公开(公告)号：US5958606A

公开(公告)日：1999-09-28

申请号：US795518

申请日：1997-02-05

Applicant: Chung-Hsiung Wang ,  Duen-Jen Cheng

Inventor： Chung-Hsiung Wang ,  Duen-Jen Cheng

IPC: B32B17/06 ,  G01K7/18 ,  H01C1/012 ,  B32B15/01

CPC classification number: H01C1/012 ,  B32B17/06 ,  G01K7/183 ,  Y10T428/12847 ,  Y10T428/12875 ,  Y10T428/12937 ,  Y10T428/12944 ,  Y10T428/24777 ,  Y10T428/24917 ,  Y10T428/31518 ,  Y10T428/31529

Abstract: The present invention discloses a substrate structure for supporting a thin film with specific temperature coefficient of resistance (TCR) thereon. The substrate structure includes a substrate composed of a borosilicate glass. The substrate further includes an interface layer of LaSiONx covering a top surface of the substrate. The substrate supports the thin film includes a platinum thin film thereon. The substrate structure further includes an adhesion anchoring seam disposed as a bonding seam interfacing the thin film to the substrate for securely attaching the thin film to the substrate therein. The bonding seam is disposed on a boundary edge of the thin film and includes a nickel-chromium alloy anchor seam disposed on the boding seam. In a preferred embodiment, the substrate structure includes a protective layer covering and protecting the substrate structure thereunder. In another preferred embodiment, the substrate structure further includes electrodes for electrically connecting to the thin film with the specific TCR for providing an electrical voltage thereto.

Abstract translation: 本发明公开了一种用于支撑其上具有特定温度系数（TCR）的薄膜的衬底结构。 基板结构包括由硼硅酸盐玻璃构成的基板。 衬底还包括覆盖衬底的顶表面的LaSiONx的界面层。 基板支撑薄膜在其上包括铂薄膜。 衬底结构还包括粘合锚定缝，其设置为将薄膜与基底相接合的粘合缝，用于将薄膜牢固地附接到衬底中。 粘合缝设置在薄膜的边界边缘上，并且包括设置在焊缝上的镍铬合金锚缝。 在优选实施例中，衬底结构包括覆盖并保护其下的衬底结构的保护层。 在另一个优选实施例中，衬底结构还包括用于与特定TCR电连接到薄膜的电极，用于向其提供电压。

公开(公告)号：US4987879A

公开(公告)日：1991-01-29

申请号：US520107

申请日：1990-05-04

Applicant: Guey-Fa Chi ,  Duen-Jen Cheng ,  Ying-Cheun Yeh

Inventor： Guey-Fa Chi ,  Duen-Jen Cheng ,  Ying-Cheun Yeh

IPC: F02P7/07

CPC classification number: F02P7/07

Abstract: An ignition distributor of an automotive vehicle has a magnetic pick-up device mounted in the housing of the ignition distributor and including a magnetoresistor. The magnetoresistor is electrically connected to a primary ignition circuit in the ignition coil, which produces a high voltage when said magnetic pick-up device produces a voltage pulse output signal. A permanent magnetic plate is attached to the magnetoresistor and provides a magnetic field perpendicular to the direction of the current flow through the magnetoresistor. When each of the teeth of an armature rotated with the distributor shaft mounted in the ignition distributor passes the magnetic pick-up device to change temporarily the magnetic field applied to the magnetoresistor, the resistance of the magnetoresistor is correspondingly varied so that said magnetoresistor can produce a voltage pulse by the magnetoresistance effect, and open and close the primary ignition circuit for firing the spark plugs.

Abstract translation: 机动车辆的点火分配器具有安装在点火分配器的壳体中的磁性拾取装置，并且包括磁阻器。 磁阻电阻器与点火线圈中的初级点火电路电连接，当所述磁性拾取器件产生电压脉冲输出信号时，该电压产生高电压。 永久磁板附着在磁电阻上，并提供垂直于通过磁电阻的电流方向的磁场。 当与安装在点火分配器中的分配器轴旋转的电枢的每个齿通过磁性拾取装置以临时改变施加到磁电阻器的磁场时，磁阻器的电阻相应地变化，使得所述磁电阻器可以产生 通过磁阻效应的电压脉冲，并且打开和关闭用于点火火花塞的初级点火电路。

