公开(公告)号：US20210408354A1

公开(公告)日：2021-12-30

申请号：US17357094

申请日：2021-06-24

Applicant: NEC Corporation

Inventor： Katsumi KIKUCHI ,  Akira MIYATA ,  Suguru WATANABE ,  Takanori NISHI ,  Hideyuki SATOU ,  Kenji NANBA ,  Ayami YAMAGUCHI

IPC: H01L39/04

Abstract: To provide a quantum device capable of preventing a connection member connecting a quantum chip with an interposer from being broken. The quantum device 1 includes at least one quantum chip 10, at least one interposer 20 on which the at least one quantum chip 10 is mounted, and a plurality of connection members 30 formed of a conductor. The plurality of connection members 30 are disposed between the quantum chip 10 and the interposer 20, and connect the quantum chip 10 with the interposer 20. The size of the connection member 30 on the surface along the mounting surface 20s of the interposer 20 is changed according to the position thereof relative to the quantum chip 10.

公开(公告)号：US20210399197A1

公开(公告)日：2021-12-23

申请号：US17347820

申请日：2021-06-15

Applicant: NEC Corporation

Inventor： Katsumi KIKUCHI ,  Akira MIYATA ,  Suguru WATANABE ,  Takanori NISHI ,  Hideyuki SATOU ,  Kenji NANBA ,  Ayami YAMAGUCHI

IPC: H01L39/22 ,  H01L39/02 ,  G06N10/00 ,  H01L27/18

Abstract: A quantum device according to an example embodiment includes a quantum chip 10, and an interposer 20 on which the quantum chip 10 is mounted, in which the interposer 20 includes a conductive wiring line CL1 electrically connected to the quantum chip 10, a mounting surface 21 of the interposer 20 on which the quantum chip 10 is mounted or an opposite surface 22 opposite to the mounting surface 21 includes a first area AR11 and a second area AR12 different from the first area AR11 as viewed in a direction perpendicular to the mounting surface 21 or the opposite surface 22, the conductive wiring line CL1 is disposed in the first area AR11 on the mounting surface 21 or the opposite surface 22, and a movable member 60 is in contact with the second area AR12 of the interposer 20.

公开(公告)号：US20210399194A1

公开(公告)日：2021-12-23

申请号：US17349281

申请日：2021-06-16

Applicant: NEC Corporation

Inventor： Kenji NANBA ,  Ayami YAMAGUCHI ,  Akira MIYATA ,  Katsumi KIKUCHI ,  Suguru WATANABE ,  Takanori NISHI ,  Hideyuki SATOU

IPC: H01L39/04 ,  H01L39/24

Abstract: A quantum device (100) includes: an interposer (112); a quantum chip (111); and a connection part (130) that is provided between the interposer (112) and the quantum chip (111) and electrically connects a wiring layer of the interposer (112) to a wiring layer of the quantum chip (111), in which the connection part (130) includes: a plurality of pillars (131) arranged on a main surface of the interposer (112); and a metal film (132) provided on a surface of the plurality of pillars (131) in such a way that it contacts the wiring layer of the quantum chip (111) and the thickness of the metal film at outer peripheral parts of the tip of each of the plurality of pillars (131) becomes larger than the thickness of the metal film at a center part of the tip of each of the plurality of pillars (131).

公开(公告)号：US20210164859A1

公开(公告)日：2021-06-03

申请号：US16632654

申请日：2018-07-23

Applicant: NEC Corporation

Inventor： Shigeki SHINODA ,  Hirofumi INOUE ,  Takahiro KUMURA ,  Katsumi KIKUCHI

IPC: G01M3/24 ,  E03B7/00 ,  F17D5/06

Abstract: Provided are an analyzing device and the like capable of suppressing erroneous determination. This analyzing device is provided with: a cross correlation calculating unit that obtains a cross correlation function with respect to vibrations detected at two points contained in a measurement sector of a pipeline; an estimating unit that estimates a cause of the vibrations, on the basis of the continuity of peaks in the cross correlation function; and an analyzing unit that analyzes the actual generation location of the vibrations and cause of the vibrations on the basis of an estimated generation location of the vibrations and cause of the vibrations and information relating to the configuration of a pipeline network.

公开(公告)号：US20210116323A1

公开(公告)日：2021-04-22

申请号：US17056463

申请日：2019-06-13

Applicant: NEC CORPORATION

Inventor： Shigeki SHINODA ,  Hirofumi INOUE ,  Junichiro MATAGA ,  Takahiro KUMURA ,  Katsumi KIKUCHI

IPC: G01M3/24 ,  G01M3/22

Abstract: A leakage inspection device according to an aspect of the present disclosure includes: at least one memory storing a set of instructions; and at least one processor configured to execute the set of instructions to: determine a measurement time; measure vibration waveforms for the measurement time by using at least two sensors set to a pipe; calculate a cross-correlation function of the measured vibration waveforms; detect peaks of the cross-correlation function at least twice in the measurement time; and determine that leakage occurs in a case where the peaks are repeatedly detected in the measurement time.

