公开(公告)号：US20250098550A1

公开(公告)日：2025-03-20

申请号：US18670767

申请日：2024-05-22

Applicant: NEC Corporation

Inventor： Katsumi KIKUCHI ,  Satoshi TSUKIYAMA ,  Tomohiro NISHIYAMA

IPC: H10N60/81 ,  H10N60/01

Abstract: A quantum device using a quantum state, including a quantum chip, a wiring component having a wiring layer, and a laminated substrate installed so that at least the surface of the wiring component on which the quantum chip is mounted is exposed, wherein a wiring layer of the laminated substrate and the wiring layer of the wiring component are connected by an integrated conductor pattern.

公开(公告)号：US20240234293A9

公开(公告)日：2024-07-11

申请号：US18226866

申请日：2023-07-27

Applicant: NEC Corporation

Inventor： Katsumi KIKUCHI ,  Akira MIYATA ,  Suguru WATANABE ,  Takanori NISHI ,  Hideyuki SATOU ,  Kenji NANBA ,  Ayami YAMAGUCHI

IPC: H01L23/498 ,  G06N10/40 ,  H01L23/13 ,  H01L23/367 ,  H10N60/81 ,  H10N69/00

CPC classification number: H01L23/49888 ,  G06N10/40 ,  H01L23/13 ,  H01L23/3677 ,  H10N60/815 ,  H10N69/00 ,  H01L23/36

Abstract: A quantum device capable of effectively cooling a quantum chip and an area (e.g., a space) therearound is provided. A quantum device includes a quantum chip and an interposer on which the quantum chip is located. The interposer includes an interposer substrate and an interposer wiring layer. The interposer wiring layer is disposed on a surface of the interposer substrate on a side on which the quantum chip is located. The interposer wiring layer includes, in at least a part thereof, a superconducting material layer formed of a superconducting material and a non-superconducting material layer formed of a non-superconducting material.

公开(公告)号：US20240079281A1

公开(公告)日：2024-03-07

申请号：US18239447

申请日：2023-08-29

Applicant: NEC Corporation

Inventor： Suguru WATANABE ,  Kunihiko ISHIHARA ,  Katsumi KIKUCHI

IPC: H01L23/053 ,  H01L23/498 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H10N69/00

CPC classification number: H01L23/053 ,  H01L23/49822 ,  H01R12/7005 ,  H01R12/714 ,  H01R13/2421 ,  H10N69/00 ,  H01L24/16 ,  H01L2224/16225

Abstract: A quantum device includes a quantum chip including a superconducting quantum circuit; an interposer including mounting the quantum chip on a first surface thereof; a housing having openings penetrating from a first surface of the housing opposing a second surface of the interposer to a second surface of the housing with probe pins housed in the opening, a board with a first surface facing the second surface of the housing; and one or more spacers between the first surface of the housing and the second surface of the interposer to ensure a clearance between the first surface of the housing and the second surface of the interposer facing the first surface of the housing.

公开(公告)号：US20230206630A1

公开(公告)日：2023-06-29

申请号：US17926726

申请日：2020-05-26

Applicant: NEC Corporation

Inventor： Haruna WATANABE ,  Katsumi KIKUCHI ,  Soma SHIRAISHI ,  Yu NABETO

IPC: G06V20/40 ,  G06V10/776 ,  G06V10/774 ,  G06V10/82

CPC classification number: G06V20/41 ,  G06V10/776 ,  G06V10/774 ,  G06V10/82

Abstract: The information processing device 1X mainly includes an input data acquisition means 14X, an importance degree calculation means 15X, and an attention part identification means 16X. The input data acquisition means 14X is configured to acquire input data “Di” including at least one of video data or audio data. The importance degree calculation means 15X is configured to calculate a degree of importance of the input data Di. The attention part identification means 16X is configured to identify an attention part of the input data Di in a calculation of the degree of importance.

公开(公告)号：US20230188855A1

公开(公告)日：2023-06-15

申请号：US17924745

申请日：2020-05-21

Applicant: NEC Corporation

Inventor： Katsumi KIKUCHI ,  Soma SHIRAISHI ,  Yu NABETO ,  Takami SATO

IPC: H04N23/695 ,  H04N23/56 ,  H04N23/74

CPC classification number: H04N23/695 ,  H04N23/56 ,  H04N23/74

Abstract: An installation assistance apparatus (100) includes a first image capture unit and a second image capture unit that are placed in such a way as to face each other in a plan view, an acquisition unit (102) acquiring a first image from the first image capture unit, a detection unit (104) detecting a position of at least part of the second image capture unit in the first image by processing the first image, a determination unit (106) determining whether the position of the second image capture unit satisfies a criterion, and an output processing unit (108) causing a determination result by the determination unit (106) to be output.

