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公开(公告)号：US4961821A
公开(公告)日：1990-10-09
申请号：US440296
申请日：1989-11-22
IPC分类号： B41J2/05 , B41J2/135 , B41J2/16 , H01L21/301 , H01L21/306 , H01L21/308 , H01L21/768
CPC分类号： B41J2/1603 , B41J2/1628 , B41J2/1629 , H01L21/30608 , H01L21/3081 , H01L21/76898
摘要： At least one through opening of predetermined location and dimensions is fabricated in a (100) silicon wafer by orientation dependent etching method after completion of integrated circuits on the wafer, the opening extending through the wafer between a circuit surface of the wafer and an opposite parallel base surface of the wafer and having a predetermined location relative to the integrated circuit on the circuit surface of the wafer. The method includes the steps of fabricating the integrated circuit on the circuit surface of the wafer; applying an etch resistant layer of plasma solicon nitride on the circuit and base surfaces of the wafer; patterning the etch resistant plasma silicon nitride layer on the circuit surface to define an upper etch opening having a location and dimensions which define the predetermined location and dimensions of the through opening; and patterning the plasma silicon nitride layer on the base surface to produce a lower etch opening aligned with the upper etch opening within a predetermined tolerance. The wafer is then anisotropically etched to produce a first recess corresponding to the upper etch opening in the circuit surface and a second recess corresponding to the lower etch opening in the base surface, each of the first and second recesses being bounded by (111) plane side walls. The anisotropic etching of the second recess intersects the first recess to form the through opening bounded by (111) plane side walls and has its predetermined dimensions and location defined by the patterning of the upper etch opening.
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公开(公告)号：US4789425A
公开(公告)日：1988-12-06
申请号：US82417
申请日：1987-08-06
申请人： Donald J. Drake , William G. Hawkins , Stephen F. Pond , Michael R. Campanelli , Pamela J. Hartman , Raymond E. Bailey
发明人： Donald J. Drake , William G. Hawkins , Stephen F. Pond , Michael R. Campanelli , Pamela J. Hartman , Raymond E. Bailey
CPC分类号： B41J2/1628 , B23P15/00 , B41J2/1603 , B41J2/1623 , B41J2/1625 , B41J2/1629 , B41J2/1631 , B41J2/1635 , B41J2/1642 , Y10T29/49083
摘要： A thermal ink jet printhead of the type which expels droplets on demand towards a recording medium from nozzles located above and generally parallel with the bubble generating heating elements contained therein is disclosed, together with fabrication processes therefor. The droplets are propelled along trajectories that are perpendicular to the heating element surfaces and from nozzles located in the printhead roof; such configuration is generally referred to as "roofshooter". Each printhead comprises a silicon heater plate and a fluid directing structural member. The heater plate has a linear array of heating elements associated addressing electrodes, and an elongated ink fill hole parallel with the heating element array. The structural member contains at least one recessed cavity, a plurality of nozzles, and a plurality of parallel walls within the recessed cavity which define individual ink channels for directing ink to the nozzles. The recessed cavity and fill hole are in communication with each other and form the ink reservoir within the printhead. The ink holding capacity of the fill hole is larger than that of the recessed cavity. The fill hole is precisely formed and positioned within the heater plate by anisotropic etching. The structural member may be fabricated either from two layers of photoresist, a two-stage flat nickel electroform, or a single photoresist layer and a single stage flat nickel electroform.
摘要翻译： 公开了一种根据需要将液滴从记录介质喷出的类型的热喷墨打印头，其喷嘴位于包含在其中的产生发泡元件的上方并大致平行的喷嘴及其制造工艺。 液滴沿着垂直于加热元件表面和位于打印头顶部的喷嘴的轨迹推进; 这种构造通常被称为“屋顶运动器”。 每个打印头包括硅加热器板和流体引导结构构件。 加热器板具有与寻址电极相关联的加热元件的线性阵列和与加热元件阵列平行的细长的墨水填充孔。 结构构件在凹腔内包含至少一个凹腔，多个喷嘴和多个平行壁，其限定用于将墨引导到喷嘴的各个墨通道。 凹腔和填充孔彼此连通并在打印头内形成墨水容器。 填充孔的油墨保持能力大于凹腔的油墨保持能力。 填充孔通过各向异性蚀刻精确地形成并定位在加热器板内。 结构构件可以由两层光致抗蚀剂，两级平面镍电铸或单一光致抗蚀剂层和单级平面镍电铸制成。
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公开(公告)号：US4786357A
公开(公告)日：1988-11-22
申请号：US126085
申请日：1987-11-27
CPC分类号： B41J2/1604 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1635
摘要： A plurality of thermal ink jet printheads are fabricated from two substrates, at least one of which is a (100) silcon wafer. A plurality of sets of heating element arrays are formed on one substrate, together with addressing electrodes for each heating element. A thick film insulative layer is placed over the heating elements and addressing electrodes which is patterned to remove the thick film from over the individual heating elements, placing them each in a recess, and the thermal end portions of the electrodes including the contact pads therefor. A plurality of ink supplying manifold recesses are anisotropically etched in the silicon wafer and a plurality of sets of channel grooves are formed, each set of which communicate with an associated manifold. The silicon wafer and heating element substrates are aligned and bonded together, so that each channel groove contains a heating element. The individual printheads are formed by first removing unwanted silicon above each set of end portions of electrodes by a dicing operation and then dicing the heating element substrate to obtain the individual printheads. The patterned trough in the thick film insulative layer above the electrode end portions provides the spacing between the two substrates to enable removal of the unwanted silicon without the need of etched relief recesses as used in the prior art.
