公开(公告)号：US20210247569A1

公开(公告)日：2021-08-12

申请号：US16787632

申请日：2020-02-11

Applicant: Cisco Technology, Inc.

Inventor： Matthew J. TRAVERSO ,  Jock T. BOVINGTON ,  Ashley J.M. ERICKSON

IPC: G02B6/13 ,  G02B6/12

Abstract: Solder reflow compatible connections between optical components are provided by use of reflow compatible epoxies to bond optical components and remain bonded between the optical components at temperatures of at least 260 degrees Celsius for at least five minutes. In some embodiments, the reflow compatible epoxy is index matched to the optical channels in the optical components and is disposed in the light path therebetween. In some embodiments, a light path is defined between the optical channels through at least a portion of an air gap between the optical components.

公开(公告)号：US20210091529A1

公开(公告)日：2021-03-25

申请号：US16581923

申请日：2019-09-25

Applicant: Cisco Technology, Inc.

Inventor： Dominic F. SIRIANI ,  Vipulkumar K. PATEL ,  Jock T. BOVINGTON ,  Matthew J. TRAVERSO

IPC: H01S3/23 ,  H01L31/0304 ,  H01S5/10 ,  H01S5/14 ,  G02B6/12

Abstract: Described herein is a two chip photonic device (e.g., a hybrid master oscillator power amplifier (MOPA)) where a gain region and optical amplifier region are formed on a III-V chip and a variable reflector (which in combination with the gain region forms a laser cavity) is formed on a different semiconductor chip that includes silicon, silicon nitride, lithium niobate, or the like. Sides of the two chips are disposed in a facing relationship so that optical signals can transfer between the gain region, the variable reflector, and the optical amplifier.

公开(公告)号：US20200124794A1

公开(公告)日：2020-04-23

申请号：US16433846

申请日：2019-06-06

Applicant: Cisco Technology, Inc.

Inventor： Jock T. BOVINGTON ,  Kenneth J. THOMSON ,  Dominic F. SIRIANI

IPC: G02B6/122 ,  G02B6/13

Abstract: Embodiments provide for a photonic platform, comprising: a silicon component; a III-V component; and a bonding layer contacting the silicon component on one side and the III-V component on the opposite side; wherein the silicon component comprises: a silicon substrate; a dielectric, contacting the silicon substrate on one face and the bonding layer on the opposite face; a silicon cores disposed in the dielectric; and wherein the III-V component comprises: a III-V cladding; a III-V contact, having a first side that contacts the bonding layer; and an active region, disposed on the III-V contact and separating the III-V contact from the III-V cladding, wherein the active region is located relative to the silicon cores to define an optical path that includes the active region and the silicon cores.

公开(公告)号：US20200088940A1

公开(公告)日：2020-03-19

申请号：US16132109

申请日：2018-09-14

Applicant: Cisco Technology, Inc.

Inventor： Jock T. BOVINGTON ,  Matthew J. TRAVERSO

IPC: G02B6/12 ,  H01S5/026 ,  H04B10/25

Abstract: A method comprises receiving, at a plurality of optical distributors of a photonic chip, optical energy from a plurality of primary laser sources. Each of the optical distributors receives optical energy from a respective primary laser source at a respective first input. The method further comprises detecting a failed primary laser source of the primary laser sources using control circuitry of a sparing system. The sparing system further comprises one or more secondary laser sources configured to provide optical energy to respective second inputs of the optical distributors. A first one of the secondary laser sources is optically coupled with at least two of the optical distributors. The method further comprises controlling, using the control circuitry, a first one of the secondary laser sources to selectively provide optical energy to the optical distributor whose first input is optically coupled with the failed primary laser source.

公开(公告)号：US20200044412A1

公开(公告)日：2020-02-06

申请号：US16052441

申请日：2018-08-01

Applicant: Cisco Technology, Inc.

Inventor： Jock T. BOVINGTON ,  Ashley J. MAKER ,  Kumar Satya Harinadh POTLURI

IPC: H01S5/022 ,  G02B6/12 ,  G02B6/42

Abstract: A submount assembly comprises a first substrate having a first surface and an opposing second surface, wherein a plurality of first grooves are formed into the first substrate from the first surface. Each first groove is dimensioned to receive a portion of a respective optical fiber of a plurality of optical fibers, and to arrange the optical fiber with a predetermined first height relative to the first surface. The submount assembly further comprises a plurality of first conductive traces on a side of the first substrate corresponding to the first surface, and a semiconductor laser contacted with the first conductive traces. The semiconductor laser has a predetermined second height relative to the first surface. The submount assembly further comprises a plurality of second conductive traces at the second surface and a plurality of first vias extending through the first substrate from the first conductive traces to the second conductive traces.