公开(公告)号：US20090065144A1

公开(公告)日：2009-03-12

申请号：US12207139

申请日：2008-09-09

申请人： Masayuki Yamamoto ,  Saburo Miyamoto

发明人： Masayuki Yamamoto ,  Saburo Miyamoto

IPC分类号： B32B38/10

CPC分类号： B29C63/0013 ,  H01L21/67132 ,  Y10T156/1105 ,  Y10T156/1189 ,  Y10T156/1972 ,  Y10T156/1983

摘要： A surface height of a protective tape joined to a wafer mounted and held on a separation table is detected, an operation amount of approaching a joining member to the protective tape until a separation tape wound around the joining member contacts the protective tape based on detected information, the joining member is operation controlled to approach the protective tape based on the calculated operation amount, the joining member and the separation table are relatively moved along a direction of a surface of the protective tape in a state of maintaining the height of the joining member to join the separation tape to the protective tape, and the separation tape is separated from the surface of the wafer integrally with the protective tape.

摘要翻译： 检测接合到安装并保持在分离台上的晶片的保护带的表面高度，接合到保护带的接合构件的操作量，直到缠绕在接合构件上的分离带基于检测到的信息接触保护带 根据计算出的操作量，接合构件被操作控制到接近保护带，接合构件和分离台在保持接合构件的高度的状态下沿着保护带的表面的方向相对移动 将分离带连接到保护带上，并且分离带与保护带一体地与晶片的表面分离。

公开(公告)号：US07393757B2

公开(公告)日：2008-07-01

申请号：US10939429

申请日：2004-09-14

申请人： Saburo Miyamoto ,  Yukitoshi Hase

发明人： Saburo Miyamoto ,  Yukitoshi Hase

IPC分类号： H01L21/78

CPC分类号： B32B43/006 ,  B32B2457/14 ,  H01L21/67109 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834

摘要： A work is suction-held by an upper suction chuck stage from the surface side of a supporting member, is moved upward to a predetermined height, and is heated in a state where the thickness direction of a both-faced adhesive sheet is not restricted, and a dicing tape is cooled. After lapse of predetermined heating time, the work is separated from the both-faced adhesive sheet whose adhesive strength is weaken, and drops to a lower suction chuck stage.

摘要翻译： 工件由支撑构件的表面侧的上部吸力卡盘台抽吸，向上移动到预定高度，并且在两面粘合片的厚度方向不受限制的状态下被加热， 并且切割胶带被冷却。 在经过预定的加热时间之后，将工件与粘合强度减弱的双面粘合片分离，并且下降到较低的吸力卡盘台。

公开(公告)号：US07387951B2

公开(公告)日：2008-06-17

申请号：US11084133

申请日：2005-03-21

申请人： Masayuki Yamamoto ,  Saburo Miyamoto

发明人： Masayuki Yamamoto ,  Saburo Miyamoto

IPC分类号： H01L21/00

CPC分类号： H01L21/6836 ,  H01L21/67132 ,  H01L21/78 ,  H01L2221/68327

摘要： The invention relates to a semiconductor wafer dicing method of dicing a semiconductor wafer along parting lines into chips. The semiconductor wafer in which parting lines along which the semiconductor wafer is diced into chips are formed is held by an adhesive tape. By radially drawing the adhesive tape in a state where the chips in the semiconductor wafer are not parted from each other, the chips are parted from each other and clearances among the chips are extended.

摘要翻译： 本发明涉及一种将半导体晶片沿分型线切割成芯片的半导体晶片切割方法。 形成半导体晶片切成芯片的分型线的半导体晶片由胶带保持。 通过在半导体晶片中的芯片不彼此分离的状态下径向拉伸粘合带，芯片彼此分离，并且芯片之间的间隙延长。

公开(公告)号：US07384811B2

公开(公告)日：2008-06-10

申请号：US10938645

申请日：2004-09-13

申请人： Saburo Miyamoto ,  Yukitoshi Hase

发明人： Saburo Miyamoto ,  Yukitoshi Hase

IPC分类号： H01L21/00 ,  H01L21/46

CPC分类号： H01L21/67132

摘要： With respect to a work obtained by joining a semiconductor wafer and a supporting member to each other via a both-faced adhesive sheet having heating separability, the surface of the supporting member is suction-held at a suction stage and is heated, thereby making the adhesive strength of an adhesive layer almost disappear. A Bernoulli chuck is moved close from the back side of the semiconductor wafer to separate the semiconductor wafer in a non-contact manner and to suspension-hold the semiconductor wafer in a state where the semiconductor wafer floats in the air.

