公开(公告)号：US4604496A

公开(公告)日：1986-08-05

申请号：US640582

申请日：1984-08-14

申请人： Shosaku Ishihara ,  Takashi Kuroki ,  Gyozo Toda ,  Akio Yasukawa ,  Tatsuji Sakamoto

发明人： Shosaku Ishihara ,  Takashi Kuroki ,  Gyozo Toda ,  Akio Yasukawa ,  Tatsuji Sakamoto

IPC分类号： H05K3/46 ,  H05K1/03 ,  H05K1/09 ,  H05K3/40 ,  H05K3/42 ,  H05K1/02

CPC分类号： H05K3/42 ,  H05K3/4061 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/0191 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K3/4611 ,  H05K3/4629

摘要： A ceramic multilayer wiring board is provided in which ceramic insulating layers and wiring patterns provided thereon are connected by conductors filling through-holes formed in the ceramic insulating layers. The through-holes are so formed that the superficial portions of each through-hole of the ceramic multilayer wiring board is smaller in diameter than the inside portion of the through-hole between the superficial portion. This can prevent the board from being cracked around the through-holes.

摘要翻译： 提供一种陶瓷多层布线板，其中设置在其上的陶瓷绝缘层和布线图案通过填充形成在陶瓷绝缘层中的通孔的导体连接。 通孔形成为使陶瓷多层布线基板的贯通孔的表面部的直径比表层部之间的贯通孔的内部的直径小。 这可以防止板在通孔周围破裂。