公开(公告)号：US06590658B2

公开(公告)日：2003-07-08

申请号：US09789317

申请日：2001-02-20

申请人： Steven K. Case ,  Gregory S. Mowry ,  Timothy A. Skunes ,  Patrick J. Garfield ,  John T. McElreath

发明人： Steven K. Case ,  Gregory S. Mowry ,  Timothy A. Skunes ,  Patrick J. Garfield ,  John T. McElreath

IPC分类号： G01B1100

CPC分类号： G02B6/4236 ,  G02B6/255 ,  G02B6/2553 ,  G02B6/2555 ,  G02B6/3616 ,  G02B6/362 ,  G02B6/3636 ,  G02B6/3652 ,  G02B6/3838 ,  G02B6/3873 ,  G02B6/4221 ,  G02B6/4224 ,  G02B6/4225 ,  G02B6/4226 ,  G02B6/4227 ,  G02B6/4228 ,  G02B6/4231 ,  G02B6/4232 ,  G02B6/4239

摘要： An optical alignment system is provided for aligning an optical module of the type which is suitable for use in an optical device. The system includes a reference base having a registration feature that aligns with a registration feature of the optical module. An optical sensor senses an optical characteristic of the optical element and optical element manipulator moves the optical element relative to the registration features of the optical module. A controller operates the optical element manipulator.

公开(公告)号：US5309223A

公开(公告)日：1994-05-03

申请号：US719727

申请日：1991-06-25

申请人： John P. Konicek ,  Steven K. Case ,  Timothy A. Skunes ,  Jeffrey A. Jalkio

发明人： John P. Konicek ,  Steven K. Case ,  Timothy A. Skunes ,  Jeffrey A. Jalkio

IPC分类号： G01R31/311 ,  H05K13/08 ,  G01N21/84

CPC分类号： G01R31/311 ,  H05K13/08

摘要： A high speed, high precision laser-based semiconductor lead measurement system for use on surface mount component placement machines. A laser system is used to accurately sense the position and condition of each of the many leads used on integrated circuits prior to their placement on a surface mount circuit board by a pick and place machine. Using one, two or three laser beams, the non-contact sensor system can, with the highest degree of resolution, determine lateral orientation and coplanarity of leads for integrated circuit components, even those having an ultra-fine pitch. Determination of the lead position by the invention is based on the integrated circuit leads occluding the light of one or more precisely directed and focused laser light sources. Each integrated circuit lead is passed through the focal point of a laser beam. The position of each lead is determined when it blocks all or a portion of the light of the laser beam. A processor means is used to calculate the actual position of each lead. The difference between the actual position of the lead and the nominal position of the lead can then be computed. The position of each lead is then sorted to determine the greatest deviation of any lead from a best fit plane. The processor may then either generate a reject or a repositioning signal to the component placement machine for proper placement of the integrated circuit upon the surface mount circuit board.

摘要翻译： 一种用于表面贴装元件贴装机的高速，高精度的基于激光的半导体引线测量系统。 激光系统用于在通过拾取和放置机器放置在表面安装电路板之前，精确地检测在集成电路上使用的许多引线中的每一个的位置和状态。 使用一个，两个或三个激光束，非接触式传感器系统可以以最高的分辨率确定用于集成电路部件的引线的横向取向和共面性，即使是具有超细间距的那些。 通过本发明确定引线位置是基于封闭一个或多个精确定向和聚焦的激光光源的光的集成电路引线。 每个集成电路引线通过激光束的焦点。 当它阻挡激光束的全部或一部分光时，确定每个引线的位置。 处理器装置用于计算每个引线的实际位置。 然后可以计算引线的实际位置和引线的标称位置之间的差异。 然后对每个引线的位置进行排序，以确定任何引线与最佳拟合平面的最大偏差。 然后，处理器可以向组件放置机器生成拒绝或重新定位信号，以便将集成电路正确放置在表面安装电路板上。

公开(公告)号：US5278634A

公开(公告)日：1994-01-11

申请号：US659983

申请日：1991-02-22

申请人： Timothy A. Skunes ,  Steven K. Case ,  Curtis J. Bocchi

发明人： Timothy A. Skunes ,  Steven K. Case ,  Curtis J. Bocchi

IPC分类号： G01B11/24 ,  G01B11/00 ,  G01B11/245 ,  G01B11/27 ,  G01D5/34 ,  H05K13/04

CPC分类号： G01B11/272 ,  G01D5/342

摘要： A high speed high precision laser based alignment sensor system for use on surface mount component placement machines. A laser system is utilized to correctly align and position component parts which range between 0.02 inches and 2.0 inches in size. The laser sensor system consists of a laser light source which is passed through a collimating lens and then through an aperture to create a stripe of collimated laser light which is focused past the component being aligned to strike a multi-element CCD sensor array. The sensor system is mounted directly on the carrying mechanism for the surface mount component placement machine. During transit of the component between the bin of components and the circuit board upon which the component is to be placed, the component is rotated and the shadow which falls on the detector array is monitored. When the minimum width of shadow is detected, the correct angular orientation is determined, the average of the edges of the shadow when compared with the center of the quill determines the coordinate (X,Y) location of the component on the quill. Two alignments normally occur displaced by 90.degree.. Thereafter, the sensor sends correcting signals to the component placement machine to assure the correct angular orientation and the correct X,Y position for the component to be placed on the circuit board by the component placement machine.

摘要翻译： 用于表面贴装元件贴装机的高速高精度激光对准传感器系统。 使用激光系统来正确对准和定位尺寸在0.02英寸和2.0英寸之间的组件。 激光传感器系统由激光光源组成，该激光光源通过准直透镜，然后穿过孔径，以产生准直激光条，其被聚焦经过对准的部件以撞击多元件CCD传感器阵列。 传感器系统直接安装在表面安装元件贴装机的搬运机构上。 在组件箱和要放置组件的电路板之间的部件运输期间，组件被旋转并且监测落在检测器阵列上的阴影。 当检测到阴影的最小宽度时，确定正确的角度方向，与羽毛笔中心相比，阴影边缘的平均值决定了羽毛笔上部件的坐标（X，Y）位置。 两个对准通常发生位移90度。 此后，传感器将校正信号发送到组件放置机，以确保组件放置机器将组件放置在电路板上的正确角度定位和正确的X，Y位置。