公开(公告)号：US09971382B2

公开(公告)日：2018-05-15

申请号：US15201097

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Michael Ahrens ,  George H. Daskalakis ,  Steven J. Lofland ,  David Pidwerbecki ,  Bo Qiu ,  James C. Raupp ,  Stacy L. Yee

IPC: G06F1/16 ,  E05D3/02 ,  H05K5/02 ,  H04M1/02

CPC classification number: G06F1/1652 ,  E05D3/022 ,  E05Y2900/606 ,  G06F1/1616 ,  G06F1/1641 ,  G06F1/1681 ,  H04M1/0214 ,  H04M1/0247 ,  H04M1/0268 ,  H04M2250/16 ,  H05K5/0226

Abstract: Systems, methods and apparatuses may provide for a flexible display assembly including a flexible display and a backplane coupled to the flexible display, wherein at least a portion of the backplane comprises a super elastic sheet. In one example, the backplane includes a first rigid sheet metal portion and a second rigid sheet metal portion, wherein the super-elastic sheet is joined between the first and second rigid sheet metal portions.

公开(公告)号：US20180006485A1

公开(公告)日：2018-01-04

申请号：US15201418

申请日：2016-07-02

Applicant: Intel Corporation

Inventor： Jianfang Zhu ,  Bo Qiu ,  Bradley A. Jackson ,  Sayan Lahiri ,  James B. Kirkland, JR. ,  Ahmed Omer

IPC: H02J7/02 ,  H02J50/40 ,  H02J50/10

CPC classification number: H02J7/025 ,  H02J7/0042 ,  H02J7/0044 ,  H02J50/10 ,  H02J50/40

Abstract: In one example a docking mat for an electronic device comprises a substrate defining a first major surface on which the electronic device may be positioned, a power source coupling, a plurality of power grids embedded in the first major surface and electrically coupled to the power source coupling, wherein a portion of the power grids extend above the first major surface. Other examples may be described.