公开(公告)号：US12076971B2

公开(公告)日：2024-09-03

申请号：US17041884

申请日：2019-03-27

申请人： CORNING INCORPORATED

发明人： Jin Su Kim ,  Dean Michael Thelen

IPC分类号： B32B7/027 ,  B32B17/06 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C4/18 ,  C03C10/00 ,  C03C21/00 ,  H05K1/02 ,  H05K1/03

CPC分类号： B32B7/027 ,  B32B17/06 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C4/18 ,  C03C10/0009 ,  C03C10/0054 ,  H05K1/024 ,  H05K1/0306 ,  B32B2307/30 ,  B32B2307/732 ,  B32B2457/00 ,  C03C21/002 ,  C03C2204/00 ,  H05K2201/017 ,  H05K2201/0191 ,  H05K2201/068

摘要： A laminated glass structure for an electronic device includes: a core glass layer having a first coefficient of thermal expansion (CTE); and a plurality of clad glass layers, each having a CTE that is lower than or equal to the first CTE of the core glass layer. A first of the clad glass layers is laminated to a first surface of the core glass layer and a second of the clad layers is laminated to a second surface of the core glass layer. Further, the total thickness of the core glass layer and the clad glass layers ranges from about 0.1 mm to about 3 mm. In addition, each of the first of the clad layers and the core glass layer comprises a loss tangent of 0.006 or less for signals having a frequency of 1 GHz to about 100 GHz.

公开(公告)号：US20240268022A1

公开(公告)日：2024-08-08

申请号：US18289769

申请日：2022-08-23

申请人： NOF CORPORATION

发明人： Toshinobu FUJIMURA ,  Katsumi NAKASATO ,  Muneaki IIZUKA

IPC分类号： H05K1/05 ,  C23C16/40 ,  C23C16/448 ,  H01L21/48 ,  H01L23/373 ,  H05K1/02 ,  H05K3/44

CPC分类号： H05K1/053 ,  C23C16/403 ,  C23C16/4486 ,  H01L21/4846 ,  H01L23/3735 ,  H05K1/0209 ,  H05K3/44 ,  H05K2201/0179 ,  H05K2201/0191 ,  H05K2203/088

摘要： According to the present invention, a heat-dissipating circuit board is formed by providing a metal material adjacent to one surface of an insulating layer and providing a conductive metal layer to the other surface of the insulating layer. The metal material is a sheet of copper or a copper alloy or aluminum or an aluminum alloy and is 0.2-20 mm thick. The insulating layer is a metal oxide layer that has the composition AlxOyTz, is 0.2-30 μm thick, has a volume resistivity of at least 1000 GΩ·cm, and has a porosity of no more than 10%. The heat-dissipating circuit board has excellent heat-dissipation properties and insulation properties.

公开(公告)号：US20240023237A1

公开(公告)日：2024-01-18

申请号：US18253894

申请日：2021-10-26

申请人： NITTO DENKO CORPORATION

发明人： Rihito FUKUSHIMA ,  Shusaku SHIBATA ,  Teppei NIINO

IPC分类号： H05K1/02 ,  H05K1/18

CPC分类号： H05K1/0281 ,  H05K1/189 ,  H05K2201/09727 ,  H05K2201/0191

摘要： A wiring circuit board includes a first insulating layer and a conductive pattern. The conductive pattern has a first terminal, and a wiring connected to the first terminal. The wiring has a first portion disposed away from the first terminal, and a second portion disposed between the first terminal and the first portion. The first portion of the wiring and the first terminal include a portion consisting of the first conductive layer and the second conductive layer. The second portion of the wiring consists of the first conductive layer.

公开(公告)号：US20230199954A1

公开(公告)日：2023-06-22

申请号：US18111738

申请日：2023-02-20

申请人： Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. ,  GARUDA TECHNOLOGY CO., LTD.

