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公开(公告)号：US20230279876A1
公开(公告)日：2023-09-07
申请号：US18196928
申请日：2023-05-12
CPC分类号： F04F7/00 , B01L3/50273 , B01L3/502738 , B81B1/006 , F04B53/10 , B01L2200/141 , B01L2200/16 , B01L2400/0605 , B81B2201/051 , B81B2203/0338
摘要： The present disclosure is drawn to inertial pumps. An inertial pump can include a microfluidic channel, a fluid actuator located in the microfluidic channel, and a check valve located in the microfluidic channel. The check valve can include a moveable valve clement, a narrowed channel segment located upstream of the moveable valve element, and a blocking element formed in the microfluidic channel downstream of the moveable valve element. The narrowed channel segment can have a width less than a width of the moveable valve element so that the moveable valve element can block fluid flow through the check valve when the moveable valve element is positioned in the narrowed channel segment. The blocking element can be configured such that the blocking element constrains the moveable valve element within the check valve while also allowing fluid flow when the moveable valve element is positioned against the blocking element.
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2.发明授权公开(公告)号：US09643179B1
公开(公告)日：2017-05-09
申请号：US15192281
申请日：2016-06-24
IPC分类号： G01N27/403 , B01L3/00 , B82B1/00 , B82B3/00
CPC分类号： G01N27/4146 , B01L3/502707 , B01L3/502761 , B01L2200/0663 , B01L2300/0861 , B01L2300/0887 , B01L2300/0896 , B81B2201/051 , B81C1/00119 , B81C2201/0181 , B82B1/005 , B82B3/008 , G01N27/4145 , G01N33/48721
摘要： Techniques for fabricating horizontally aligned nanochannels are provided. In one aspect, a method of forming a device having nanochannels is provided. The method includes: providing a SOI wafer having a SOI layer on a buried insulator; forming at least one nanowire and pads in the SOI layer, wherein the nanowire is attached at opposite ends thereof to the pads, and wherein the nanowire is suspended over the buried insulator; forming a mask over the pads, the mask having a gap therein where the nanowire is exposed between the pads; forming an alternating series of metal layers and insulator layers alongside one another within the gap and surrounding the nanowire; and removing the nanowire to form at least one of the nanochannels in the alternating series of the metal layers and insulator layers. A device having nanochannels is also provided.
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3.发明授权Processes for rapid microfabrication using thermoplastics and devices thereof 有权使用热塑性塑料快速微细加工的方法及其装置公开(公告)号：US09522820B2
公开(公告)日：2016-12-20
申请号：US12742598
申请日：2008-11-12
申请人： Michelle Khine , Chi-shuo Chen , Anthony Grimes , David Nate Breslauer , Luke Lee , Michael Dunlap , Ajay Gopinathan , Sayantani Ghosh
发明人： Michelle Khine , Chi-shuo Chen , Anthony Grimes , David Nate Breslauer , Luke Lee , Michael Dunlap , Ajay Gopinathan , Sayantani Ghosh
CPC分类号： B01L3/502707 , B01F5/0057 , B01F5/0646 , B01F5/0647 , B01F13/0059 , B01F2215/0037 , B01L2200/12 , B01L2300/0816 , B01L2300/0867 , B01L2300/0887 , B81B1/002 , B81B2201/051 , B81B2201/058 , B81B2203/0338 , B81C1/00071 , B81C2201/0152 , B82Y40/00 , G03F7/0002 , H01L21/02269 , H01L21/02271
摘要： A method is provided to prepare one or more microfluidic channels on a receptive material by applying an image-forming material to a heat sensitive thermoplastic receptive material in a designed pattern and heating the material under conditions that reduce the size of the thermoplastic receptive material by at least about 60%. In an alternative aspect, the microfluidic channels on receptive material are prepared by etching a designed pattern into a heat sensitive thermoplastic material support and then heating the material under conditions that reduce the size of the thermoplastic receptive material by at least about 60%.
摘要翻译： 提供了一种通过将图像形成材料以设计图案施加到热敏性热塑性接受材料上并在加热材料的条件下，通过在下述条件下加热该材料的方法来制备接受材料上的一个或多个微流体通道： 至少约60％。 在另一方面，接收材料上的微流体通道是通过将设计的图案蚀刻成热敏热塑性材料载体，然后在将热塑性接受材料的尺寸减小至少约60％的条件下加热材料来制备的。
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公开(公告)号：US09481571B2
公开(公告)日：2016-11-01
申请号：US14564406
申请日：2014-12-09
申请人： Henry Helvajian
发明人： Henry Helvajian
CPC分类号： B81C1/00341 , B01J19/0093 , B01J2219/00788 , B01J2219/00835 , B01L3/502707 , B01L3/50273 , B01L3/502738 , B01L2300/0654 , B01L2300/0874 , B01L2300/12 , B01L2400/0439 , B01L2400/0478 , B01L2400/0633 , B28B1/001 , B33Y10/00 , B33Y80/00 , B81B2201/051 , B81B2203/0338 , B81C1/00634 , C06B21/00 , F16L55/00 , G03F7/70216 , Y10T29/49117
摘要： A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.
