公开(公告)号：US12074362B2

公开(公告)日：2024-08-27

申请号：US17980128

申请日：2022-11-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungsoo Kim ,  Jaehoon Jo ,  Yongyoun Kim ,  Dongyoung Lee ,  Woomin Jang ,  Seungbum Choi

IPC: H01Q1/24 ,  G01D5/24 ,  G01L1/14 ,  H01Q9/04

CPC classification number: H01Q1/243 ,  G01D5/24 ,  G01L1/142 ,  H01Q9/0407

Abstract: An electronic device is provided. The electronic device includes a housing including a first surface, a second surface opposite to the first surface, and a side surface between the first surface and the second surface, an antenna including a carrier including a first carrier surface facing the side surface, a second carrier surface opposite to the first carrier surface and a plurality of side carrier surfaces between the first carrier surface and the second carrier surface, and a patch positioned on the first carrier surface, a first capacitive sensor positioned between the first carrier surface and the side surface, and a filler positioned between the side surface and the first carrier surface.

公开(公告)号：US11942704B2

公开(公告)日：2024-03-26

申请号：US17584981

申请日：2022-01-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sumin Yun ,  Hosaeng Kim ,  Seongjin Park ,  Woomin Jang ,  Jehun Jong ,  Jaehoon Jo

IPC: H01Q1/24 ,  H01Q1/44 ,  H01Q9/04

CPC classification number: H01Q9/0421 ,  H01Q1/44 ,  H01Q1/243

Abstract: An electronic device is provided that includes a housing, an antenna structure, an electronic component, and a wireless communication circuit. The antenna structure includes a substrate, at least one conductive patch disposed at the substrate, at least one power feeder disposed at a position of the at least one conductive patch, and at least one electrical connection structure. The at least one electrical connection structure includes a first conductive via disposed to pass through the at least one conductive patch and a ground layer of the substrate, and a second conductive via passing through the at least one conductive patch and electrically connected to the ground layer. The electronic component is disposed to overlap at least in part with the at least one conductive patch when the substrate is viewed from above, and is electrically connected to a main board through the at least one electrical connection structure. The wireless communication circuit is electrically connected to the at least one power feeder, and is configured to form a beam pattern in a first direction through the at least one conductive patch.

公开(公告)号：US11942690B2

公开(公告)日：2024-03-26

申请号：US17373888

申请日：2021-07-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sumin Yun ,  Dongyeon Kim ,  Yoonjung Kim ,  Seongjin Park ,  Sehyun Park ,  Myunghun Jeong ,  Jehun Jong ,  Jaehoon Jo

IPC: H01Q21/06 ,  G06F3/041 ,  H01Q1/24 ,  H01Q3/36 ,  H01Q5/30

CPC classification number: H01Q21/065 ,  G06F3/0412 ,  H01Q1/243 ,  H01Q3/36 ,  H01Q5/30

Abstract: An electronic device may include a housing including a first plate facing a first direction, a second plate facing a second direction opposite the first direction, and a side housing surrounding a space between the first plate and the second plate, wherein the side housing includes a first portion, including an external metal portion having a first face facing an outside and a second face facing the space and an internal polymer portion having a third face contacting the second face and a fourth face facing the space, a touch screen display positioned within the space to be viewable through the first plate, wherein an edge of the touch screen display is spaced apart from the first portion of the side housing and when the first plate is viewed from above, the gap is covered by a peripheral portion of the first glass plate, an antenna structure comprising at least one antenna and configured to include a substrate having a fifth face substantially parallel to the second face and a sixth face facing a direction opposite the fifth face and at least one conductive pattern positioned between the fifth face and the sixth face and extending toward the peripheral portion of the first plate, and wireless communication circuitry operatively connected to the at least one conductive pattern and configured to form a directivity beam using at least a part of the at least one conductive pattern.

公开(公告)号：US11533815B2

公开(公告)日：2022-12-20

申请号：US17464120

申请日：2021-09-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongyeon Kim ,  Seongjin Park ,  Sehyun Park ,  Myunghun Jeong ,  Jehun Jong ,  Jaehoon Jo ,  Yoonjung Kim ,  Gyubok Park

IPC: H05K5/02 ,  H05K5/00 ,  H05K7/14

Abstract: An electronic device in provided, including an antenna using a horn structure capable of using at least a portion of a metal member as a signal waveguide structure of the antenna. The device includes a housing, a display, a printed circuit board, and at least one wireless communication circuit, where a waveguide hole is provided to connect at least a portion of a through hole and an electronic component and is used as an operating channel of the electronic component together with the waveguide hole.