摘要翻译： 多个热喷墨打印头由两个基板制成，其中至少一个是（100）硅晶圆。 在一个基板上形成多组加热元件阵列，以及每个加热元件的寻址电极。 将加热元件和寻址电极放置在加热元件和寻址电极上，该电极图案化以从各个加热元件上方移除厚膜，将它们各自放置在凹部中，并且电极的热端部包括用于其的接触垫。 在硅晶片中各向异性地蚀刻多个供墨歧管凹槽，并且形成多组通道槽，每组通道槽与相关歧管连通。 硅晶片和加热元件基板对准并结合在一起，使得每个通道槽包含加热元件。 单个打印头通过首先通过切割操作去除每组电极端部上的不需要的硅，然后切割加热元件基板以获得各个打印头而形成。 在电极端部上方的厚膜绝缘层中的图形槽提供两个基板之间的间隔，以便能够去除不需要的硅，而不需要像现有技术中所使用的蚀刻的浮雕凹槽。
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公开(公告)号：US4639748A
公开(公告)日：1987-01-27
申请号：US781554
申请日：1985-09-30
CPC分类号： B41J2/1604 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1635 , B41J2/1642 , B41J2/17563
摘要： An ink jet printhead having an internal, integrated filtering system and fabricating process therefor is disclosed. Each printhead is composed of two parts aligned and bonded together. One part is a substantially flat substrate which contains on a surface thereof a linear array of heating elements and addressing electrodes. The other part is a flat substrate having a set of concurrently etched recesses in one surface. The set of recesses include a parallel array of elongated recesses for use as capillary filled, ink channels having ink droplet emitting nozzles at one end and having interconnection with a common ink supplying manifold recess at the other ends. The manifold recess contains an internal, closed wall defining a chamber with an ink fill hole. Small passageways are formed in the internal chamber walls to permit passage of ink therefrom into the manifold. Each of the passageways have smaller cross-sectional flow areas than the nozzles to filter the ink, while the total cross-sectional flow area of the passageways is larger than the total cross-sectional flow area of the nozzles. Many printheads can be made simultaneously by producing a plurality of sets of heating element arrays with their addressing electrodes on a silicon wafer and by placing alignment marks thereon at predetermined locations. A corresponding plurality of sets of channels and associated manifolds with internal filters are produced in a second silicon wafer and, in one embodiment, alignment openings are etched thereon at predetermined locations. The two wafers are aligned via the alignment openings and alignment marks, then bonded together and diced into many separate printheads.
摘要翻译： 公开了一种具有内部集成过滤系统及其制造方法的喷墨打印头。 每个打印头由对准和粘合在一起的两个部件组成。 一部分是基本平坦的基板，其在其表面上包含加热元件和寻址电极的线性阵列。 另一部分是在一个表面中具有一组同时蚀刻的凹槽的平坦基底。 这组凹槽包括用作毛细管填充的墨水通道的细长凹槽的平行阵列，墨水通道在一端具有喷墨嘴，并且在另一端具有与公共墨水供应歧管凹槽的互连。 歧管凹槽包含限定具有墨水填充孔的室的内部封闭壁。 在内部室壁中形成小通道，以允许墨水从歧管中通过。 每个通道具有比用于过滤油墨的喷嘴更小的横截面流动面积，而通道的总截面流动面积大于喷嘴的总横截面积面积。 可以通过在硅晶片上产生多组加热元件阵列及其寻址电极并且通过在预定位置放置对准标记来同时制造许多打印头。 在第二硅晶片中产生相应的多组具有内部滤波器的通道和相关联的歧管，并且在一个实施例中，在预定位置处蚀刻对准开口。 两个晶片通过对准开口和对准标记对齐，然后粘合在一起并切成许多单独的打印头。
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