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公开(公告)号：US09222185B2
公开(公告)日：2015-12-29
申请号：US12933184
申请日：2009-03-12
IPC分类号： B82Y15/00 , B82Y30/00 , B82Y40/00 , C25D1/00 , B01J19/00 , B01J23/42 , B01J23/72 , B01J35/00 , B22F1/00 , B22F3/00 , B81C99/00 , C25D1/04 , C25D1/08 , C25D5/18
CPC分类号： C25D1/006 , B01J19/0093 , B01J23/42 , B01J23/72 , B01J35/0006 , B01J2219/00783 , B01J2219/00835 , B01J2219/00846 , B01J2219/00853 , B01J2219/0086 , B01J2219/00873 , B22F1/0025 , B22F3/002 , B81B2201/0292 , B81B2201/051 , B81C99/0085 , B82Y15/00 , B82Y30/00 , B82Y40/00 , C25D1/00 , C25D1/003 , C25D1/04 , C25D1/08 , C25D5/18 , G01F1/688 , G01N25/00 , Y10S977/762 , Y10T29/49117 , Y10T428/12201 , Y10T428/12389 , Y10T428/24562 , Y10T428/24893 , Y10T428/25
摘要： The invention concerns a nanowire structural element suited for use in a microreactor system or microcatalyzer system. A template based process is used for the production of the nanowire structural element, wherein the nanowires are electrochemically depositioned in the nanopores. The irradiation is carried out at different angles, such that a nanowire network is formed. The hollow chamber-like structure in the nanowire network is established through the dissolving of the template foil and removal of the dissolved template material. The interconnecting of the nanowires provides stability to the nanowire structural element and an electrical connection between the nanowires is created thereby.
摘要翻译： 本发明涉及适用于微反应器系统或微型催化剂系统的纳米线结构元件。 使用基于模板的工艺来生产纳米线结构元件，其中纳米线被电化学沉积在纳米孔中。 以不同的角度进行照射，形成纳米线网络。 通过模板箔的溶解和去除溶解的模板材料来建立纳米线网络中的中空室状结构。 纳米线的互连提供了对纳米线结构元件的稳定性，并且由此形成纳米线之间的电连接。
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公开(公告)号：US08685348B2
公开(公告)日：2014-04-01
申请号：US12933254
申请日：2009-03-12
IPC分类号： B01J8/00
CPC分类号： C25D1/006 , B01J19/0093 , B01J23/42 , B01J23/72 , B01J35/0006 , B01J2219/00783 , B01J2219/00835 , B01J2219/00846 , B01J2219/00853 , B01J2219/0086 , B01J2219/00873 , B22F1/0025 , B22F3/002 , B81B2201/0292 , B81B2201/051 , B81C99/0085 , B82Y15/00 , B82Y30/00 , B82Y40/00 , C25D1/00 , C25D1/003 , C25D1/04 , C25D1/08 , C25D5/18 , G01F1/688 , G01N25/00 , Y10S977/762 , Y10T29/49117 , Y10T428/12201 , Y10T428/12389 , Y10T428/24562 , Y10T428/24893 , Y10T428/25
摘要： The invention concerns a nanowire structural element which is suited for implementation in, for example, a microreactor system or microcatalyzer system. For the production of the nanowire structural element, a template based process is used wherein the electrochemical deposition of the nanowires in nanopores is ideally carried out at least until caps are formed and said caps ideally are at least partially merged together. After reinforcing the two cover layers the structured hollow chamber between the two cover layers is cleared by dissolving the template foil and removing the dissolved template material, wherein the two cover layers remain intact. In this manner, a stable sandwich-like nanostructure is constructed with a two-dimensional hollow chamber-like structure in the plane parallel to the cover layers contained on both sides by the cover layers and permeated in a column-like manner with nanowires.
