摘要:
The microreactor has a body of semiconductor material; a large area buried channel extending in the body and having walls; a coating layer of insulating material coating the walls of the channel; a diaphragm extending on top of the body and upwardly closing the channel. The diaphragm is formed by a semiconductor layer completely encircling mask portions of insulating material.
摘要:
A process that includes the steps of forming, in a wafer of monocrystalline silicon, first trenches extending between portions of the wafer; etching the substrate to remove the silicon around the first trenches and forming cavities in the substrate; covering the walls of the cavities with an epitaxial growth inhibiting layer; growing a monocrystalline epitaxial layer on top of the substrate and the cavities so as to obtain a monocrystalline wafer embedding buried cavities completely surrounded by silicon; forming second trenches extending in the epitaxial layer as far as the cavities; removing the epitaxial growth inhibiting layer; oxidizing the cavities, forming at least one continuous region of buried oxide; depositing a polysilicon layer on the entire surface of the wafer and inside the second trenches; removing the polysilicon layer on the surface and leaving filling regions inside the second trenches; and oxidizing, on the top, portions of said filling regions so as to form field oxide regions.
摘要:
To manufacture a layer of semiconductor material, a first wafer of semiconductor material is subjected to implantation to form a defect layer at a distance from a first face; the first wafer is bonded to a second wafer, by putting an insulating layer present on the second wafer in contact with the first face of the first wafer. Then, hydrogen atoms are introduced into the first wafer through a second face at an energy such as to avoid defects to be generated in the first wafer and at a temperature lower than 600° C. Thereby, the first wafer splits into a usable layer, bonded to the second wafer, and a remaining layer disposed between the defect layer and the second face of the first wafer. Prior to bonding, the first wafer is subjected to processing steps for obtaining integrated components.
摘要:
An optical two-dimensional position sensor including a selective optical unit which faces, and is displaceable relative to, an integrated device. The selective optical unit is formed by a polarized light source and a filter with four quadrants which permits passage of light through two quadrants only. The selective optical unit is attached to a control lever such as to translate in a plane along a first direction and a second direction, and to pivot around an axis which is orthogonal to the preceding directions. In a transparent package, the integrated device comprises a first group of sensor elements which are spaced along the first direction, a second group of sensor elements which are spaced along the second direction and a third group of sensor elements which detect an angular position of the selective optical unit. Electronics which are integrated with the sensor elements generates a code which is associated with each position which is assumed by the selective optical unit and a control signal which corresponds to a function to be performed.