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公开(公告)号：US6099675A
公开(公告)日：2000-08-08
申请号：US203497
申请日：1998-12-01
申请人： Masayuki Yamamoto , Makoto Namikawa , Eiji Toyoda , Shigeji Kuroda , Saburo Miyamoto , Takao Matsushita
发明人： Masayuki Yamamoto , Makoto Namikawa , Eiji Toyoda , Shigeji Kuroda , Saburo Miyamoto , Takao Matsushita
CPC分类号： B29C63/0013 , Y10S156/922 , Y10T156/11
摘要： An adhesive tape is applied to an article covered with a resist pattern. The article with the adhesive tape applied thereto is rapidly cooled to form cracks in the resist pattern on the surface of the article to weaken the cohesion between the resist pattern and the surface of the article. After the cooling, the adhesive tape is separated from the article, whereby the resist pattern is removed with the adhesive tape from the surface of the article.
摘要翻译： 将粘合带施加到被抗蚀图案覆盖的物品上。 施加有胶粘带的制品被快速冷却以在制品的表面上的抗蚀剂图案中形成裂纹，以削弱抗蚀剂图案和制品的表面之间的内聚力。 冷却后，粘合带与制品分离，由此用胶带从制品的表面除去抗蚀剂图案。
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公开(公告)号：US06235144B1
公开(公告)日：2001-05-22
申请号：US09203263
申请日：1998-12-01
申请人： Masayuki Yamamoto , Makoto Namikawa , Eiji Toyoda , Shigeji Kuroda , Saburo Miyamoto , Takao Matsushita
发明人： Masayuki Yamamoto , Makoto Namikawa , Eiji Toyoda , Shigeji Kuroda , Saburo Miyamoto , Takao Matsushita
IPC分类号： B32B3500
CPC分类号： H01L21/67132 , B08B7/00 , B08B7/0028 , B08B7/0035 , B29C63/0013 , G03F7/42 , Y10T156/11 , Y10T156/1158 , Y10T156/1189
摘要： A resist removing apparatus for removing an unwanted resist pattern from a surface of wafer W by applying an adhesive tape to the surface of wafer W having the resist patterns formed thereon, and separating the adhesive tape from the surface of wafer W. The apparatus includes an adhesive removing mechanism 13 for treating the surface of wafer W after the adhesive tape is separated therefrom. The adhesive removing mechanism 13 may be effective when constructed to jet ozone to the surface of wafer W heated, to irradiate the surface of wafer W heated, with ultraviolet rays, or to jet ozone to the surface of wafer W heated and irradiate the surface with ultraviolet rays.
摘要翻译： 一种抗蚀剂去除装置，用于通过在其上形成有抗蚀剂图案的晶片W的表面上涂布粘合带，从晶片W的表面除去不需要的抗蚀剂图案，并将粘合带从晶片W的表面分离。该装置包括： 粘合剂去除机构13，用于在粘合带分离之后处理晶片W的表面。 当粘合剂去除机构13被构造成将臭氧喷射到被加热的晶片W的表面上，以紫外线照射加热的晶片W的表面，或者将臭氧喷射到加热并照射表面的晶片W的表面时， 紫外线。
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公开(公告)号：US07913735B2
公开(公告)日：2011-03-29
申请号：US12390661
申请日：2009-02-23
申请人： Masayuki Yamamoto , Saburo Miyamoto
发明人： Masayuki Yamamoto , Saburo Miyamoto
IPC分类号： B29C65/50
CPC分类号： H01L21/67132 , Y10T156/1168 , Y10T156/1195
摘要： An adhesive tape joining apparatus of this invention adopts an inverted “T”-shaped layout configured with a rectangular section that extends laterally when being viewed in a plane and a protrusion section that is coupled on a center of the rectangular section. An adhesive tape joining part is disposed in the protrusion section and joins an adhesive tape to a ring frame and a wafer. A transport mechanism is disposed in the rectangular section and transports the wafer, the ring frame, and the wafer held by the ring frame. An electronic substrate processing unit is disposed in at least one of two regions adjoining to the rectangular section with the protrusion section being interposed therebetween, and is coupled to the transport mechanism.