摘要翻译： 本发明涉及一种纳米线结构元件，其适用于例如微反应器系统或微型催化剂系统。 为了生产纳米线结构元件，使用基于模板的方法，其中纳米线中的纳米线的电化学沉积理想地至少直到形成帽并且所述帽理想地至少部分地并入在一起。 在加强两个覆盖层之后，通过溶解模板箔并除去溶解的模板材料来清除两个覆盖层之间的结构化中空室，其中两个覆盖层保持完整。 以这种方式，在与覆盖层两侧包含的覆盖层平行的平面中，通过二维中空室状结构构造稳定的夹层状纳米结构，并以纳米线的柱状渗透。
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公开(公告)号：US08383063B2
公开(公告)日：2013-02-26
申请号：US13059370
申请日：2009-08-10
CPC分类号： B01L3/502707 , B01L2300/044 , B01L2300/0816 , B01L2300/0883 , B01L2300/0887 , B01L2300/12 , B29C65/02 , B29C65/06 , B29C65/0618 , B29C65/08 , B29C65/10 , B29C65/16 , B29C65/18 , B29C66/006 , B29C66/0344 , B29C66/1122 , B29C66/53461 , B29C66/71 , B29C66/73366 , B29C66/9141 , B29C66/91421 , B29C66/91431 , B29C66/91645 , B29C66/919 , B29C66/91941 , B29C66/929 , B29C66/949 , B29C2071/022 , B29K2023/06 , B29K2023/12 , B29K2025/00 , B29K2027/06 , B29K2027/08 , B29K2031/04 , B29K2033/12 , B29K2033/20 , B29K2067/00 , B29K2069/00 , B29K2077/00 , B29K2083/00 , B29K2101/12 , B29K2995/0018 , B29K2995/0035 , B29L2031/756 , B81B2201/051 , B81B2203/0338 , B81C1/00071 , B81C1/00119 , B81C2201/019 , B81C2203/032 , G01N27/44791 , Y10T156/10 , B29K2067/003 , B29K2025/06 , B29K2023/38
摘要： A microchip 1 in which a resinous film can be inhibited from sagging into a channel. The microchip 1 comprises: a resinous substrate 2 having a channel groove formed therein; and a resinous film bonded to a surface of the substrate on which the channel groove has been formed. A micro-channel 3 including channels 3A and channels 3B is formed by the channel groove and the resinous film 10. The total length of the channels 3B, which is parallel to the X direction for the resinous substrate 2, is larger than the total length of the channels 3A, which is parallel to the Y direction for the resinous substrate 2. The resinous substrate 2 has been bonded to the resinous film so that the sides parallel to the channels 3B are parallel to the TD direction of the resinous film and that the sides parallel to the channels 3A are parallel to the MD direction of the resinous film.
摘要翻译： 可以抑制树脂膜下垂到通道中的微芯片1。 微芯片1包括：在其中形成有沟槽的树脂基板2; 以及与已经形成有沟槽的基板的表面结合的树脂膜。 包括通道3A和通道3B的微通道3由通道槽和树脂膜10形成。与树脂基板2的X方向平行的通道3B的总长度大于总长度 与树脂基板2的Y方向平行的通道3A的树脂基板2已经结合到树脂膜上，使得平行于通道3B的边平行于树脂膜的TD方向，并且 平行于通道3A的边平行于树脂膜的MD方向。
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公开(公告)号：US08105551B2
公开(公告)日：2012-01-31
申请号：US12417716
申请日：2009-04-03
申请人： Jongmyeon Park , Jeonggun Lee
发明人： Jongmyeon Park , Jeonggun Lee
CPC分类号： B81C3/001 , B01L3/502707 , B01L3/502738 , B01L2200/0689 , B01L2300/0803 , B01L2300/0816 , B01L2300/0887 , B01L2400/0677 , B29C65/14 , B29C65/1406 , B29C65/483 , B29C65/4845 , B29C65/52 , B29C65/526 , B29C66/112 , B29C66/114 , B29C66/1142 , B29C66/242 , B29C66/244 , B29C66/342 , B29C66/53461 , B29C66/54 , B29C66/71 , B29C2035/0827 , B29L2031/756 , B81B2201/051 , B81C2201/019 , B81C2203/032 , Y10T137/206 , Y10T137/2164 , Y10T137/2169 , B29K2033/08 , B29K2033/12 , B29K2083/00
摘要： A microfluidic device and a method of fabricating the microfluidic device are provided. The microfluidic device includes: a platform including an upper substrate and a lower substrate that are bonded to face each other; a microfluidic structure obtained by forming grooves in the lower substrate; a lower substrate protrusion pattern including an outline protrusion that protrudes from the lower substrate toward the upper substrate along an outline of the microfluidic structure; and an adhesive layer disposed between the lower substrate protrusion pattern and the upper substrate in order to bond the upper substrate and the lower substrate to each other. The lower substrate protrusion pattern only supports the upper substrate, and remaining portions of the lower substrate except for the lower substrate protrusion pattern do not have structures for supporting the upper substrate.