发明人： LIN-JIE GAO ,  YONG-CHAO WEI

IPC分类号： H05K1/11 ,  H05K3/00 ,  H05K1/05 ,  H05K3/34 ,  H05K3/42

CPC分类号： H05K1/114 ,  H05K3/0041 ,  H05K1/056 ,  H05K3/3452 ,  H05K3/421 ,  H05K2203/0415 ,  H05K2201/0191 ,  H05K2201/09036 ,  H05K2201/09509 ,  H05K2201/0358 ,  H05K2201/0195

摘要： A circuit board includes an inner circuit substrate and an outer circuit substrate electrically connected to the inner circuit substrate. The outer circuit substrate includes an outer dielectric layer and an outer circuit layer facing the inner circuit substrate embedded in the outer dielectric layer. A portion of the outer circuit layer facing away from the inner circuit substrate protruding from the outer dielectric layer. The circuit board can increase contact area between the outer circuit layer and the outer dielectric layer, improving adhesion between the outer circuit layer and the outer dielectric layer, and reducing a thickness of the outer circuit substrate, thereby reducing the overall thickness of the circuit board.

公开(公告)号：US20180310404A1

公开(公告)日：2018-10-25

申请号：US15765308

申请日：2016-09-12

申请人： LG INNOTEK CO., LTD.

发明人： Jun Young LIM ,  Woong Sik KIM ,  Hyung Kyu YOON

IPC分类号： H05K1/09 ,  H05K3/28 ,  H05K1/02 ,  H05K1/03

CPC分类号： H05K1/09 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/18 ,  H05K1/189 ,  H05K3/244 ,  H05K3/28 ,  H05K3/3452 ,  H05K2201/0154 ,  H05K2201/0191 ,  H05K2201/0338 ,  H05K2201/10136

摘要： An embodiment of the present invention relates to a flexible printed circuit board (FPCB), which is applied to various electronic display devices, and may provide the FPCB, including a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

公开(公告)号：US20180270949A1

公开(公告)日：2018-09-20

申请号：US15986553

申请日：2018-05-22

申请人： FUJITSU LIMITED

发明人： Taiga Fukumori

IPC分类号： H05K1/03 ,  H05K1/02 ,  H01P3/08

CPC分类号： H05K1/0366 ,  H01P3/08 ,  H01P3/082 ,  H01P3/085 ,  H05K1/02 ,  H05K1/0225 ,  H05K1/113 ,  H05K1/181 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/029 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/10378 ,  H05K2201/10734

摘要： A circuit board includes an insulation layer, a signal line formed over the insulation layer and extending in a direction X, and a conductor layer formed under the insulation layer. The insulation layer has periodic dielectric-constant distribution in a direction Y orthogonal to the direction X. The conductor layer includes a slit at a position corresponding to the signal line. The slit expands an electric field produced between the signal line and the conductor layer; causes less difference in dielectric constants of the insulation layer in the vicinity of the signal line (the difference is caused by the positional relationship between the signal line and the dielectric-constant distribution of the insulation layer); and reduces difference in signal transmission speeds caused by the positional relationship.

公开(公告)号：US10021780B2

公开(公告)日：2018-07-10

申请号：US15800680

申请日：2017-11-01

申请人： NITTO DENKO CORPORATION

发明人： Daisuke Yamauchi ,  Hiroyuki Tanabe

IPC分类号： H05K1/03 ,  H05K1/02 ,  H05K3/06 ,  H05K3/18

CPC分类号： H05K1/028 ,  G11B5/484 ,  H05K1/056 ,  H05K3/064 ,  H05K3/18 ,  H05K3/243 ,  H05K2201/0191 ,  H05K2201/0347 ,  H05K2201/09736 ,  H05K2203/0353

摘要： A wired circuit board includes an insulating layer and a conductive layer. The insulating layer continuously has a first insulating portion, a second insulating portion having a thickness smaller than that of the first insulating portion, and a third insulating portion disposed between the first insulating portion and the second insulating portion and having a thickness that gradually becomes smaller from the first insulating portion toward the second insulating portion. The conductive layer continuously has a first conductive portion disposed at one-side surface of the first insulating portion and a second conductive portion disposed at one-side surface of the second insulating portion and having a thickness smaller than that of the first conductive portion. The first conductive portion is disposed at one-side surface of the second insulating portion and the third insulating portion or is disposed at one-side surface of the first insulating portion and the third insulating portion.

