公开(公告)号：US20100219924A1

公开(公告)日：2010-09-02

申请号：US12709912

申请日：2010-02-22

申请人： Tsung-Chan Wu ,  Roger Hsieh ,  Yi-Min Huang ,  Lan-Chin Hsieh

发明人： Tsung-Chan Wu ,  Roger Hsieh ,  Yi-Min Huang ,  Lan-Chin Hsieh

IPC分类号： H01F27/02

CPC分类号： H01F17/045 ,  H01F2017/048

摘要： An electronic device including a core, at least a wire and a magnetic material is provided. The core includes a pillar, a top board and a bottom board. The pillar is disposed between the top board and the bottom board. An area of the top board is smaller than an area of the bottom board. A winding space is fanned among the top board, the bottom board and the pillar. The wire is winded around the pillar and located in the winding space. The magnetic material fills the winding space to encapsulate the wire. The magnetic material includes a resin and a metallic powder, wherein an average particle diameter of the magnetic powder is smaller than 20 μm.

摘要翻译： 提供了包括芯，至少线和磁性材料的电子设备。 核心包括柱子，顶板和底板。 支柱设置在顶板和底板之间。 顶板的面积小于底板的面积。 在顶板，底板和支柱之间蜿蜒的空间。 电线缠绕在支柱上并位于绕组空间中。 磁性材料填充绕组空间以封装电线。 磁性材料包括树脂和金属粉末，其中磁粉的平均粒径小于20μm。

公开(公告)号：US6151771A

公开(公告)日：2000-11-28

申请号：US274736

申请日：1999-03-23

申请人： Jackel Tzeng ,  Roger Hsieh ,  Duen-Jen Cheng

发明人： Jackel Tzeng ,  Roger Hsieh ,  Duen-Jen Cheng

IPC分类号： G01K7/18 ,  H01C7/10 ,  H01C17/00

CPC分类号： H01C17/006 ,  G01K7/183 ,  H01C7/10 ,  Y10T29/49082 ,  Y10T29/49085

摘要： The present invention discloses a method for manufacturing a surface mount resistance-temperature-detector (RTD) on a substrate. The manufacture method includes the steps of (a) depositing a resistive thin film on a top surface of the substrate having a substantially linear temperature resistance coefficient (TCR) over a predetermined temperature range for temperature measurement; (b) patterning the resistive film into a plurality of resistive strips and a plurality of top terminals near two opposite edges on the top surface of the substrate with each resistive strip connected between two top terminals; (c) forming a bottom electrode on a bottom surface of the substrate underneath each of the top terminals; (d) depositing two edge conductive plates on edge surfaces of the substrate for connecting one of the top terminals to a bottom terminal thereunder; and (e) forming two surface mount solder electrodes with a conductive layer overlying the top terminal, the edge conductive plate and the bottom terminal provided for performing a surface-mount soldering operation thereon.

摘要翻译： 本发明公开了一种在基板上制造表面安装电阻温度检测器（RTD）的方法。 该制造方法包括以下步骤：（a）在具有基本上线性的耐温系数（TCR）的基板的顶表面上沉积电阻薄膜超过预定温度范围进行温度测量; （b）将电阻膜图案化成多个电阻条和位于基板顶表面两个相对边缘附近的多个顶端，每个电阻条连接在两个顶端之间; （c）在每个顶端子下面的衬底的底表面上形成底电极; （d）在所述基板的边缘表面上沉积两个边缘导电板，用于将所述顶部端子中的一个连接到其下面的底部端子; 和（e）形成两个表面贴装的焊料电极，其上覆盖着顶部端子，边缘导电板和底部端子，用于在其上执行表面贴装焊接操作。