公开(公告)号：US20080157208A1

公开(公告)日：2008-07-03

申请号：US11648098

申请日：2006-12-29

申请人： Kevin J. Fischer ,  Vinay B. Chikarmane ,  Brennan L. Peterson

发明人： Kevin J. Fischer ,  Vinay B. Chikarmane ,  Brennan L. Peterson

IPC分类号： H01L29/768 ,  H01L21/336

CPC分类号： H01L21/823807 ,  H01L21/28518 ,  H01L21/2855 ,  H01L21/76843 ,  H01L21/76895 ,  H01L21/823814 ,  H01L21/823871 ,  H01L23/485 ,  H01L23/53238 ,  H01L29/165 ,  H01L29/665 ,  H01L29/66628 ,  H01L29/66636 ,  H01L29/7833 ,  H01L29/7843 ,  H01L29/7845 ,  H01L29/7848 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for forming a slot contact structure for transistor performance enhancement. A contact opening is formed to expose a contact region, and a slot contact is disposed within the contact opening in order to induce a stress on an adjacent channel region. In an embodiment, a stress inducing barrier plug is disposed within a portion of the contact opening and the remainder of the contact opening is filled with a lower resistivity contact metal. By selecting the proper materials and deposition parameters, the slot contact can be tuned to induce a tensile or compressive stress on the adjacent channel region, thus being applicable for both p-type and n-type devices.

摘要翻译： 一种用于形成用于晶体管性能增强的槽接触结构的方法。 形成接触开口以暴露接触区域，并且在接触开口内设置槽接触件，以便在相邻通道区域上引起应力。 在一个实施例中，应力诱导阻挡塞设置在接触开口的一部分内，并且接触开口的其余部分填充有较低电阻率的接触金属。 通过选择适当的材料和沉积参数，可以调整槽接触以在相邻通道区域上引起拉伸或压缩应力，从而适用于p型和n型器件。

公开(公告)号：US20080014746A1

公开(公告)日：2008-01-17

申请号：US11486871

申请日：2006-07-14

申请人： Vinay B. Chikarmane ,  Kevin J. Fischer ,  Brennan L. Peterson

发明人： Vinay B. Chikarmane ,  Kevin J. Fischer ,  Brennan L. Peterson

IPC分类号： H01L21/44

CPC分类号： H01L21/7684 ,  H01L21/02074 ,  H01L21/32115 ,  H01L21/3212 ,  H01L21/32136

摘要： Copper interconnects may be made using the damascene process with reduced copper corrosion. Copper corrosion may be reduced by planarizing through excess copper down to, but not completely through, a copper diffusion barrier layer. The copper diffusion barrier layer may be removed using a different technique. Thereafter, suitable chemicals may be utilized to clean the structure.

摘要翻译： 铜互连可以使用具有减少的铜腐蚀的镶嵌工艺来制造。 通过使铜过度扩散到铜扩散阻挡层而不是完全通过多余的铜进行平坦化，可以减少铜腐蚀。 可以使用不同的技术去除铜扩散阻挡层。 此后，可以使用合适的化学品来清洁结构。

公开(公告)号：US06607305B2

公开(公告)日：2003-08-19

申请号：US09873935

申请日：2001-06-04

申请人： Kevin J. Fischer ,  Henry Guckel ,  Yogesh B. Gianchandani

发明人： Kevin J. Fischer ,  Henry Guckel ,  Yogesh B. Gianchandani

IPC分类号： G02B638

CPC分类号： G02B6/358 ,  G02B6/3502 ,  G02B6/355 ,  G02B6/3572 ,  G02B6/3584 ,  H02N1/006

摘要： A micromechanical actuator includes a plunger, having two magnet heads spaced from each other and joined to move together, that is supported for linear movement on a substrate. A magnetic core is supported on the substrate and has gaps in the core adjacent to the heads of the plunger. At least one permanent magnet is mounted to the plunger to move with it and forms, with the core, first and second magnetic circuits for flux which pass through the first and second heads of the plunger. A coil is coupled to the magnetic core to provide flux to the core. When the coil is supplied with DC current in one direction, the flux from the coil opposes the flux from the permanent magnet in one of the gaps and augments the flux in the other gap, causing the plunger to move in the direction of the gap having the augmented flux. After the plunger has switched positions, the electrical current in the coil is turned off, leaving the plunger latched in its switched position due to the flux from the permanent magnet. Switching to the opposite position of the plunger is carried out by supplying current to the coil in the reverse direction, drawing the plunger to its opposite position.