公开(公告)号：US20230186271A1

公开(公告)日：2023-06-15

申请号：US17925046

申请日：2020-05-22

Applicant: NEC Corporation

Inventor： Soma SHIRAISHI ,  Katsumi KIKUCHI ,  Takami SATO ,  Yu NABETO

IPC: G06Q20/20 ,  G06V10/764 ,  G06T7/70 ,  G06V10/74 ,  G06V10/75 ,  G06V10/12

CPC classification number: G06Q20/208 ,  G06V10/764 ,  G06T7/70 ,  G06V10/761 ,  G06V10/751 ,  G06V10/12

Abstract: The present invention provides a processing apparatus (10) including: an acquisition unit (11) that acquires a plurality of images, captured by a plurality of cameras, of a product held by a customer with a hand; a detection unit (12) that detects an object from each of the plurality of images; a positional information generation unit (13) that generates positional information indicating a position in the image, for the each detected object; a product kind-related information generation unit (14) that generates product kind-related information that determines a product kind, for the each detected object; an extraction unit (15) that extracts a group of a plurality of objects which satisfies conditions with each other, the conditions being related to the positional information and the product kind-related information; and a product recognition result output unit (16) that outputs a product recognition result for the each extracted group.

公开(公告)号：US20210407928A1

公开(公告)日：2021-12-30

申请号：US17357233

申请日：2021-06-24

Applicant: NEC Corporation

Inventor： Kenji NANBA ,  Ayami YAMAGUCHI ,  Akira MIYATA ,  Katsumi KIKUCHI ,  Suguru WATANABE ,  Takanori NISHI ,  Hideyuki SATOU

IPC: H01L23/552 ,  H01L23/498

Abstract: A quantum device (100) includes an interposer (112), a quantum chip (111) mounted on the interposer (112), and a shield part (150) provided so as to surround a quantum circuit region of the interposer (112) and the quantum chip (111). Accordingly, the quantum device (100) is able to prevent interference in the quantum circuit region due to exogenous noise.

公开(公告)号：US20200003653A1

公开(公告)日：2020-01-02

申请号：US16493373

申请日：2018-03-22

Applicant: NEC Corporation

Inventor： Soichiro TAKATA ,  Takahiro KUMURA ,  Katsumi KIKUCHI

IPC: G01M5/00

Abstract: Provided is an analysis device which enables highly accurate diagnosis of a structure state. An analysis device includes a system identification unit, an input modeling unit, an input generation unit, and a response calculation unit. The system identification unit identifies a model representing time evolution of a structure using a non-Gaussian random process, based on a distribution of response of the structure. The input modeling unit generates a probability model representing a distribution of an input, based on data indicating fluctuation of the input to the structure. The input generation unit generates an input signal for the structure based on the probability model. The response calculation unit random response of vibration occurring in the structure in response to the input signal, based on the model and the input signal.

公开(公告)号：US20240242577A1

公开(公告)日：2024-07-18

申请号：US18435108

申请日：2024-02-07

Applicant: NEC Corporation

Inventor： Yu NABETO ,  Soma SHIRAISHI ,  Takami SATO ,  Katsumi KIKUCHI

IPC: G07G1/00 ,  G06Q20/20 ,  G06V10/74

CPC classification number: G07G1/0045 ,  G06Q20/208 ,  G06V10/761 ,  G06V2201/07

Abstract: An image acquisition unit (11) acquires a recognition processing image. A recognition unit (12) recognizes a product in the recognition processing image based on an estimation model. A registration unit (13) registers a result of the recognition in recognized product information. An output unit (14) outputs a result of the recognition. A correction reception unit (16) receives an input for correcting a result of the recognition. A correction unit (17) changes a result of the recognition to a result of the recognition after a correction, and also stores correction information in which a result of the recognition after a correction and the recognition processing image are associated with each other. A learning unit (18) performs relearning by using the recognition processing image stored as the correction information and updates the estimation model, when a number of the recognition processing image stored exceeds a predetermined value.

公开(公告)号：US20240136274A1

公开(公告)日：2024-04-25

申请号：US18226866

申请日：2023-07-26

Applicant: NEC Corporation

Inventor： Katsumi KIKUCHI ,  Akira MIYATA ,  Suguru WATANABE ,  Takanori NISHI ,  Hideyuki SATOU ,  Kenji NANBA ,  Ayami YAMAGUCHI

IPC: H01L23/498 ,  G06N10/40 ,  H01L23/13 ,  H01L23/367 ,  H10N60/81 ,  H10N69/00

CPC classification number: H01L23/49888 ,  G06N10/40 ,  H01L23/13 ,  H01L23/3677 ,  H10N60/815 ,  H10N69/00 ,  H01L23/36

Abstract: A quantum device capable of effectively cooling a quantum chip and an area (e.g., a space) therearound is provided. A quantum device includes a quantum chip and an interposer on which the quantum chip is located. The interposer includes an interposer substrate and an interposer wiring layer. The interposer wiring layer is disposed on a surface of the interposer substrate on a side on which the quantum chip is located. The interposer wiring layer includes, in at least a part thereof, a superconducting material layer formed of a superconducting material and a non-superconducting material layer formed of a non-superconducting material.