公开(公告)号：US09419244B2

公开(公告)日：2016-08-16

申请号：US14398821

申请日：2013-05-14

Applicant: OSRAM OLED GmbH

Inventor： Erwin Lang ,  Marc Philippens ,  Tilman Schlenker ,  Richard Baisl

IPC: H01L21/66 ,  H01L51/52 ,  H01L51/56

CPC classification number: H01L51/5256 ,  H01L51/5203 ,  H01L51/5253 ,  H01L51/5275 ,  H01L51/56

Abstract: An organic light-emitting component includes a substrate on which a functional layer stack is applied, the stack including a first electrode, an organic functional layer stack thereover including an organic light-emitting layer and a translucent second electrode thereover, and a translucent halogen-containing thin-film encapsulation arrangement over the translucent second electrode, wherein a translucent protective layer having a refractive index of more than 1.6 is arranged directly on the translucent second electrode between the translucent second electrode and the thin-film encapsulation arrangement.

Abstract translation: 有机发光部件包括其上施加有功能层堆叠的基板，所述堆叠包括第一电极，其间包含有机发光层和其中的半透明第二电极的有机功能层堆叠，以及半透明卤素 - 在半透明的第二电极上包含薄膜封装装置，其中折射率大于1.6的半透明保护层直接布置在半透明的第二电极和薄膜封装装置之间的半透明的第二电极上。

公开(公告)号：US20160149158A1

公开(公告)日：2016-05-26

申请号：US14901110

申请日：2014-06-13

Applicant: OSRAM OLED GMBH

Inventor： Erwin Lang ,  Philipp Schwamb ,  Simon Schicktanz

IPC: H01L51/52 ,  H01L51/56 ,  H01L27/32 ,  H01L51/00

CPC classification number: H01L51/5253 ,  H01L27/3272 ,  H01L51/0097 ,  H01L51/52 ,  H01L51/524 ,  H01L51/5243 ,  H01L51/5246 ,  H01L51/5284 ,  H01L51/529 ,  H01L51/56 ,  H01L2251/5338 ,  H01L2251/566

Abstract: Various embodiments may relate to a method for processing an electronic component. The method includes applying a planar structure provided with predetermined separation locations to the electronic component, and removing a part of the applied planar structure, wherein removing includes separating the planar structure at the predetermined separation locations.

Abstract translation: 各种实施例可以涉及一种用于处理电子部件的方法。 该方法包括将设置有预定分离位置的平面结构应用于电子部件，以及去除所施加的平面结构的一部分，其中移除包括在预定分离位置分离平面结构。

公开(公告)号：US11569479B2

公开(公告)日：2023-01-31

申请号：US17335534

申请日：2021-06-01

Applicant: OSRAM OLED GmbH

Inventor： Sebastian Wittmann ,  Arne Fleissner ,  Erwin Lang

IPC: H01L51/52 ,  H01L51/50

Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a first electrode layer, an organic light-emitting layer stack abutting the first electrode layer, a second electrode layer abutting the light-emitting layer stack and a multilayer encapsulation abutting the second electrode layer, wherein the multilayer encapsulation comprises a barrier layer and a planarization layer, wherein the planarization layer abuts the second electrode layer, and wherein the planarization layer is arranged between the second electrode layer and the barrier layer.

公开(公告)号：US11043654B2

公开(公告)日：2021-06-22

申请号：US16830023

申请日：2020-03-25

Applicant: OSRAM OLED GmbH

Inventor： Sebastian Wittmann ,  Arne Fleissner ,  Erwin Lang

IPC: H01L51/52 ,  H01L51/50

Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a first electrode layer, an organic light-emitting layer stack abutting the first electrode layer, a second electrode layer abutting the light-emitting layer stack and a multilayer encapsulation abutting the second electrode layer, wherein the multilayer encapsulation comprises a barrier layer and a planarization layer, wherein the planarization layer abuts the second electrode layer, and wherein the planarization layer is arranged between the second electrode layer and the barrier layer.

公开(公告)号：US10944081B2

公开(公告)日：2021-03-09

申请号：US16813922

申请日：2020-03-10

Applicant: OSRAM OLED GmbH

Inventor： Erwin Lang ,  Thomas Wehlus ,  Arne Fleißner ,  Sebastian Wittmann

IPC: H01L29/06 ,  H01L21/00 ,  H01L51/52

Abstract: A component module includes a component holder having a curved upper side, and a radiation-emitting component arranged in a curved shape on the upper side, wherein the component holder includes a heat-distributing region on the upper side, a neutral fiber running inside the component, an adhesive is planar and arranged between the radiation-emitting component and the upper side, and the adhesive fixes the radiation-emitting component on the upper side.

