ELECTRONIC DEVICE
    31.
    发明申请

    公开(公告)号:US20220066610A1

    公开(公告)日:2022-03-03

    申请号:US17386546

    申请日:2021-07-28

    Abstract: The disclosure provides an electronic device including a substrate, a plurality of first electrodes, a plurality of second electrodes, a first wiring, and a second wiring. The substrate includes a plurality of touch areas and an optical component area. The first electrodes are disposed on a surface of the substrate and are located in the optical component area. The second electrodes are disposed on the surface of the substrate, and are located in the touch areas. The first wiring is disposed on the surface of the substrate, and is electrically connected to the first electrodes. The second wiring is disposed on the surface of the substrate, and is electrically connected to the second electrodes. At least one of the touch areas partially overlaps the optical component area.

    SEMICONDUCTOR DEVICE
    32.
    发明申请

    公开(公告)号:US20210134841A1

    公开(公告)日:2021-05-06

    申请号:US17073401

    申请日:2020-10-19

    Abstract: A semiconductor device including a substrate, a polysilicon semiconductor layer, and a conductive wire is provided. The polysilicon semiconductor layer is disposed on the substrate. The conductive wire is disposed on the substrate. The conductive wire contacts the polysilicon semiconductor layer through a contact portion. The polysilicon semiconductor layer and the contact portion of the conductive wire respectively have sides aligned with each other. The semiconductor device of the disclosure has good electrical connection, mitigated contact problems, improved reliability, reduced resistivity, increased driving capability, or improved display quality.

    ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

    公开(公告)号:US20250107237A1

    公开(公告)日:2025-03-27

    申请号:US18813003

    申请日:2024-08-22

    Abstract: An electronic device including a substrate, a circuit layer, a light filtering layer, an organic insulating layer and a transparent conductive layer is provided by the present disclosure. The circuit layer is disposed on the substrate. The light filtering layer is disposed on the circuit layer and has a first via. The organic insulating layer is disposed on the light filtering layer and has a second via, wherein the second via is corresponding to the first via. The transparent conductive layer is electrically connected to the circuit layer through the first via and the second via. The first via has a first sidewall, the second via has a second sidewall, the first sidewall and the second sidewall are not continuous, and a width of the first via is less than a width of the second via.

    METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

    公开(公告)号:US20250040246A1

    公开(公告)日:2025-01-30

    申请号:US18918068

    申请日:2024-10-17

    Abstract: The present disclosure provides an electronic device comprising a substrate, and an electrode. The substrate comprises a base, a first metal layer disposed on the base, a second metal layer disposed on the first metal layer and electrically connected to the first metal layer, and an insulating layer disposed on second metal layer. The electrode is disposed on the insulating layer. The substrate comprises a high-level region and a low-level region. The insulating layer comprises an opening in the low-level region to expose a part of the second metal layer. A part of the electrode is disposed in the high-level region and another part of the electrode is disposed in the low-level region.

    Electronic device
    35.
    发明授权

    公开(公告)号:US12148769B2

    公开(公告)日:2024-11-19

    申请号:US18302014

    申请日:2023-04-18

    Abstract: The disclosure provides an electronic device includes a substrate and a pattern layer. The substrate with a step structure includes a high-level surface and a low-level surface. The pattern layer includes a first unit pattern and a second unit pattern adjacent to and separated from the first unit pattern, wherein the first unit pattern overlaps a first part of the low-level surface and overlaps a first part of the high-level surface, and the second unit pattern overlaps a second part of the low-level surface and overlaps a second part of the high-level surface.

    ELECTRONIC DEVICE
    36.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20240363822A1

    公开(公告)日:2024-10-31

    申请号:US18764192

    申请日:2024-07-04

    CPC classification number: H01L33/62

    Abstract: An electronic device includes a substrate, a first conductive wire, a plurality of semiconductors, an insulation layer and a plurality of conductive elements. The first conductive wire is configured to transmit a first signal and disposed on the substrate, and the first conductive wire extends along a first direction. The semiconductors are disposed on the substrate and overlapped with the first conductive wire. The insulation layer is disposed on the substrate and has a plurality of holes. The conductive elements are disposed on the substrate and overlapped with the semiconductors respectively. In a top view of the electronic device, each one of the plurality of holes overlaps with at least one semiconductor, and a number of the holes is less than a number of the plurality of conductive elements.

    ELECTRONIC DEVICE
    37.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20240361641A1

    公开(公告)日:2024-10-31

    申请号:US18766695

    申请日:2024-07-09

    Abstract: An electronic device including a substrate, a gate line, two adjacent data lines, a semiconductor layer and a metal layer is provided. The gate line is disposed on the substrate and extends along a first direction. The two adjacent data lines are disposed on the substrate and intersects with the gate line. The semiconductor layer is disposed on the substrate and has a channel area. The metal layer is disposed between the substrate and the semiconductor layer, wherein the metal layer are overlapped with the two adjacent data lines. The metal layer has a section overlapped with the channel area, the section has a first width (WLS1) along a second direction perpendicular to the first direction, the gate line has a second width (WG) along the second direction, and the first width and the second width satisfy a relational expression below:





    W
    G



    W

    LS

    1




    10
    *


    W
    G

    .

    ELECTRONIC DEVICE
    38.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20240310682A1

    公开(公告)日:2024-09-19

    申请号:US18444735

    申请日:2024-02-18

    CPC classification number: G02F1/136209 G02F1/136286

    Abstract: An electronic device includes a substrate and a first light shielding layer disposed on the substrate. The first light shielding layer includes a first light shielding pattern extending along a direction and a second light shielding pattern adjacent to the first light shielding pattern and extending along the direction. In a cross-sectional view of the electronic device, a first opening is included between the first light shielding pattern and the second light shielding pattern, the first light shielding pattern has a first width, the first opening has a second width, and a ratio of the first width to the second width range from 0.5 to 2.

    Electronic device
    40.
    发明授权

    公开(公告)号:US12062747B2

    公开(公告)日:2024-08-13

    申请号:US18149162

    申请日:2023-01-03

    CPC classification number: H01L33/62

    Abstract: An electronic device includes a substrate, a first conductive wire, a plurality of semiconductors, an insulation layer and a plurality of conductive elements. The first conductive wire is disposed on the substrate and extends along a first direction. The semiconductors are disposed on the substrate and arranged along the first direction. The semiconductors are overlapped with the first conductive wire in a top view of the electronic device. The insulation layer is disposed between the first conductive wire and the semiconductors. The insulation layer includes a plurality of holes. The conductive elements are disposed on the substrate and overlapped with the semiconductors respectively in the top view of the electronic device. In the top view of the electronic device, each one of the holes overlaps with at least one semiconductor, and a number of the holes is less than a number of the conductive elements.

Patent Agency Ranking