away from the base substrate and a side surface facing the organic encapsulation layer, and at least one of the upper surface and the side surface includes a groove and a protrusion.

公开(公告)号：US20210193760A1

公开(公告)日：2021-06-24

申请号：US16766797

申请日：2019-12-26

Applicant: BOE Technology Group Co., Ltd.

Inventor： Chunyan XIE ,  Song ZHANG ,  Pinfan WANG ,  Tao WANG ,  Penghao GU

IPC: H01L27/32 ,  H01L51/00 ,  H01L51/52 ,  H01L51/56

Abstract: The present disclosure provides an organic light-emitting display panel, a method for preparing the same and a display device. The method includes: providing a substrate, where the substrate includes a non-display area and a display area surrounding the non-display area; forming a barrier layer and a pixel circuit on the substrate, where an orthographic projection of the pixel circuit on the substrate and an orthographic projection of the non-display area on the substrate do not overlap; patterning the barrier layer in the non-display area to form at least one via hole penetrating the barrier layer; patterning the substrate by using the barrier layer as a mask in the non-display area to form a groove; forming a light emitting layer on the pixel circuit; and forming a thin film encapsulation layer covering the light emitting layer and the side wall of the draw-in structure on the light emitting layer.