COMPONENT MODULE HAVING A RADIATION-EMITTING CURVED COMPONENT

    公开(公告)号:US20200212343A1

    公开(公告)日:2020-07-02

    申请号:US16813922

    申请日:2020-03-10

    Abstract: A component module includes a component holder having a curved upper side, and a radiation-emitting component arranged in a curved shape on the upper side, wherein the component holder includes a heat-distributing region on the upper side, a neutral fiber running inside the component, an adhesive is planar and arranged between the radiation-emitting component and the upper side, and the adhesive fixes the radiation-emitting component on the upper side.

    OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT

    公开(公告)号:US20180151833A1

    公开(公告)日:2018-05-31

    申请号:US15823643

    申请日:2017-11-28

    Abstract: In various embodiments, an optoelectronic component is provided. The optoelectronic component includes an optically active layer structure on a surface of a planar substrate. The surface in a predefined region is free of optically active layer structure. The optoelectronic component further includes an encapsulation structure having an inorganic encapsulation layer. The inorganic encapsulation layer is formed on or above the optically active layer structure and the surface of the substrate in the predefined region. The inorganic encapsulation layer at least in the predefined region is formed in direct contact with the surface of the substrate. The surface of the substrate at least in the predefined region includes a structuring. The structuring is configured to increase the roughness of the surface. The substrate at least in the predefined region at the surface thereof includes or is formed from an inorganic material.

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