公开(公告)号：US07255562B2

公开(公告)日：2007-08-14

申请号：US10027278

申请日：2001-12-21

申请人： Richard P. Rusin ,  Kevin M. Cummings ,  Roger J. Carufel

发明人： Richard P. Rusin ,  Kevin M. Cummings ,  Roger J. Carufel

IPC分类号： A61K6/08

CPC分类号： A61C13/0022 ,  A61K6/083 ,  A61K6/087 ,  A61K6/09 ,  C08L33/00 ,  C08L63/00 ,  C08L75/16

摘要： A dental mill blank comprising a resin and a filler, wherein the blank is fabricated such that it passes a Thermal Shock Test. The mill blank is substantially free of cracks and discontinuities. Further, the blank may have superior cuttability and hardness.

摘要翻译： 一种包括树脂和填料的牙科磨机坯料，其中坯料被制造成使其通过热冲击试验。 轧机坯料基本上没有裂纹和不连续性。 此外，坯料可以具有优异的可切割性和硬度。

公开(公告)号：US07160528B2

公开(公告)日：2007-01-09

申请号：US11248781

申请日：2005-11-16

申请人： Richard P. Rusin

发明人： Richard P. Rusin

IPC分类号： C08K3/22 ,  C08K3/36 ,  C08K3/38

CPC分类号： A61K6/083 ,  A61K6/0073 ,  A61K6/087 ,  C01P2006/12 ,  C08K3/013 ,  C09C1/00 ,  C09C1/3045 ,  C09C1/40 ,  Y10S522/908 ,  Y10T428/2993 ,  C08L33/00 ,  C08L63/00

摘要： Polymerizable compositions that include: (a) a cationically active functional group; (b) an initiation system capable of initiating cationic polymerization of the cationically active functional group; and (c) a filler composition that includes various radiopacifying fillers in an amount sufficient to render the polymerizable composition radiopaque. Components (a), (b), and (c) are selected such that the polymerizable composition polymerizes to form a polymerized composition having a Barcol hardness, measured using a GYZJ-935 meter, of at least 10 within 30 minutes following initiation of the cationically active functional group at a reaction temperature of 25° C.

摘要翻译： 可聚合组合物，其包括：（a）阳离子活性官能团; （b）能够引发阳离子活性官能团的阳离子聚合的引发体系; 和（c）包含足以使可聚合组合物不透射线的量的各种放射性填料的填料组合物。 选择组分（a），（b）和（c），使得可聚合组合物聚合以形成具有Barcol硬度的聚合组合物，其在使用GYZJ-935米测量时在30分钟内至少10分钟 阳离子活性官能团的反应温度为25℃

公开(公告)号：US06352763B1

公开(公告)日：2002-03-05

申请号：US09221007

申请日：1998-12-23

申请人： Kenneth R. Dillon ,  Kyung H. Moh ,  Thomas Edward Wood ,  Raymond C. Chiu ,  Vincent Wen-Shiuan King ,  Richard P. Rusin ,  Timothy Lee Hoopman ,  Paul Edward Humpal

发明人： Kenneth R. Dillon ,  Kyung H. Moh ,  Thomas Edward Wood ,  Raymond C. Chiu ,  Vincent Wen-Shiuan King ,  Richard P. Rusin ,  Timothy Lee Hoopman ,  Paul Edward Humpal

IPC分类号： B32B1800

CPC分类号： H01J9/242 ,  C03C8/14 ,  C03C8/16 ,  C03C17/04 ,  H01J2211/36 ,  Y10T428/24413 ,  Y10T428/24421 ,  Y10T428/24545 ,  Y10T428/252 ,  Y10T428/2991 ,  Y10T428/31612

摘要： A curable slurry for forming ceramic microstructures on a substrate using a mold. The slurry is a mixture of a ceramic powder, a fugitive binder, and a diluent. The ceramic powder has a low softening temperature in a range of about 400° C. to 600° C. and a coefficient of thermal expansion closely matched to that of the substrate. The fugitive binder is capable of radiation curing, electron beam curing, or thermal curing. The diluent promotes release properties with the mold after curing the binder or quick and complete burn out of the binder during debinding.