摘要翻译： 关于通过具有加热分离性的双面粘合片将半导体晶片和支撑构件彼此接合而获得的功，将支撑构件的表面吸引保持在抽吸阶段并被加热， 粘合剂层的粘合强度几乎消失。 伯努利卡盘从半导体晶片的背面靠近移动，以非接触的方式分离半导体晶片，并且在半导体晶片浮在空气中的状态下悬挂保持半导体晶片。

公开(公告)号：US06235144B1

公开(公告)日：2001-05-22

申请号：US09203263

申请日：1998-12-01

申请人： Masayuki Yamamoto ,  Makoto Namikawa ,  Eiji Toyoda ,  Shigeji Kuroda ,  Saburo Miyamoto ,  Takao Matsushita

发明人： Masayuki Yamamoto ,  Makoto Namikawa ,  Eiji Toyoda ,  Shigeji Kuroda ,  Saburo Miyamoto ,  Takao Matsushita

IPC分类号： B32B3500

CPC分类号： H01L21/67132 ,  B08B7/00 ,  B08B7/0028 ,  B08B7/0035 ,  B29C63/0013 ,  G03F7/42 ,  Y10T156/11 ,  Y10T156/1158 ,  Y10T156/1189

摘要： A resist removing apparatus for removing an unwanted resist pattern from a surface of wafer W by applying an adhesive tape to the surface of wafer W having the resist patterns formed thereon, and separating the adhesive tape from the surface of wafer W. The apparatus includes an adhesive removing mechanism 13 for treating the surface of wafer W after the adhesive tape is separated therefrom. The adhesive removing mechanism 13 may be effective when constructed to jet ozone to the surface of wafer W heated, to irradiate the surface of wafer W heated, with ultraviolet rays, or to jet ozone to the surface of wafer W heated and irradiate the surface with ultraviolet rays.

摘要翻译： 一种抗蚀剂去除装置，用于通过在其上形成有抗蚀剂图案的晶片W的表面上涂布粘合带，从晶片W的表面除去不需要的抗蚀剂图案，并将粘合带从晶片W的表面分离。该装置包括： 粘合剂去除机构13，用于在粘合带分离之后处理晶片W的表面。 当粘合剂去除机构13被构造成将臭氧喷射到被加热的晶片W的表面上，以紫外线照射加热的晶片W的表面，或者将臭氧喷射到加热并照射表面的晶片W的表面时， 紫外线。

公开(公告)号：US5759006A

公开(公告)日：1998-06-02

申请号：US658071

申请日：1996-06-04

申请人： Saburo Miyamoto ,  Minoru Ametani

发明人： Saburo Miyamoto ,  Minoru Ametani

IPC分类号： B65G49/07 ,  H01L21/673 ,  H01L21/677 ,  H01L21/68

CPC分类号： H01L21/67369 ,  H01L21/67386 ,  H01L21/67778 ,  Y10S414/136 ,  Y10S414/137

摘要： A transport container for transporting a plurality of semiconductor wafers as stacked therein. The container includes a box-shaped container body having four peripheral walls, and an upper lid for closing and opening an upper opening of the container body. The front wall of the container body is pivotable between an open position and a closed position. The upper lid and front wall are opened when the semiconductor wafers are loaded into or unloaded from the transport container. An apparatus is provided for loading and unloading the semiconductor wafers into/from the transport container. The apparatus includes a cassette table for supporting a cassette for storing the semiconductor wafers in multiple stages at predetermined intervals, a container table for supporting the transport container openable and closable for storing the semiconductor wafers stacked alternately with protective sheets of guard paper, and a robot arm substantially opposed to each of the cassette table and the container table for transporting the semiconductor wafers between the cassette and the transport container.

摘要翻译： 一种运输容器，用于将多个半导体晶片堆叠在其中。 该容器包括具有四个周壁的箱形容器主体和用于关闭和打开容器主体的上部开口的上盖。 容器主体的前壁可在打开位置和关闭位置之间枢转。 当半导体晶片被装载到运输容器中或从运输容器卸载时，上盖和前壁被打开。 提供了用于将半导体晶片装载到运输容器中或从运送容器卸载的装置。 该装置包括用于支撑用于以预定间隔多级存储半导体晶片的盒的盒台，用于支撑可开启和关闭的运输容器的容器台，用于存储与防护纸的保护片交替堆叠的半导体晶片和机器人 与所述盒式桌子和所述容器台中的每一个基本上相对，用于在所述盒和所述运送容器之间输送所述半导体晶片。