摘要翻译： 提供微流体装置和制造微流体装置的方法。 微流体装置包括：平台，包括被粘合以面对的上基板和下基板; 通过在下基板中形成凹槽获得的微流体结构; 下基板突起图案，其包括沿着所述微流体结构的轮廓从所述下基板朝向所述上基板突出的轮廓突起; 以及设置在下基板突起图案和上基板之间的粘合层，以将上基板和下基板彼此粘合。 下基板突起图案仅支撑上基板，除了下基板突起图案之外，下基板的剩余部分不具有用于支撑上基板的结构。
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公开(公告)号：US08057988B2
公开(公告)日：2011-11-15
申请号：US12779819
申请日：2010-05-13
申请人： Jeffrey D. Morse , David A. Sopchak , Ravindra S. Upadhye , John G. Reynolds , Joseph H. Satcher , Alex E. Gash
发明人： Jeffrey D. Morse , David A. Sopchak , Ravindra S. Upadhye , John G. Reynolds , Joseph H. Satcher , Alex E. Gash
IPC分类号： G03F7/20
CPC分类号： H01M8/0618 , B01J19/0093 , B01J21/185 , B01J23/755 , B01J23/80 , B01J37/0203 , B01J37/0215 , B01J37/0242 , B01J37/036 , B01J2219/00783 , B01J2219/00822 , B01J2219/00824 , B01J2219/00828 , B01J2219/00831 , B01J2219/00835 , B01J2219/00873 , B81B3/0094 , B81B2201/051 , B81B2203/0338 , B81C2201/0197 , B82Y30/00 , C01B3/326 , C01B3/583 , C01B2203/0233 , C01B2203/044 , C01B2203/047 , C01B2203/1005 , H01M4/8825 , H01M4/9016 , H01M4/96 , H01M8/0204 , H01M8/0215 , H01M8/0228 , H01M8/0247 , H01M8/0625 , H01M8/0631 , H01M2250/30 , Y02B90/18 , Y02P20/52
摘要： A microreactor comprising a silicon wafer, a multiplicity of microchannels in the silicon wafer, and a catalyst coating the microchannels. In one embodiment the catalyst coating the microchannels comprises a nanostructured material. In another embodiment the catalyst coating the microchannels comprises an aerogel. In another embodiment the catalyst coating the microchannels comprises a solgel. In another embodiment the catalyst coating the microchannels comprises carbon nanotubes.
摘要翻译： 一种微反应器，包括硅晶片，硅晶片中的多个微通道和涂覆微通道的催化剂。 在一个实施方案中，涂覆微通道的催化剂包括纳米结构材料。 在另一个实施方案中，涂覆微通道的催化剂包含气凝胶。 在另一个实施方案中，涂覆微通道的催化剂包括溶胶凝胶。 在另一个实施方案中，涂覆微通道的催化剂包括碳纳米管。
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公开(公告)号：US08057743B2
公开(公告)日：2011-11-15
申请号：US12664621
申请日：2008-06-13
申请人： Kiyoshi Nokihara , Yasuo Oka
发明人： Kiyoshi Nokihara , Yasuo Oka
CPC分类号： B01J19/0093 , B01J2219/00783 , B01J2219/00819 , B01J2219/00831 , B01J2219/0086 , B01J2219/00873 , B01L3/502707 , B01L2200/0689 , B01L2300/0883 , B01L2300/12 , B81B2201/051 , B81B2201/058 , B81B2203/0307 , B81C3/001 , B81C2203/0109 , B81C2203/032
摘要： Means for overcoming the problems which the conventional glass microchannel chips have are disclosed. That is, a microchannel chip in which microchannels can be formed at a low cost, and which has a high chemical resistance is disclosed. The microchannel chip is constituted by a substrate made of carbon, which has a channel in its surface; and a cover composed of a glass plate bonded to the substrate. The cover is bonded to the substrate by heating at least a part of the contact surface at which the substrate is in contact with the cover.
摘要翻译： 公开了克服传统玻璃微通道芯片所存在的问题的手段。 也就是说，公开了一种微通道芯片，其中可以以低成本形成微通道，并且具有高耐化学性。 微通道芯片由碳表面构成，其表面具有通道; 以及由与基板结合的玻璃板构成的盖。 通过加热基板与盖接触的接触表面的至少一部分，将盖结合到基板。
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