公开(公告)号：US6151771A

公开(公告)日：2000-11-28

申请号：US274736

申请日：1999-03-23

Applicant: Jackel Tzeng ,  Roger Hsieh ,  Duen-Jen Cheng

Inventor： Jackel Tzeng ,  Roger Hsieh ,  Duen-Jen Cheng

IPC: G01K7/18 ,  H01C7/10 ,  H01C17/00

CPC classification number: H01C17/006 ,  G01K7/183 ,  H01C7/10 ,  Y10T29/49082 ,  Y10T29/49085

Abstract: The present invention discloses a method for manufacturing a surface mount resistance-temperature-detector (RTD) on a substrate. The manufacture method includes the steps of (a) depositing a resistive thin film on a top surface of the substrate having a substantially linear temperature resistance coefficient (TCR) over a predetermined temperature range for temperature measurement; (b) patterning the resistive film into a plurality of resistive strips and a plurality of top terminals near two opposite edges on the top surface of the substrate with each resistive strip connected between two top terminals; (c) forming a bottom electrode on a bottom surface of the substrate underneath each of the top terminals; (d) depositing two edge conductive plates on edge surfaces of the substrate for connecting one of the top terminals to a bottom terminal thereunder; and (e) forming two surface mount solder electrodes with a conductive layer overlying the top terminal, the edge conductive plate and the bottom terminal provided for performing a surface-mount soldering operation thereon.

Abstract translation: 本发明公开了一种在基板上制造表面安装电阻温度检测器（RTD）的方法。 该制造方法包括以下步骤：（a）在具有基本上线性的耐温系数（TCR）的基板的顶表面上沉积电阻薄膜超过预定温度范围进行温度测量; （b）将电阻膜图案化成多个电阻条和位于基板顶表面两个相对边缘附近的多个顶端，每个电阻条连接在两个顶端之间; （c）在每个顶端子下面的衬底的底表面上形成底电极; （d）在所述基板的边缘表面上沉积两个边缘导电板，用于将所述顶部端子中的一个连接到其下面的底部端子; 和（e）形成两个表面贴装的焊料电极，其上覆盖着顶部端子，边缘导电板和底部端子，用于在其上执行表面贴装焊接操作。

公开(公告)号：US5981393A

公开(公告)日：1999-11-09

申请号：US939671

申请日：1997-09-29

Applicant: Shih-Chang Liao ,  Duen-Jen Cheng

Inventor： Shih-Chang Liao ,  Duen-Jen Cheng

IPC: H01C17/00 ,  H01L21/00 ,  B44C1/22

CPC classification number: H01C17/006

Abstract: A method of forming electrode at the end surface of chip array resistors utilizes the vacuum metallization technology such as sputtering evaporating deposition or ion implanting accompanying a metal mask for forming electrode at the end surfaces of chip array resistors. A blank base can be used instead of a punch-through base which has to be used in conventional technology. The method disclosed in the present invention may greatly increase the productivity of the electrodes, and at the same time, the variation of resistance value of the chip array resistor is minimized and the product quality may be improved.

Abstract translation: 在芯片阵列电阻器的端面处形成电极的方法利用真空金属化技术，例如溅射蒸发沉积或伴随金属掩模的离子注入，用于在芯片阵列电阻器的端面处形成电极。 可以使用空白基座代替必须在传统技术中使用的穿透基座。 本发明公开的方法可以大大提高电极的生产率，并且同时使芯片阵列电阻器的电阻值的变化最小化，并且可以提高产品质量。

公开(公告)号：US5896081A

公开(公告)日：1999-04-20

申请号：US872564

申请日：1997-06-10

Applicant: Jackel Tzeng ,  Roger Hsieh ,  Duen-Jen Cheng

Inventor： Jackel Tzeng ,  Roger Hsieh ,  Duen-Jen Cheng

IPC: G01K7/18 ,  H01C7/10 ,  H01C17/00

CPC classification number: H01C17/006 ,  G01K7/183 ,  H01C7/10 ,  Y10T29/49082 ,  Y10T29/49085