公开(公告)号：US20240160982A1

公开(公告)日：2024-05-16

申请号：US18388563

申请日：2023-11-10

Applicant: NEC Corporation

Inventor： Katsumi KIKUCHI ,  Akira Miyata

IPC: G06N10/20

CPC classification number: G06N10/20

Abstract: A quantum device includes a first chip and a second chip that are assembled to configure a three-dimensional wiring structure. The first chip includes a protruding region protruded from a side edge of an outer periphery of the second chip and includes terminals on the protruding region.

公开(公告)号：US20230141150A1

公开(公告)日：2023-05-11

申请号：US17918405

申请日：2020-04-21

Applicant: NEC Corporation

Inventor： Yu NABETO ,  Katsumi KIKUCHI ,  Takami SATO ,  Soma SHIRAISHI

IPC: G06V10/22 ,  G06V20/52 ,  G06V10/14 ,  G06V10/74

CPC classification number: G06V10/23 ,  G06V20/52 ,  G06V10/14 ,  G06V10/74

Abstract: The present invention provides a processing apparatus (10) including: an acquisition unit (11) that acquires an image generated by a plurality of cameras for photographing a product picked up by a customer; a recognition unit (12) that recognizes the product, based on each of a plurality of images generated by the plurality of cameras; and a determination unit (13) that determines a final recognition result, based on a plurality of recognition results based on each of the plurality of images, and a size of a region where the product is present within each of the plurality of images.

公开(公告)号：US20230048407A1

公开(公告)日：2023-02-16

申请号：US17792224

申请日：2020-01-23

Applicant: NEC Corporation

Inventor： Soma SHIRAISHI ,  Katsumi KIKUCHI ,  Takami SATO ,  Yu NABETO

IPC: G01V8/20

Abstract: A housing device (20) includes a housing portion (22), a light source (200), and an optical sensor (300). The housing portion (22) includes a holding body (100). An article is housed in the housing portion (22). The holding body (100) extends in one direction. The light source (200) is attached to the holding body (100) along the one direction. The light source (200) applies light toward at least a part of a space (S) located on a side of the holding body (100) with respect to the one direction of the holding body (100), a front of the space (S), and a back of the space (S). The optical sensor (300) is attached to the holding body (100). At least a part of a visual field of the optical sensor (300) faces in at least a part of the space (S), the front of the space (S), and the back of the space (S).

公开(公告)号：US20210399196A1

公开(公告)日：2021-12-23

申请号：US17347784

申请日：2021-06-15

Applicant: NEC Corporation

Inventor： Katsumi KIKUCHI ,  Akira MIYATA ,  Suguru WATANABE ,  Takanori NISHI ,  Hideyuki SATOU ,  Kenji NANBA ,  Ayami YAMAGUCHI

IPC: H01L39/04 ,  H01R12/71

Abstract: A quantum device capable of securing terminals for external connection is provided. A quantum device according to an example embodiment includes a quantum chip 10, an interposer 20 on which the quantum chip 10 is mounted, and a socket 40 disposed so as to be opposed to the interposer 20, the socket 40 comprising a movable pin 47 and a housing 45 supporting the movable pin 47, in which at least one end of the movable pin 47, which includes the one end and the other end opposite to the one end, is movable relative to the housing 45, the one end being in electrical contact with a terminal of the interposer 20, and the other end is in an electrical contact with a terminal of a board 50 on which a connector 51 is formed, the connector 51 being configured to serve as an external input/output.

公开(公告)号：US20210398893A1

公开(公告)日：2021-12-23

申请号：US17345426

申请日：2021-06-11

Applicant: NEC Corporation

Inventor： Katsumi KIKUCHI ,  Akira MIYATA ,  Suguru WATANABE ,  Takanori NISHI ,  Hideyuki SATOU ,  Kenji NANBA ,  Ayami YAMAGUCHI

IPC: H01L23/498 ,  H01L39/02

Abstract: A quantum device capable of improving a cooling effect while securing the number of terminals is provided. A quantum device according to an example embodiment includes a quantum chip 10, and an interposer 20 on which the quantum chip 10 is mounted, in which the interposer 20 includes a conductive wiring line CL1 electrically connected to the quantum chip 10, and a metal film 70 disposed in a part of the interposer 20 that is in contact with a sample stage 30 having a cooling function, and a mounting surface 21 of the interposer 20 on which the quantum chip 10 is mounted or an opposite surface 22 opposite to the mounting surface 21 includes a first area AR11 and a second area AR12 different from the first area AR11 as viewed in a direction perpendicular to the mounting surface 21 or the opposite surface 22.