摘要翻译： 本发明的胶带接合装置采用倒置的“T”形布置，其配置有在平面中横向延伸的矩形截面，以及连接在矩形部分中心的突出部分。 粘合带接合部分设置在突出部分中，并将粘合带连接到环形框架和晶片。 传送机构设置在矩形部分中并传送由环形框架保持的晶片，环形框架和晶片。 电子基板处理单元设置在与矩形部分相邻的两个区域中的至少一个中，其中插入有突出部分，并且联接到输送机构。
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公开(公告)号：US20110048609A1
公开(公告)日：2011-03-03
申请号：US12848290
申请日：2010-08-02
CPC分类号： B65H35/0013 , B65H37/002 , B65H2301/460186 , Y10T156/108 , Y10T156/1084 , Y10T156/1085 , Y10T156/1195
摘要： A joint detector detects a joint in an adhesive tape supplied from a tape supply section, and a computing unit determines a suitable cutting position of the adhesive tape for removing the joint in accordance with the detected results. A controller controls each mechanism to operate so as to satisfy the determined results by the computing unit. Thereafter, the adhesive tape including the joint is cut and removed.
摘要翻译： 联合检测器检测从带供应部分提供的粘合带中的接头，并且计算单元根据检测结果确定用于移除接头的胶带的适当切割位置。 控制器控制每个机构进行操作以满足计算单元确定的结果。 此后，将包括接头的胶带切割并除去。
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公开(公告)号：US07849900B2
公开(公告)日：2010-12-14
申请号：US11358140
申请日：2006-02-22
IPC分类号： B29C65/18
CPC分类号： B29C63/0013 , H01L21/67132 , H01L2221/6839 , Y10T156/1105 , Y10T156/1168 , Y10T156/1179 , Y10T156/19 , Y10T156/1906 , Y10T156/1978
摘要： During relative and horizontal movement of a mount frame, in which a semiconductor wafer with a protective tape is supported on a ring frame through a supporting adhesive tape, and a joining member, a position of an end edge of the protective tape is detected in a non-contact manner. Based on the detection result, a joining member is stopped in the position of the end edge of the protective tape and is moved close to the semiconductor wafer to press and bring a separation tape against and into contact with an end of the protective tape. In this state, the mount frame and the joining member are relatively and horizontally moved to join the separation tape onto the protective tape. Then, the mount frame and the joining member are relatively and horizontally moved to separate the separation tape together with the protective tape from a surface of the semiconductor wafer.
摘要翻译： 在具有保护带的半导体晶片通过支撑胶带被支撑在环形框架上的安装框架的相对和水平移动以及接合构件中，在保护带的端部边缘的位置被检测到 非接触式 基于检测结果，接合构件停止在保护带的端缘的位置，并且移动靠近半导体晶片，以将分离带抵靠并与保护带的端部接触。 在这种状态下，安装框架和接合构件被相对且水平地移动以将分离带连接到保护带上。 然后，安装框架和接合构件被相对且水平地移动，以将分离带与保护带一起从半导体晶片的表面分离。
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6.发明申请Adhesive tape cutting method and adhesive tape joining apparatus using the same 失效胶带切割方法和使用其的胶带接合装置公开(公告)号：US20080066869A1
公开(公告)日：2008-03-20
申请号：US11898831
申请日：2007-09-17
申请人： Masayuki Yamamoto , Saburo Miyamoto
发明人： Masayuki Yamamoto , Saburo Miyamoto
IPC分类号： B32B41/00
CPC分类号： B26F1/3846 , B26D3/085 , B26D5/00 , B26D5/02 , B26D5/32 , B26D5/34 , B26D7/018 , G01B11/06 , G01B21/16 , H01L21/67132 , Y10T83/0567 , Y10T83/175 , Y10T83/178 , Y10T83/2022 , Y10T83/2024 , Y10T83/4656 , Y10T83/4664 , Y10T83/515 , Y10T83/527 , Y10T83/533 , Y10T156/12 , Y10T156/1343
摘要： In a state that a reference plane of a cutter holder, to which a cutter blade is attached, is brought into contact with a surface of a base of a supporting adhesive tape, the cutter blade cuts the supporting adhesive tape while the reference plane of the cutter holder follows the surface of the base. Herein, a cutting edge of the cutter blade passes by a joining interface between the supporting adhesive tape and a ring frame without penetrating through an adhesive layer of the supporting adhesive tape.