Abstract: The present invention discloses a surface-mount resistance-temperature-detector (RTD) supported on a substrate. The surface-mount RTD includes a resistive strip disposed on a top surface of the substrate having a substantially linear temperature resistance coefficient (TCR) over a predetermined temperature range for measurement. The surface-mount RTD further includes two top terminals disposed on two opposite end on the top surface of the substrate wherein each of the top terminal connected to one end of the resistive strip. The surface-mount RTD further includes two bottom terminals disposed on a bottom surface of the substrate wherein each of the bottom terminals is disposed below one of the top terminals. The surface-mount RTD further includes two edge conductive plates each disposed on an edge surface of the substrate connected to one of the top terminals to a corresponding bottom terminal below. The surface-mount RTD further includes two surface mount solder electrodes wherein each solder electrode constituting a conductive layer overlying the top terminal, the edge conductive plate and the bottom terminal provided for performing a surface-mount soldering operation thereon. In a preferred embodiment, the surface-mount RTD further includes a passivation protective layer covering and protecting the resistive strip. In a preferred embodiment, the surface-mount RTD further includes two terminal-solder buffer pastes each disposed on top of the top surface terminal under the surface-mount solder electrode for buffering the top terminal and the solder electrode. In a preferred embodiment, the resistive strip is a platinum resistive strip having a temperature coefficient of resistance (TCR) ranging from 3000 to 3900 ppm/.degree.C.

Abstract translation: 本发明公开了一种支撑在基板上的表面安装电阻温度检测器（RTD）。 表面贴装RTD包括设置在基板的顶表面上的电阻条，该电阻条在预定的温度范围内具有基本线性的耐温系数（TCR），用于测量。 表面安装RTD还包括两个顶部端子，其设置在基板的顶表面上的两个相对端上，其中每个顶部端子连接到电阻带的一端。 表面安装RTD还包括设置在基板的底表面上的两个底部端子，其中每个底部端子设置在顶部端子之一的下方。 表面安装RTD还包括两个边缘导电板，每个边缘导电板设置在连接到顶部端子中的一个的基板的边缘表面上，到下面的相应的底部端子。 表面贴装RTD还包括两个表面贴装焊料电极，其中每个焊料电极构成覆盖顶部端子的导电层，边缘导电板和底部端子，用于在其上执行表面贴装焊接操作。 在优选实施例中，表面安装RTD还包括覆盖并保护电阻带的钝化保护层。 在优选实施例中，表面贴装RTD还包括两个末端焊料缓冲浆料，每个末端焊料缓冲浆料均设置在表面安装焊料电极下面的顶表面端子的顶部，用于缓冲顶部端子和焊料电极。 在优选实施例中，电阻条是具有3000至3900ppm /℃范围内的电阻温度系数（TCR）的铂电阻条。

公开(公告)号：US5850171A

公开(公告)日：1998-12-15

申请号：US692449

申请日：1996-08-05

Applicant: Barry Lin ,  Shih Chang Liao ,  Duen Jen Cheng

Inventor： Barry Lin ,  Shih Chang Liao ,  Duen Jen Cheng

IPC: H01C1/16 ,  H01C13/02 ,  H01L27/08 ,  H05K1/03 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H01C1/01 ,  H01C1/14

CPC classification number: H01C13/02 ,  H01C1/16 ,  H01L27/0802 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/403

Abstract: The present invention discloses a resistive circuit. The resistive circuit includes a plurality of resistor networks disposed on a substrate. The resistor networks also includes a plurality of resistive circuit elements. The resistor networks further includes a plurality of termination contacts each connected to one of the resistive circuit elements. Each of the termination contacts is disposed on an edge of the substrate and each of the termination contacts is separated from a next termination contact by an edge trench disposed on the edge of the substrate whereby a distance across the edge trench defining a pitch between the termination contacts.

Abstract translation: 本发明公开了一种电阻电路。 电阻电路包括设置在基板上的多个电阻网络。 电阻网络还包括多个电阻电路元件。 电阻网络还包括多个终端触点，每个终端触点都连接到电阻电路元件之一。 每个终端触点设置在衬底的边缘上，并且每个终端触点通过设置在衬底的边缘上的边缘沟槽与下一终端触点分开，从而跨越边缘沟槽的距离限定了终端之间的间距 联系人