摘要:
A high speed, high precision laser-based semiconductor lead measurement system for use on surface mount component placement machines. A laser system is used to accurately sense the position and condition of each of the many leads used on integrated circuits prior to their placement on a surface mount circuit board by a pick and place machine. Using one, two or three laser beams, the non-contact sensor system can, with the highest degree of resolution, determine lateral orientation and coplanarity of leads for integrated circuit components, even those having an ultra-fine pitch. Determination of the lead position by the invention is based on the integrated circuit leads occluding the light of one or more precisely directed and focused laser light sources. Each integrated circuit lead is passed through the focal point of a laser beam. The position of each lead is determined when it blocks all or a portion of the light of the laser beam. A processor means is used to calculate the actual position of each lead. The difference between the actual position of the lead and the nominal position of the lead can then be computed. The position of each lead is then sorted to determine the greatest deviation of any lead from a best fit plane. The processor may then either generate a reject or a repositioning signal to the component placement machine for proper placement of the integrated circuit upon the surface mount circuit board.
摘要:
A high speed, high precision laser-based semiconductor lead measurement system for use on surface mount component placement machines. A multi-beam laser system is used to accurately sense the position and condition of each of the many leads used on integrated circuits prior to their placement on a surface mount circuit board by a pick and place machine. Using two, three or four laser beams, the non-contact sensor system can, with the highest degree of resolution, determine lateral orientation, height, colinearity, and coplanarity of leads for integrated circuit components, even those having an ultra-fine pitch. Determination of the lead position by the invention is based on the integrated circuit leads occluding the light of one or more precisely directed and focused laser light sources. Each integrated circuit lead is passed nominally through the focal point of a laser beam. The position of each lead is determined when it blocks all or a portion of the light of the laser beam. A processor means is used to calculate the actual position of each lead. The difference between the actual position of the lead and the nominal position of the lead can then be computed. The position of each lead is then sorted to determine the greatest deviation of any lead from a best fit line or from the Seating Plane. The processor may then either generate a reject or a repositioning signal to the component placement machine for proper placement of the integrated circuit upon the surface mount circuit board.
摘要:
The system of the present invention reports a signal related to a physical condition of an object, such as an electronic component, with the most basic realization of the system including a vacuum quill for releasably holding the object and a motion control system for rotating the quill. The invention includes control electronics coupled to the detector for providing a trigger signal where the detector is oriented to view a stripe in a viewing plane perpendicular to the central axis of the quill, and to provide an image of the stripe. The control electronics sends a plurality of trigger signals to the detector while the motion control system rotates the quill, with each trigger signal triggering the acquisition of another image of a stripe. A processing circuit processes the plurality of images of the stripes to provide the signal related to the physical condition of the object, which can include the orientation or location of the component, the presence or absence of balls on a ball grid array, the height of a specific lead on a leaded component, the distance between the leads on a leaded component or the coplanarity of features on the component. A method for picking and placing components is also disclosed for use with the apparatus of the present invention.
摘要:
The present invention includes a system for providing a signal related to a physical condition of an object, such as an electronic component. Various types of electronic components may be used with the present invention, including leaded components, column, pin or grid array packages, and the like. The system includes a quill for releasably holding the object. The object has a major surface defining a plane, and a motion control system for rotating the quill about a central axis. Control electronics in the invention provide a plurality of trigger signals to each of two detectors, each detector adapted to view the same stripe in the plane upon receipt of a trigger signal and to output an image of the stripe. The detectors view a plurality of stripes while the motion control system rotates the quill, and the output from the detectors is received by processing circuitry for processing the plurality of images of the stripes to provide the signal related to the physical condition of the object. The signal may be computed to provide the orientation of the object, the location of a feature on the object, the distance between leads on a leaded component or the coplanarity of raised features on the object. A method of picking and placing components is also disclosed for use with the apparatus of the present invention.
摘要:
A pick and place machine includes a sensor disposed to acquire an image of a nozzle before a pick operation, and one or more images after the pick operation. Image analytics based upon these images reveal important characteristics that can be used to classify the pick operation. In some embodiments, a plurality of after-pick images are acquired at different poses (angular orientations).
摘要:
An electronics assembly apparatus with improved pick evaluation is provided. The apparatus includes a placement head having at least one nozzle for releasably picking up and holding a component. A robotic system is provided for generating relative movement between the placement head and a workpiece, such as a circuit board. An image acquisition system is disposed to obtain at least one before-pick image of a component pick up location and at least one after-pick image of the component pick up location. The before-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view, while the after-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view.
摘要:
An electronics assembly apparatus with improved pick evaluation is provided. The apparatus includes a placement head having at least one nozzle for releasably picking up and holding a component. A robotic system is provided for generating relative movement between the placement head and a workpiece, such as a circuit board. An image acquisition system is disposed to obtain at least one before-pick image of a component pick up location and at least one after-pick image of the component pick up location. The before-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view, while the after-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view.
摘要:
A sensor for sensing placement information of a component to be placed by a pick and place machine is disclosed. The sensor includes a plurality of light sources each of which is disposed to direct illumination at different angles of incidence upon the component. Each source is further adapted to generate light based upon an energization signal. Source control electronics are provided and coupled to the plurality of light sources to successively and/or provide energization signals to each source. A detector is disposed within the sensor relative to the plurality of sources to receive at least one shadow of the component, and provide data at a detector output indicative of the shadow imaged while the component is rotated.
摘要:
A method of sensing a component held by a nozzle of a pick and place machine is provided. The method includes engaging a source of illumination and recording a reference background image when no component is held by the nozzle. Then, a component is adhered to the nozzle. A shadow image of the component is detected while the component is held by the nozzle. The detected shadow image of the component is adjusted based upon the recorded reference background image. Positional information relative to the component held on the nozzle is computed using the adjusted shadow image. The component is then mounted upon a workpiece using the positional information.
摘要:
A method of sensing a component held by a nozzle of a pick and place machine is provided. The method includes engaging a source of illumination and recording a reference background image when no component is held by the nozzle. Then, a component is adhered to the nozzle. A shadow image of the component is detected while the component is held by the nozzle. The detected shadow image of the component is adjusted based upon the recorded reference background image. Positional information relative to the component held on the nozzle is computed using the adjusted shadow image. The component is then mounted upon a workpiece using the positional information.