摘要翻译： 在安装有切割刀片的刀架的参考平面与支撑胶带的基部的表面接触的状态下，刀片切割支撑胶带，同时， 刀架靠近基座的表面。 这里，切割刀片的切割刃通过支撑胶带和环形框架之间的接合界面而不穿透支撑胶带的粘合剂层。
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7.发明申请Method of dicing semiconductor wafer into chips, and apparatus using this method 失效将半导体晶片切割成芯片的方法，以及使用该方法的装置公开(公告)号：US20050215033A1
公开(公告)日：2005-09-29
申请号：US11084133
申请日：2005-03-21
申请人： Masayuki Yamamoto , Saburo Miyamoto
发明人： Masayuki Yamamoto , Saburo Miyamoto
IPC分类号： H01L21/301 , B28D5/00 , H01L21/00 , H01L21/304 , H01L21/46 , H01L21/68 , H01L21/78
CPC分类号： H01L21/6836 , H01L21/67132 , H01L21/78 , H01L2221/68327
摘要： The invention relates to a semiconductor wafer dicing method of dicing a semiconductor wafer along parting lines into chips. The semiconductor wafer in which parting lines along which the semiconductor wafer is diced into chips are formed is held by an adhesive tape. By radially drawing the adhesive tape in a state where the chips in the semiconductor wafer are not parted from each other, the chips are parted from each other and clearances among the chips are extended.
摘要翻译： 本发明涉及一种将半导体晶片沿分型线切割成芯片的半导体晶片切割方法。 形成半导体晶片切成芯片的分型线的半导体晶片由胶带保持。 通过在半导体晶片中的芯片不彼此分离的状态下径向拉伸粘合带，芯片彼此分离，并且芯片之间的间隙延长。
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公开(公告)号：US20110045234A1
公开(公告)日：2011-02-24
申请号：US12834450
申请日：2010-07-12
CPC分类号： B62D25/105 , Y10T156/1077 , Y10T428/24174
摘要： A joining roller rolls while pressing on a separator on a surface of a double-faced adhesive tape with through holes in rectangular shapes regularly formed therein in a longitudinal tape direction, and the double-faced adhesive tape is joined to a building panel. Thereafter, the separator is separated and the reinforcing member is joined to an adhesive layer of the double-faced adhesive tape while being pressed with the reinforcing member being kept parallel to the double-faced adhesive tape.
摘要翻译： 接合辊在将双面胶带的表面上的隔膜压在辊纵向上规则地形成有矩形形状的通孔的同时滚压，双面胶带与建筑面板接合。 此后，分离器被分离，并且加强构件在与加强构件保持平行于双面胶带的同时被按压而与双面胶带的粘合剂层接合。
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公开(公告)号：US20060219359A1
公开(公告)日：2006-10-05
申请号：US11358140
申请日：2006-02-22
CPC分类号： B29C63/0013 , H01L21/67132 , H01L2221/6839 , Y10T156/1105 , Y10T156/1168 , Y10T156/1179 , Y10T156/19 , Y10T156/1906 , Y10T156/1978
摘要： During relative and horizontal movement of a mount frame, in which a semiconductor wafer with a protective tape is supported on a ring frame through a supporting adhesive tape, and a joining member, a position of an end edge of the protective tape is detected in a non-contact manner. Based on the detection result, a joining member is stopped in the position of the end edge of the protective tape and is moved close to the semiconductor wafer to press and bring a separation tape against and into contact with an end of the protective tape. In this state, the mount frame and the joining member are relatively and horizontally moved to join the separation tape onto the protective tape. Then, the mount frame and the joining member are relatively and horizontally moved to separate the separation tape together with the protective tape from a surface of the semiconductor wafer.
摘要翻译： 在具有保护带的半导体晶片通过支撑胶带被支撑在环形框架上的安装框架的相对和水平移动以及接合构件中，在保护带的端部边缘的位置被检测到 非接触式 基于检测结果，接合构件停止在保护带的端缘的位置，并且移动靠近半导体晶片，以将分离带抵靠并与保护带的端部接触。 在这种状态下，安装框架和接合构件被相对且水平地移动以将分离带连接到保护带上。 然后，安装框架和接合构件被相对且水平地移动，以将分离带与保护带一起从半导体晶片的表面分离。
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公开(公告)号：US08349106B2
公开(公告)日：2013-01-08
申请号：US12848290
申请日：2010-08-02
IPC分类号： B32B41/00
CPC分类号： B65H35/0013 , B65H37/002 , B65H2301/460186 , Y10T156/108 , Y10T156/1084 , Y10T156/1085 , Y10T156/1195
摘要： A joint detector detects a joint in an adhesive tape supplied from a tape supply section, and a computing unit determines a suitable cutting position of the adhesive tape for removing the joint in accordance with the detected results. A controller controls each mechanism to operate so as to satisfy the determined results by the computing unit. Thereafter, the adhesive tape including the joint is cut and removed.
摘要翻译： 联合检测器检测从带供应部分提供的粘合带中的接头，并且计算单元根据检测结果确定用于移除接头的胶带的适当切割位置。 控制器控制每个机构进行操作以满足计算单元确定的结果。 此后，将包括接头的胶带切割并除去。
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