公开(公告)号：US20170339784A1

公开(公告)日：2017-11-23

申请号：US15534897

申请日：2015-12-10

申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： Andreas Zluc ,  Gerald Weidinger ,  Mario Schober ,  Hannes Stahr ,  Timo Schwarz ,  Benjamin Gruber

IPC分类号： H05K1/02 ,  H01L21/48 ,  H01L23/14 ,  H01L23/00 ,  H05K3/46 ,  H05K3/00 ,  H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H01L23/538

CPC分类号： H05K1/0271 ,  H01L21/481 ,  H01L21/4857 ,  H01L21/568 ,  H01L23/145 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/2518 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/9222 ,  H01L2924/0002 ,  H01L2924/18162 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/185 ,  H05K1/189 ,  H05K3/0017 ,  H05K3/0097 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/068 ,  H05K2201/09136 ,  H01L2924/00

摘要： A circuit board is described which includes a layer composite with at least one dielectric layer which includes a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto, and which includes a layer thickness along a z-axis which is perpendicular with respect to the x-axis and to the y-axis; and at least one metallic layer which is attached to the dielectric layer in a planar manner. The layer composite along the z-axis is free from a symmetry plane which is oriented in parallel with respect to the xy-plane, and the dielectric layer includes a dielectric material which has an elastic modulus E in a range between 1 and 20 GPa and along the x-axis and along the y-axis a coefficient of thermal expansion in a range between 0 and 17 ppm/K. A method of manufacturing such a circuit board is also described. Further, a method of manufacturing a circuit board structure comprising two asymmetric circuit boards and a method of manufacturing two processed asymmetric circuit boards from a larger circuit board structure is described.

公开(公告)号：US20170339783A1

公开(公告)日：2017-11-23

申请号：US15534172

申请日：2015-12-10

申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： Hannes Stahr ,  Andreas Zluc ,  Timo Schwarz ,  Gerald Weidinger

IPC分类号： H05K1/02 ,  H01L21/48 ,  H01L23/14 ,  H01L23/00 ,  H05K3/46 ,  H05K3/00 ,  H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H01L23/538

CPC分类号： H05K1/0271 ,  H01L21/481 ,  H01L21/4857 ,  H01L21/568 ,  H01L23/145 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5387 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2924/0002 ,  H01L2924/18162 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/185 ,  H05K1/189 ,  H05K3/0017 ,  H05K3/0097 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/068 ,  H05K2201/09136 ,  H01L2924/00

摘要： A circuit board and a method of manufacturing a circuit board or two circuit boards are illustrated and described. The circuit board includes (a) a dielectric layer with a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto and a layer thickness along a z-direction which is perpendicular with respect to the x-axis and to the y-axis; (b) a metallic layer which is attached to the dielectric layer in a planar manner; and (c) a component which is embedded in the dielectric layer and/or in a dielectric core-layer of the circuit board. The dielectric layer includes a dielectric material which has (i) an elastic modulus E in a range between 1 and 20 GPa and (ii) a coefficient of thermal expansion in a range between 0 and 17 ppm/K along the x-axis and along the y-axis.

公开(公告)号：US09710663B2

公开(公告)日：2017-07-18

申请号：US14721539

申请日：2015-05-26

申请人： TransUnion Rental Screening Solutions, Inc.

发明人： Michael A. Britti ,  Robert D. Thornley ,  Joel R. Springer ,  Michael J. Mauseth ,  Michael J. Collins

IPC分类号： G06F21/62 ,  G06Q10/06 ,  G06Q10/10 ,  G06Q20/36 ,  G06Q40/02 ,  G06Q50/16 ,  G06Q50/20

CPC分类号： H01L23/49822 ,  G06F21/62 ,  G06Q10/06 ,  G06Q10/0635 ,  G06Q10/10 ,  G06Q10/1053 ,  G06Q20/3674 ,  G06Q40/02 ,  G06Q40/025 ,  G06Q50/16 ,  G06Q50/20 ,  H01L21/48 ,  H01L21/4857 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0271 ,  H05K3/4682 ,  H05K2201/0191 ,  H05K2201/0209

摘要： Systems and methods for screening applicants are disclosed herein. A method of screening applicants is performed by a screening server. The server begins by receiving a selection of screening services and an applicant profile that identifies an applicant. The screening continues by generating screening results specified by the selection of screening services based on the applicant profile. A property manager is then notified that the screening results are available for the applicant based upon the applicant profile. The screening results are then provided to the property manager based upon the applicant profile. Based on these screening results, the screener or property manager can make a decision about the applicant and communicate a decision action to the applicant.