公开(公告)号：US11564312B2

公开(公告)日：2023-01-24

申请号：US17034867

申请日：2020-09-28

Applicant: Google LLC

Inventor： Lieven Verslegers ,  Hong Liu ,  Kevin Yasumura ,  Jill Berger ,  Ryohei Urata

IPC: H05K1/02 ,  G02B6/12 ,  G02B6/42

Abstract: The present disclosure provides for an example integrated optics assembly. The integrated optics assembly may include an optics mount, a substrate including a heat sink, and a photonic integrated circuit (“PIC”). The optics mount may be adapted to support a light source on a first end of the optics mount. The first end of the optics mount may be coupled to a region of the substrate including the heat sink. The heat sink may remove or dissipate the heat produced by the light source. A second end of the optics mount may be coupled to the PIC such that the optics mount extends between the substrate and the PIC. This may decrease the amount of space the optics mount takes up on the PIC thereby allowing the overall size of the PIC to be decreased. Decreasing the size of the PIC may allow for more PICS per wafer.

公开(公告)号：US20220139876A1

公开(公告)日：2022-05-05

申请号：US17579012

申请日：2022-01-19

Applicant: Google LLC

Inventor： Woon-Seong Kwon ,  Namhoon Kim ,  Teckgyu Kang ,  Ryohei Urata

IPC: H01L25/065 ,  G02B6/42 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H01L25/16

Abstract: The technology relates to an integrated circuit (IC) package. The IC package may include a substrate. An IC die may be mounted to the substrate. One or more photonic modules may be attached to the substrate and one or more serializer/deserializer (SerDes) interfaces may connect the IC die to the one or more photonic modules. The IC die may be an application specific integrated circuit (ASIC) die and the one or more photonic modules may include a photonic integrated circuit (PIC) and fiber array. The one or more photonic modules may be mounted to one or more additional substrates which may be attached to the substrate via one or more sockets.

公开(公告)号：US10812196B2

公开(公告)日：2020-10-20

申请号：US16358200

申请日：2019-03-19

Applicant: Google LLC

Inventor： Xiang Zhou ,  Lieven Verslegers ,  Hong Liu ,  Ryohei Urata

IPC: H04L25/03 ,  H04B10/516

Abstract: Systems and methods of transmitting direct detection optical signal are provided. A direct detection optical transmitter according to illustrative embodiments includes a Mach Zehnder Modulator (MZM) configured to modulate laser light based on an electrical drive signal to generate a modulated optical signal and a complementary-modulated optical signal. The optical transmitter includes an optical finite impulse response (FIR) filter configured to receive the complementary-modulated optical signal and generate a filtered optical signal. The optical transmitter includes a polarization rotator configured to receive the filtered optical signal and output a rotated optical signal. The optical transmitter includes an optical combiner configured to combine the modulated optical signal and the rotated optical signal. The optical transmitter includes an output port configured to output the combined optical signal.

公开(公告)号：US20200241222A1

公开(公告)日：2020-07-30

申请号：US16261211

申请日：2019-01-29

Applicant: Google LLC

Inventor： Daoyi Wang ,  Lieven Verslegers ,  Ryohei Urata

IPC: G02B6/42

Abstract: A photonic integrated circuit for coupling a laser from an optical assembly to a grating coupler is disclosed. A method for coupling a laser to a photonic integrated circuit is disclosed. The optical assembly includes an optical system disposed on a v-groove bench. The optical system typically includes a laser source, a coupling lens or lens system, an optional isolator, a beam redirector that includes a prism or other light turning element and a cylindrical tube mounted on the v-groove bench. The method of tuning the angle of incidence from the optical assembly to the grating coupler is also disclosed.

公开(公告)号：US12169304B2

公开(公告)日：2024-12-17

申请号：US18203328

申请日：2023-05-30

Applicant: Google LLC

Inventor： Liming Wang ,  Ryohei Urata ,  Jan Petykiewicz ,  Jill Berger

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/124 ,  G02B6/13 ,  H01L23/00

Abstract: A photonic integrated circuit chip includes a substrate and a wafer on the substrate. The wafer itself includes a photonic grating coupler with a taper portion and grating features. The grating features extend from the taper portion toward the substrate.

