公开(公告)号：US12136597B2

公开(公告)日：2024-11-05

申请号：US17515864

申请日：2021-11-01

Applicant: MEDIATEK INC.

Inventor： Yi-Lin Tsai ,  Nai-Wei Liu ,  Wen-Sung Hsu

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L25/065

Abstract: A semiconductor package includes a first die structure, a first redistribution structure that is disposed on the first die structure, a second die structure that is disposed on the first redistribution structure, and a second redistribution structure that is disposed on the second die structure. The first die structure includes an interposer, and the interposer includes a semiconductor substrate and through-vias that penetrate through the semiconductor substrate. A first integrated circuit die is disposed in the semiconductor substrate of the interposer. The second die structure includes a second integrated circuit die that is encapsulated in an encapsulant and several conductive pillars that penetrate through the encapsulant. The first integrated circuit die is electrically connected to the second integrated circuit die through the first redistribution structure, the conductive pillars, and the second redistribution structure.

公开(公告)号：US11824020B2

公开(公告)日：2023-11-21

申请号：US18046218

申请日：2022-10-13

Applicant: MEDIATEK INC.

Inventor： Yen-Yao Chi ,  Nai-Wei Liu ,  Tzu-Hung Lin

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01Q1/22 ,  H01Q1/38

CPC classification number: H01L23/66 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/20 ,  H01Q1/2283 ,  H01Q1/38 ,  H01L2223/6672 ,  H01L2223/6677 ,  H01L2224/214

Abstract: An electronic device that has an antenna device that includes a conductive pattern layer comprising a first antenna element, the conductive pattern layer formed in an insulating substrate and adjacent to a first surface of the insulating substrate, and a second antenna element formed on a second surface of the insulating substrate opposite the first surface. The electronic device further has a semiconductor package that includes a redistribution layer (RDL) structure bonded and electrically connected to the conductive pattern layer, a first electronic component electrically connected to the RDL structure, and an encapsulating layer formed on the RDL structure and surrounding the first electronic component.

公开(公告)号：US20220392839A1

公开(公告)日：2022-12-08

申请号：US17886704

申请日：2022-08-12

Applicant: MediaTek Inc.

Inventor： Yen-Yao Chi ,  Nai-Wei Liu ,  Ta-Jen Yu ,  Tzu-Hung Lin ,  Wen-Sung Hsu

IPC: H01L23/528 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor package structure including a semiconductor die having a first surface, a second surface opposite the first surface, and a third surface adjoined between the first surface and the second surface. A first protective insulating layer covers the first and third surfaces of the semiconductor die. A redistribution layer (RDL) structure is electrically coupled to the semiconductor die and surrounded by the first protective insulating layer on the first surface of the semiconductor die. A first passivation layer covers the first protective insulating layer and the RDL structure. At least one conductive structure passes through the first passivation layer and is electrically coupled to the RDL structure. A method of forming the semiconductor package is also provided.

公开(公告)号：US20210273317A1

公开(公告)日：2021-09-02

申请号：US17321914

申请日：2021-05-17

Applicant: MediaTek Inc.

Inventor： Nai-Wei Liu ,  Yen-Yao Chi ,  Tzu-Hung Lin ,  Wen-Sung Hsu

IPC: H01Q1/22 ,  H01L23/31 ,  H01L23/538 ,  H01L23/66 ,  H01L23/00 ,  H01Q1/38 ,  H01Q9/16

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a semiconductor die surrounded by a first molding compound layer. A redistribution layer (RDL) structure is formed on a non-active surface of the semiconductor die and the first molding compound layer. A second molding compound layer is formed on the RDL structure. An insulating capping layer covers the second molding compound layer. An antenna is electrically coupled to the semiconductor die and includes a first antenna element formed in the RDL structure and a second antenna element formed between the second molding compound layer and the insulating capping layer.

公开(公告)号：US11043730B2

公开(公告)日：2021-06-22

申请号：US16387354

申请日：2019-04-17

Applicant: MediaTek Inc.

Inventor： Nai-Wei Liu ,  Yen-Yao Chi ,  Tzu-Hung Lin ,  Wen-Sung Hsu

IPC: H01Q1/22 ,  H01L23/31 ,  H01L23/538 ,  H01L23/66 ,  H01L23/00 ,  H01Q1/38 ,  H01Q9/16

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a semiconductor die surrounded by a first molding compound layer. A redistribution layer (RDL) structure is formed on a non-active surface of the semiconductor die and the first molding compound layer. A second molding compound layer is formed on the RDL structure. An insulating capping layer covers the second molding compound layer. An antenna is electrically coupled to the semiconductor die and includes a first antenna element formed in the RDL structure and a second antenna element formed between the second molding compound layer and the insulating capping layer.

公开(公告)号：US11024954B2

公开(公告)日：2021-06-01

申请号：US16399659

申请日：2019-04-30

Applicant: MediaTek Inc.

Inventor： Nai-Wei Liu ,  Yen-Yao Chi ,  Tzu-Hung Lin ,  Wen-Sung Hsu

IPC: H01Q1/38 ,  H01Q9/16 ,  H01L23/00 ,  H01L21/56 ,  H01L23/66

Abstract: A method of forming a semiconductor package structure includes providing a first wafer-level package structure having a die region surrounded by a scribe line region. The first wafer-level package structure includes a first encapsulating layer, a first redistribution layer (RDL) structure formed on the first encapsulating layer, a first antenna element formed in the first RDL structure and corresponding to the die region, and a semiconductor die in the first encapsulating layer and corresponding to the die region. A second wafer-level package structure is bonded onto the first RDL structure using a first adhesive layer. The second wafer-level package structure includes a second encapsulating layer attached to the first adhesive layer, and a second antenna element formed on the second encapsulating layer. The second antenna element and the first antenna element form a pitch antenna after the bonding of the second wafer-level package structure.