Cell bottom node reset in a memory array

    公开(公告)号:US11004492B2

    公开(公告)日:2021-05-11

    申请号:US16869510

    申请日:2020-05-07

    Abstract: Methods, systems, and devices for cell bottom node reset in a memory array are described. The memory array may include a plurality of ferroelectric memory cells having a cell bottom node and a cell plate opposite the cell bottom node. A zero voltage may be applied to a plurality of digit lines in the memory array. A plurality of word lines may be activated to electrically coupled the plurality of digit lines to cell bottom node of each of the ferroelectric memory cells. Accordingly, the cell bottom node of each of the ferroelectric memory cells may be reset to the zero voltage.

    Access schemes for access line faults in a memory device

    公开(公告)号:US10902935B2

    公开(公告)日:2021-01-26

    申请号:US16102489

    申请日:2018-08-13

    Abstract: Methods, systems, and devices related to access schemes for access line faults in a memory device are described. In one example, a method may include isolating a first word line of a section of a memory device from a voltage source (e.g., a deselection voltage source) during a first portion of a period when the first word line is deselected, and coupling the first word line with the voltage source during a second portion of the period when the first word line is deselected based on determining that an access operation is performed during the second portion of the period when the word line is deselected. In some examples, the method may include identifying that the first word line is associated with a fault, such as a short circuit fault with a digit line of the memory device.

    Power gate circuits for semiconductor devices

    公开(公告)号:US10804225B2

    公开(公告)日:2020-10-13

    申请号:US16532140

    申请日:2019-08-05

    Abstract: Apparatuses and methods for gate power to circuits of semiconductor devices are described. An example apparatus includes a substrate, a first wiring and a second wiring, and a plurality of transistors. The first wiring may be supplied with a power voltage, and the first wiring is formed over the substrate and is elongating in a first direction. The second wiring may be formed between the substrate and the first wiring, and vertically overlapping the first wiring with the second wiring elongating in the first direction. The plurality of transistors are vertically coupled between the first wiring and the second wiring.

    Cell bottom node reset in memory array

    公开(公告)号:US10685694B2

    公开(公告)日:2020-06-16

    申请号:US16387220

    申请日:2019-04-17

    Abstract: Methods, systems, and devices for cell bottom node reset in a memory array are described. The memory array may include a plurality of ferroelectric memory cells having a cell bottom node and a cell plate opposite the cell bottom node. A zero voltage may be applied to a plurality of digit lines in the memory array. A plurality of word lines may be activated to electrically coupled the plurality of digit lines to cell bottom node of each of the ferroelectric memory cells. Accordingly, the cell bottom node of each of the ferroelectric memory cells may be reset to the zero voltage.

    ACCESS SCHEMES FOR ACCESS LINE FAULTS IN A MEMORY DEVICE

    公开(公告)号:US20200051659A1

    公开(公告)日:2020-02-13

    申请号:US16102489

    申请日:2018-08-13

    Abstract: Methods, systems, and devices related to access schemes for access line faults in a memory device are described. In one example, a method may include isolating a first word line of a section of a memory device from a voltage source (e.g., a deselection voltage source) during a first portion of a period when the first word line is deselected, and coupling the first word line with the voltage source during a second portion of the period when the first word line is deselected based on determining that an access operation is performed during the second portion of the period when the word line is deselected. In some examples, the method may include identifying that the first word line is associated with a fault, such as a short circuit fault with a digit line of the memory device.

    POWER GATE CIRCUITS FOR SEMICONDUCTOR DEVICES

    公开(公告)号:US20190355677A1

    公开(公告)日:2019-11-21

    申请号:US16532140

    申请日:2019-08-05

    Abstract: Apparatuses and methods for gate power to circuits of semiconductor devices are described. An example apparatus includes a substrate, a first wiring and a second wiring, and a plurality of transistors. The first wiring may be supplied with a power voltage, and the first wiring is formed over the substrate and is elongating in a first direction. The second wiring may be formed between the substrate and the first wiring, and vertically overlapping the first wiring with the second wiring elongating in the first direction. The plurality of transistors are vertically coupled between the first wiring and the second wiring.

    CELL BOTTOM NODE RESET IN A MEMORY ARRAY
    39.
    发明申请

    公开(公告)号:US20190051343A1

    公开(公告)日:2019-02-14

    申请号:US16054785

    申请日:2018-08-03

    Abstract: Methods, systems, and devices for cell bottom node reset in a memory array are described. The memory array may include a plurality of ferroelectric memory cells having a cell bottom node and a cell plate opposite the cell bottom node. A zero voltage may be applied to a plurality of digit lines in the memory array. A plurality of word lines may be activated to electrically coupled the plurality of digit lines to cell bottom node of each of the ferroelectric memory cells. Accordingly, the cell bottom node of each of the ferroelectric memory cells may be reset to the zero voltage.

    Grouping power supplies for a sleep mode

    公开(公告)号:US12298838B2

    公开(公告)日:2025-05-13

    申请号:US17960718

    申请日:2022-10-05

    Abstract: Methods, systems, and devices for grouping power supplies for a power saving mode are described to configure a memory device with groups of internal power supplies whose voltage levels may be successively modified according to a group order signaled by an on-die timer. For example, when the memory device enters a deep sleep mode, respective voltage levels of a first group of internal power supplies may be modified to respective external power supply voltage levels at a first time, respective voltage levels of a second group of internal power supplies may be modified to respective external power supply voltage levels at a second time, and so on. When the memory device exits the deep sleep mode, the groups of internal voltage supplies may be modified from the respective external power supply voltage levels to respective operational voltage levels in a group order that is opposite to the entry group order.

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