公开(公告)号：US11689292B2

公开(公告)日：2023-06-27

申请号：US17228122

申请日：2021-04-12

Applicant: Google LLC

Inventor： Xiang Zhou ,  Cedric F. Lam ,  Ryohei Urata ,  Hong Liu

IPC: H04B10/60 ,  H04B10/532 ,  H04B10/548 ,  H04B10/61 ,  H04B10/40 ,  H04J14/06

CPC classification number: H04B10/532 ,  H04B10/548 ,  H04B10/40 ,  H04B10/60 ,  H04B10/61 ,  H04B10/614 ,  H04J14/06

Abstract: Coherent optical communications technology for recovery of 1D and 2D formatted optical signals. For example, 1D or 2D formatted signals that travel through fiber optic media may be recovered by separating the light into X- and Y-polarization components, rotating one polarization component (e.g., Y-component) into the polarization space of the other component (e.g., Y-component into the X-polarization space), delaying the rotated component enough to avoid destructive interference and combining the delayed component with the undelayed component to form a folded optical signal, which may then be processed as a X-polarized signal.

公开(公告)号：US20220413234A1

公开(公告)日：2022-12-29

申请号：US17358314

申请日：2021-06-25

Applicant: Google LLC

Inventor： Daoyi Wang ,  Ryohei Urata ,  Lieven Verslegers ,  Jan Petykiewicz

IPC: G02B6/42 ,  G02B6/30 ,  G02B6/12

Abstract: A system for passive alignment of fibers to an interface of a photonic integrated circuit (PIC) includes an input frame, an actuator, and an output frame. The actuator arranged to apply force along a force axis to the input frame. The output frame including a tip for picking up a plate and transferring the force thereto, the output frame being connected to the input frame such that the output frame may tilt relative to the input frame and the output frame is elastically biased relative to the input frame into a position wherein the tip is aligned on the force axis.

公开(公告)号：US20220104342A1

公开(公告)日：2022-03-31

申请号：US17034867

申请日：2020-09-28

Applicant: Google LLC

Inventor： Lieven Verslegers ,  Hong Liu ,  Kevin Yasumura ,  Jill Berger ,  Ryohei Urata

IPC: H05K1/02

Abstract: The present disclosure provides for an example integrated optics assembly. The integrated optics assembly may include an optics mount, a substrate including a heat sink, and a photonic integrated circuit (“PIC”). The optics mount may be adapted to support a light source on a first end of the optics mount. The first end of the optics mount may be coupled to a region of the substrate including the heat sink. The heat sink may remove or dissipate the heat produced by the light source. A second end of the optics mount may be coupled to the PIC such that the optics mount extends between the substrate and the PIC. This may decrease the amount of space the optics mount takes up on the PIC thereby allowing the overall size of the PIC to be decreased. Decreasing the size of the PIC may allow for more PICS per wafer.

公开(公告)号：US11264358B2

公开(公告)日：2022-03-01

申请号：US16567766

申请日：2019-09-11

Applicant: Google LLC

Inventor： Woon-Seong Kwon ,  Namhoon Kim ,  Teckgyu Kang ,  Ryohei Urata

IPC: H01L25/065 ,  G02B6/42 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H01L25/16 ,  H01L25/04 ,  H01L25/075 ,  H01L31/12

Abstract: The technology relates to an integrated circuit (IC) package. The IC package may include a substrate. An IC die may be mounted to the substrate. One or more photonic modules may be attached to the substrate and one or more serializer/deserializer (SerDes) interfaces may connect the IC die to the one or more photonic modules. The IC die may be an application specific integrated circuit (ASIC) die and the one or more photonic modules may include a photonic integrated circuit (PIC) and fiber array. The one or more photonic modules may be mounted to one or more additional substrates which may be attached to the substrate via one or more sockets.

公开(公告)号：US10775637B2

公开(公告)日：2020-09-15

申请号：US15975268

申请日：2018-05-09

Applicant: Google LLC

Inventor： Ryohei Urata ,  Lieven Verslegers ,  Hong Liu ,  Daoyi Wang

IPC: G02B27/28 ,  G02B27/09 ,  G02B6/126 ,  G02B6/10 ,  G02B6/27 ,  G02F1/09 ,  G02B5/30 ,  G02B6/42

Abstract: A photonic integrated circulator can be fabricated by including a plurality of polarizing beam splitters and optical polarization rotators such that two copies of the optical signal are output at a receiver in substantially aligned polarization states. The circulator can be used for facilitating bi-directional communications between photonic integrated circuit devices, which are inherently polarization sensitive, while reducing signal loss.