公开(公告)号：US20200227683A1

公开(公告)日：2020-07-16

申请号：US16830023

申请日：2020-03-25

Applicant: OSRAM OLED GmbH

Inventor： Sebastian Wittmann ,  Arne Fleissner ,  Erwin Lang

IPC: H01L51/52 ,  H01L51/50

Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a first electrode layer, an organic light-emitting layer stack abutting the first electrode layer, a second electrode layer abutting the light-emitting layer stack and a multilayer encapsulation abutting the second electrode layer, wherein the multilayer encapsulation comprises a barrier layer and a planarization layer, wherein the planarization layer abuts the second electrode layer, and wherein the planarization layer is arranged between the second electrode layer and the barrier layer.

公开(公告)号：US10249847B2

公开(公告)日：2019-04-02

申请号：US15527336

申请日：2015-11-04

Applicant: OSRAM OLED GmbH

Inventor： Erwin Lang ,  Arne Fleissner

IPC: G04C17/00 ,  H01L27/32 ,  H01L33/38 ,  H01L33/40 ,  H01L51/00 ,  H01L51/52

Abstract: An organic light-emitting diode provides a substrate having a top side and one or a plurality of substrate side surfaces running transversely to the top side and connected thereto via a substrate edge; and an organic layer sequence applied to the top side with an emitter layer, which generates electromagnetic radiation coupled out from the diode via a luminous surface during intended operation of the diode. In a plan view of the luminous surface, the sequence adjoins at least a partial region of substrate edge(s), and in the region the luminous surface extends at least as far as the corresponding edge. An encapsulation formed in an uninterrupted and continuous fashion is applied to the sequence. The encapsulation, at least in the region of the edge adjoining the sequence, is led onto the associated substrate side surface, at least partly covers the latter and is in direct contact with the surface.

公开(公告)号：US10177202B2

公开(公告)日：2019-01-08

申请号：US15060635

申请日：2016-03-04

Applicant: OSRAM OLED GmbH

Inventor： Arne Fleissner ,  Simon Schicktanz ,  Erwin Lang ,  Nina Riegel ,  Egbert Hoefling

IPC: H01L27/32

Abstract: A double-sided emissive organic display device includes a carrier, a control element layer structure above the carrier, a plurality of first organic light emitting components, which are formed above the carrier, which are electrically connected to the control element layer structure and which are driven by means of the control element layer structure during the operation of the double-sided emissive organic display device and emit first light substantially in a direction toward the carrier, and a plurality of second organic light emitting components, which are formed above the control element layer structure and which are electrically connected to the control element layer structure and which are driven by means of the control element layer structure during the operation of the double-sided emissive organic display device and emit second light substantially in a direction away from the carrier.

公开(公告)号：US20180351128A1

公开(公告)日：2018-12-06

申请号：US15777176

申请日：2017-10-04

Applicant: OSRAM OLED GmbH

Inventor： Erwin Lang

IPC: H01L51/52 ,  H01L51/56 ,  H01L51/00 ,  F21S43/145 ,  F21V17/10 ,  F21V23/06

CPC classification number: H01L51/524 ,  F21S43/145 ,  F21V17/101 ,  F21V23/06 ,  F21W2103/20 ,  F21W2103/35 ,  F21W2103/45 ,  F21Y2115/15 ,  H01L51/0097 ,  H01L51/5203 ,  H01L51/56 ,  H01L2251/5361

Abstract: A method for producing a bent organic light-emitting diode and a bent organic light-emitting diode are disclosed. In an embodiment the method includes providing an emitter unit having an organic layer sequence for generating radiation, providing at least one electrical connection piece, bending the at least one connection piece and the emitter unit into a curved shape and subsequently mechanically fixedly and permanently connecting the at least one connection piece to the emitter unit so that the curved shape is permanently maintained.

公开(公告)号：US09997731B2

公开(公告)日：2018-06-12

申请号：US15517147

申请日：2015-11-24

Applicant: OSRAM OLED GmbH

Inventor： Thorsten Vehoff ,  Erwin Lang

IPC: H01L29/66 ,  H01L51/44 ,  H01L51/52 ,  H01L51/50

CPC classification number: H01L51/442 ,  H01L51/5008 ,  H01L51/5036 ,  H01L51/5068 ,  H01L51/5203 ,  H01L51/5271 ,  H01L2251/5323 ,  H01L2251/5361

Abstract: A light emitting component is disclosed. In an embodiment a light-emitting device includes at least one active layer stack configured to generate light, a first electrode electrically contacting the at least one active layer stack, a second electrode electrically contacting the at least one active layer stack and at least one light-emitting face for emitting light. The device further includes a first contact structure electrically conductively connected to the first electrode and a second contact structure electrically conductively connected to the second electrode, wherein the first contact structure laterally surrounds a major part of the at least one light-emitting face and a major part of the second contact structure, and wherein the second contact structure laterally surrounds a major part of the at least one light-emitting face.