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公开(公告)号：US12108536B2
公开(公告)日：2024-10-01
申请号：US16919726
申请日：2020-07-02
发明人： Jeongyeob Kim
IPC分类号： H05K13/08 , B23K3/08 , B23K101/42
CPC分类号： H05K13/08 , B23K3/08 , H05K13/0817 , H05K13/083 , B23K2101/42
摘要： A component mounting system and a method for inspecting mounted components are provided. A component mounting system according to an embodiment, comprises a solder inspection apparatus comparing coordinate information of the solder, which is obtained through measurement of a substrate to which solder is applied, with reference coordinate information to generate coordinate correction data; and a first mounting inspection apparatus comparing a first measurement data obtained by measuring mounting state of a component when the component is mounted based on the coordination correction data through a component mounting apparatus, with the coordinate correction data to verify whether a component is mounted on a position corrected based on the coordinate correction data. In this manner, by adding the verification function for the performance function of the component mounting apparatus to the inspection apparatus, it is possible to monitor the operation state of the component mounting apparatus in each process step.
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公开(公告)号：US11961770B2
公开(公告)日：2024-04-16
申请号：US17518918
申请日：2021-11-04
发明人： Chia-Han Lin , Chien-Fa Lee , Hsu-Shui Liu , Jiun-Rong Pai , Sheng-Hsiang Chuang , Surendra Kumar Soni , Shou-Wen Kuo , Wu-An Weng , Gary Tsai , Chien-Ko Liao , Ya Hsun Hsueh , Becky Liao , Ethan Yu , Ming-Chi Tsai , Kuo-Yi Liu
IPC分类号： H01L21/66 , G06V10/22 , H01L21/67 , H01L21/677 , H01L21/687 , H05K13/08 , G06V30/10
CPC分类号： H01L22/12 , G06V10/225 , H01L21/67017 , H01L21/67288 , H01L21/6776 , H01L21/68764 , H01L22/24 , H05K13/08 , G06V30/10
摘要： Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.
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公开(公告)号：US20230403835A1
公开(公告)日：2023-12-14
申请号：US18456814
申请日：2023-08-28
发明人： Hirokazu TAKEHARA , Takaaki YOKOI
CPC分类号： H05K13/0069 , H05K13/0061 , H05K13/08 , G06F30/00 , G06T11/60 , Y10T29/49119 , Y10T29/53174 , Y10T29/53191
摘要： A support pin arrangement determination assisting apparatus including a display unit which displays an image including a board image, the board image indicating a shape and an arrangement of a component on the board, a position input unit through which an arrangement position of the support pin is input, a display processing unit which causes the display unit to display a figure to be superimposed on the board image, the figure corresponding to the support pin of which the arrangement position is input, a storage unit which stores three-dimensional shape data of an electronic component and three-dimensional shape data of the support pin, an interference judging unit which judges whether or not one or some of the support pins of which arrangement positions input interfere an already mounted component, and an alarm unit which announces occurrence of interference if the interference judging unit judges the occurrence of interference.
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公开(公告)号：US20180310446A1
公开(公告)日：2018-10-25
申请号：US15767527
申请日：2015-10-14
发明人： Kazushi TAKAMA , Jun ASAI
CPC分类号： H05K13/0465 , H05K13/0015 , H05K13/0061 , H05K13/021 , H05K13/08 , H05K13/083
摘要： A substrate working system includes a component mounter that mounts a component on a substrate, and an inspection unit provided in the component mounter or a device downstream of the component mounter and that performs a substrate inspection different from a normal substrate inspection when an abnormality related to a mounting operation is detected in the component mounter.
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公开(公告)号：US20180221910A1
公开(公告)日：2018-08-09
申请号：US15747765
申请日：2016-08-31
申请人： NORDSON CORPORATION
CPC分类号： B05C5/0225 , B05B1/3046 , B05C5/022 , B05C5/0291 , B05C11/1034 , H05K13/0469 , H05K13/08
摘要： A method of calibrating the jetting profile includes applying voltage to a piezoelectric actuator to move a valve closure structure between non-impact and impact positions, sensing the position of the valve closure structure, establishing a reference point using voltage and position data, and using the reference point to adjust the voltage applied. Another method uses a mechanical stop to calibrate a jetting system. This method includes applying voltage to the piezoelectric actuator to move the valve closure structure between non-impact and impact calibration positions, sensing the position of the valve closure structure, generating voltage and position calibration data, establishing a master reference point using this data, and using the master reference point to determine wear of at least one of: the piezoelectric actuator and the valve closure structure. Another method of operating a jetting system includes the user inputting information into a control component. Another method involves using voltage data and the position data relating to a piezoelectric actuator for preventative maintenance of one or more components of the jetting valve.
