公开(公告)号：US20210272935A1

公开(公告)日：2021-09-02

申请号：US16805911

申请日：2020-03-02

Applicant: Palo Alto Research Center Incorporated

Inventor： Yunda Wang ,  Jengping Lu ,  Qian Wang ,  Sourobh Raychaudhuri

IPC: H01L25/075 ,  H01L25/16 ,  H01L33/00 ,  H01L21/66

Abstract: MicroLED chips are transferred from an epitaxy wafer to a first coupon substrate. The first coupon substrate has a first, soft adhesive layer that temporarily holds the microLED chips. Using a first transfer substrate, a subset of the microLED chips are transferred from the first coupon substrate to a second coupon substrate having a second, soft adhesive layer. A pattern of microLED chips are transferred from another substrate to the second coupon substrate via a second transfer substrate to fill vacancies in the subset of microLED chips. The transfer substrates are operable to hold and release pluralities of micro objects.

公开(公告)号：US20200207617A1

公开(公告)日：2020-07-02

申请号：US16237419

申请日：2018-12-31

Applicant: Palo Alto Research Center Incorporated

Inventor： Anne Plochowietz ,  Bradley Rupp ,  Jengping Lu ,  Julie A. Bert ,  Lara S. Crawford ,  Sourobh Raychaudhuri ,  Eugene M. Chow ,  Matthew Shreve ,  Sergey Butylkov

IPC: B81C99/00 ,  H01L21/67 ,  H01L23/00

Abstract: Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.