公开(公告)号：US20190381789A1

公开(公告)日：2019-12-19

申请号：US16552447

申请日：2019-08-27

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Peter James Fricke ,  Andrew L. Van Brocklin

IPC: B41J2/045 ,  B41J2/175 ,  B41J2/14

Abstract: A print head assembly (PHA) includes a microelectromechanical systems (MEMS) die mounted to a substrate with an application specific integrated circuit (ASIC). The die includes an opening defined in the die, a plurality of nozzles adjacent to the opening in fluid communication with the opening, and a pad to receive electrical control signals. The ASIC includes a communication link and a plurality of transmission lines that transmit electrical signals to the MEMS die.

公开(公告)号：US10300691B2

公开(公告)日：2019-05-28

申请号：US16024302

申请日：2018-06-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Peter James Fricke ,  Michael W. Cumbie ,  Scott A. Linn

IPC: B41J2/045

Abstract: A wide array printhead module includes a plurality of printhead die, each of the printhead die includes a number of nozzles. The nozzles form a number of primitives. A nozzle firing heater is coupled to each of the nozzles. An application specific integrated circuit (ASIC) controls a number of activation pluses that activate the nozzle firing heaters for each of the nozzles associated with the primitives. The activation pulses are delayed between each of the primitives via internal delays and external delays to reduce peak power demands of the printhead die. The ASIC determines the internal delays within each printhead die.

公开(公告)号：US20190152221A1

公开(公告)日：2019-05-23

申请号：US16240562

申请日：2019-01-04

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Peter James Fricke ,  Andrew L. Van Brocklin

IPC: B41J2/045 ,  B41J2/14 ,  B41J2/175

CPC classification number: B41J2/04541 ,  B41J2/04581 ,  B41J2/14072 ,  B41J2/14153 ,  B41J2/17546

Abstract: In some examples, a printing system comprises a plurality of microelectromechanical systems (MEMS) dies comprising printing fluid jets, a printhead assembly (PHA) application specific integrated circuit (ASIC), and a substrate comprising the plurality of MEMS dies and the PHA ASIC. The PHA ASIC is to process image data into a plurality of data signals that define a firing pattern, and transmit the data signals through transmission lines on the substrate to the plurality of MEMS dies. The printing fluid jets of the plurality of MEMS dies are to fire in response to the data signals.

公开(公告)号：US10046559B2

公开(公告)日：2018-08-14

申请号：US15893268

申请日：2018-02-09

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Daryl E. Anderson ,  Eric T. Martin ,  Peter James Fricke ,  James Michael Gardner

IPC: B41J2/14 ,  B41J2/045 ,  B41J2/165

CPC classification number: B41J2/0451 ,  B41J2/04541 ,  B41J2/0458 ,  B41J2/14153 ,  B41J2/16579 ,  B41J2/2142

Abstract: In some examples, a printhead die includes a nozzle to be fired by a fire pulse, and a sensor to measure, during a firing of the nozzle by the fire pulse, a measured signal comprising an impedance characteristic of a fluid sample of the nozzle, in response to an input signal applied to the fluid sample. A comparator is to compare the measured signal to a reference value, and a counter is to count over an evaluation interval in response to the comparing indicating that an evaluation criterion is satisfied, and the counter is to stop counting in response to the comparing indicating that the evaluation criterion is not satisfied, a count value of the counter providing an indicator of nozzle chamber operation corresponding to the measured signal.

公开(公告)号：US20170313059A1

公开(公告)日：2017-11-02

申请号：US15518306

申请日：2014-10-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Peter James Fricke ,  Michael W Cumbie ,  Scott A Linn

IPC: B41J2/045

CPC classification number: B41J2/04541 ,  B41J2/0452 ,  B41J2/04528 ,  B41J2/04543 ,  B41J2/04573 ,  B41J2/0458 ,  B41J2/04596 ,  B41J2/04598 ,  B41J2202/13 ,  B41J2202/21

Abstract: A wide array printhead module includes a plurality of printhead die, each of the printhead die includes a number of nozzles. The nozzles form a number of primitives. A nozzle firing heater is coupled to each of the nozzles. An application specific integrated circuit (ASIC) controls a number of activation pluses that activate the nozzle firing heaters for each of the nozzles associated with the primitives. The activation pulses are delayed between each of the primitives via internal delays and external delays to reduce peak power demands of the printhead die. The ASIC determines the internal delays within each printhead die.

公开(公告)号：US09776395B2

公开(公告)日：2017-10-03

申请号：US15306737

申请日：2014-04-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Daryl E Anderson ,  Eric T Martin ,  Peter James Fricke

IPC: B41J2/045 ,  B41J2/165 ,  B41J2/175

CPC classification number: B41J2/0451 ,  B41J2/04541 ,  B41J2/04555 ,  B41J2/04573 ,  B41J2/0458 ,  B41J2/04588 ,  B41J2/04598 ,  B41J2/165 ,  B41J2/16579 ,  B41J2/175

Abstract: In an example, a method for determining an issue in an inkjet nozzle includes providing an initial fire pulse for firing a nozzle, and receiving the initial fire pulse as a delayed fire pulse at a primitive of the nozzle. The method includes firing the nozzle with the delayed fire pulse, and determining a first time instant following the delayed fire pulse for taking a first impedance measurement across the nozzle.

公开(公告)号：US20150202871A1

公开(公告)日：2015-07-23

申请号：US14374774

申请日：2012-04-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Tony S. Cruz-Uribe ,  James E. Clark ,  Peter James Fricke

IPC: B41J2/14

CPC classification number: B41J2/14201 ,  B41J2/045 ,  B41J2/175 ,  B41J2/18 ,  B41J2002/14491

Abstract: A piezoelectric inkjet die stack includes a printhead substrate die, a pedestal seated on the printhead substrate die, a fluidics die seated atop the pedestal, and integrated circuit (IC) dies seated on the printhead substrate die. The IC dies may be positioned substantially but not completely beneath the fluidics die and positioned on either side of the pedestal such that air gaps exist between a top surface of each IC die and a bottom surface of the fluidics die and between each IC die and the pedestal. The pedestal may include ink flow channels to allow ink flow between the fluidics die and the printhead substrate. A plurality of stand-offs may be implemented to help support the fluidics die above the IC dies.

Abstract translation: 压电喷墨模具堆叠包括打印头基底模具，位于打印头基底模具上的基座，坐落在基座顶部的流体模具以及坐在打印头基底模具上的集成电路（IC）模具。 IC芯片可以基本上但不完全位于流体模具下方并且位于基座的任一侧上，使得在每个IC芯片的顶表面和流体模具的底表面之间以及每个IC芯片和 座。 基座可以包括油墨流动通道，以允许油墨在流体模头和打印头基底之间流动。 可以实现多个支架以帮助支撑IC芯片上方的流体模具。