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公开(公告)号：US20180206372A1
公开(公告)日：2018-07-19
申请号：US15866703
申请日：2018-01-10
CPC分类号： H05K13/08 , B23K2101/42 , G06Q50/04 , H05K13/085 , Y02P90/30
摘要： A group determination method includes an external set-up work time calculation step of calculating an external set-up work time for an external set-up work by which a component supplier used in a group that is a next production target of a group under production in a component mounting line, including a plurality of the component mounters capable of attaching and detaching a component supply carriage which can arrange a plurality of the component suppliers (tape feeders), is removed from the component mounting line and arranged in the component supply carriage; and a production completion time calculation step of calculating a production completion time at which the production of all the mounting boards that are the production targets is completed in consideration of the external set-up work time. A plurality of groups which are common in an arrangement of component suppliers of a plurality of types of the mounting boards that are the production targets are determined so that production completion time is shortened.
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公开(公告)号：US20180205855A1
公开(公告)日：2018-07-19
申请号：US15741599
申请日：2015-07-06
发明人： Masafumi AMANO , Kazuya KOTANI
CPC分类号： H04N5/2253 , G06T3/4069 , H04N5/2254 , H04N5/232 , H04N5/23238 , H05K13/0404 , H05K13/0413 , H05K13/08 , H05K13/081 , H05K13/0812
摘要： Mounting device 11 captures an image of reference mark 25 at a first position at which mounting head 22 is stopped under first imaging conditions, and captures an image of component 60 under second imaging conditions. Then, mounting device 11 moves mounting head 22 and captures an image of reference mark 25 at a second position at which mounting head 22 is stopped under the first imaging conditions, and captures a second image of component 60 under the second imaging conditions. Further, mounting device 11 generates an image of component 60 picked up by mounting head 22 based on the positional relationship of reference mark 25 using the first image and the second image.
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公开(公告)号：US20180199476A1
公开(公告)日：2018-07-12
申请号：US15741672
申请日：2015-07-10
发明人： Daisuke MATSUSHITA , Daisuke KASUGA
CPC分类号： H05K13/0408 , B23K1/0016 , B23K2101/42 , H05K3/303 , H05K13/0465 , H05K13/0469 , H05K13/08
摘要： A component mounting system reduces the waste of components while mounting components via an application material. The system determines whether or not to permit the start of the mounting process to a plurality of applying locations based on the post-application elapsed time that has elapsed after the application of the adhesive to the applying location. That is, the system predicts the post-application elapsed time exceeds the time limit at the mounting timing at which the component is mounted in the mounting process for each applying location. If the plurality of applying locations include no applying location where the post-application elapsed time exceeds the time limit at the mounting timing, the start of the mounting process is permitted. However, if there is any applying location where the post-application elapsed time exceeds the time limit at the mounting timing, the start of the mounting process is prohibited.
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公开(公告)号：US09999169B2
公开(公告)日：2018-06-12
申请号：US15017170
申请日：2016-02-05
发明人： Hideki Sumi
CPC分类号： H05K13/0413 , H05K13/0417 , H05K13/08 , H05K13/081
摘要： A component mounting method performs suction and holing, by a suction nozzle, of a component fed to a component picking-up position by a tape feeder which feeds by pitch a carrier tape having a pocket in which the component is accommodated, after a predetermined delay time elapses after a pitch feeding timing, and carries and mounts the component on a board. The component mounting method includes imaging a tape position indicating portion at separate two timings after the delay time elapses, and calculating a shift amount between a first and second tape positions respectively obtained at first and second timings of imaging. It is determined whether or not the shift amount calculated is within an allowable range, and when it is determined that the shift amount exceeds the allowable range, the delay time set for the tape feeder is extended or an error is notified.
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公开(公告)号：US09980420B2
公开(公告)日：2018-05-22
申请号：US15100507
申请日：2013-12-02
发明人： Masafumi Amano , Hiroshi Oike , Hirotake Esaki
CPC分类号： H05K13/08 , G06T3/4053 , H05K13/0408 , H05K13/0409 , H05K13/041 , H05K13/0452 , H05K13/0812 , H05K13/0813 , Y10T29/53174
摘要： The assembling machine is provided with fiducial marks which are attached to a defined position on a moving head, and an image processing section which recognizes the holding state of the component by the holding member based on high resolution data which is generated by super-resolution processing which uses a plurality of items of image data. The image processing section includes a displacement amount calculation section which calculates each displacement amount of imaging positions of other items of image data in relation to the imaging position of reference data, a positioning processing section which performs the positioning of the other items of image data in relation to the reference data, and a reconstruction processing section which generates the high resolution data based on the plurality of items of image data which are positioned.
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