公开(公告)号：US11342660B2

公开(公告)日：2022-05-24

申请号：US16870160

申请日：2020-05-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jehun Jong ,  Dongyeon Kim ,  Hosaeng Kim ,  Seongjin Park ,  Sumin Yun ,  Myunghun Jeong ,  Jaehoon Jo ,  Jinwoo Jung ,  Jaebong Chun

IPC: H01Q15/02 ,  H01Q1/42 ,  H01Q3/26 ,  H01Q9/04 ,  H01Q21/06

Abstract: An electronic device is provided. The electronic device includes a housing including a front plate, a rear plate facing away from the front plate, and a side member attached to the front plate or integrated with the rear plate, and surrounding a space between the front and rear plates, an antenna device disposed inside the housing and including stacked first to fourth layers, and a wireless communication circuit electrically coupled to the antenna element. The first layer includes a ground, the second layer includes at least one antenna element and a dielectric adjacent to the at least one antenna element, the third layer includes a first area with a first periodic structure of first conductive cells and a second area at least partially surrounded by the first area, and the fourth layer includes a third area with a second periodic structure of second conductive cells and a fourth area at least partially surrounded by the third area.

公开(公告)号：US11276926B2

公开(公告)日：2022-03-15

申请号：US16812766

申请日：2020-03-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sumin Yun ,  Dongyeon Kim ,  Seongjin Park ,  Woomin Jang ,  Myunghun Jeong ,  Jehun Jong ,  Jaehoon Jo

IPC: H01Q1/24 ,  H01Q1/52 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/50 ,  H01Q15/00 ,  H01Q21/00 ,  H01Q21/06

Abstract: An electronic device is provided. The electronic device includes a housing including a first plate, a second plate facing a direction opposite to the first plate, and a lateral member surrounding a space between the first and second plates and connected to or integrally formed with the second plate. The electronic device further includes a display disposed in the space so as to be visible from outside through at least a part of the first plate, and at least one antenna structure disposed in the space, including a first surface and a second surface facing a direction opposite to the first surface, and including a first area and a second area surrounded by the first area when viewed from above the first surface. The antenna structure may also include a plurality of insulating layers disposed between the first and second surfaces, first conductive patches disposed in the first area, when viewed from above the first surface, and disposed on the first surface or on a first insulating layer closer to the first surface than the second surface, a second conductive patch overlapped at least in part with the second area, when viewed from above the first surface, and disposed on a second insulating layer between the first insulating layer and the second surface, a ground layer disposed on a third insulating layer between the second insulating layer and the second surface or on the second surface, and one or more conductive walls formed along at least a portion of an outer periphery of the first area, when viewed from above the first surface, and extended from the first insulating layer to the ground layer. The electronic device includes at least one wireless communication circuit electrically connected to the second conductive patch and configured to at least one of transmit or receive a signal having a frequency between about 3 GHz and about 100 GHz.

公开(公告)号：US11276916B2

公开(公告)日：2022-03-15

申请号：US16750541

申请日：2020-01-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongyeon Kim ,  Ahmed Hussain ,  Seongjin Park ,  Sehyun Park ,  Sumin Yun ,  Woomin Jang ,  Myunghun Jeong ,  Jehun Jong ,  Jaehoon Jo

IPC: H01Q13/10 ,  H01Q9/04 ,  H01Q1/38 ,  H01Q1/24

Abstract: An electronic device is provided. The electronic device includes a housing, a display exposed through at least part of the first plate, an antenna structure body disposed inside the housing and including a first surface facing the non-conductive portion and a second surface facing away from the first surface, a spacer structure coupled to the first surface or integrally formed with the antenna structure body to protrude from the first surface without overlapping with the conductive pattern when viewed from above the first surface, and a wireless communication circuit electrically connected to the conductive pattern and configured to transmit or receive a signal. At least part of the first plate, the second plate, or the side member includes a non-conductive portion. The antenna structure body includes at least one conductive pattern disposed between the first surface and the second surface or on the first surface.

公开(公告)号：US11088438B2

公开(公告)日：2021-08-10

申请号：US16676824

申请日：2019-11-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongjin Park ,  Dongyeon Kim ,  Sehyun Park ,  Sumin Yun ,  Woomin Jang ,  Myunghun Jeong ,  Jehun Jong ,  Jinwoo Jung ,  Jaehoon Jo

IPC: H01Q1/24 ,  H01Q13/16 ,  H01Q21/30 ,  H01Q21/06

Abstract: An electronic device is provided. The electronic device includes a housing including a first plate, a second plate directed in an opposite direction to the first plate, and a side member surrounding a space between the first plate and the second plate and being combined with or being integrally formed with the second plate, a display configured to be seen through at least a part of the first plate, an antenna structure arranged inside the housing, the antenna structure including a first conductive layer including a first region including a first U-shaped slot and a second region coming in contact with the first region, and a second conductive layer facing the first conductive layer to be spaced apart from the first conductive layer, and including a third region including a second U-shaped slot facing the first U-shaped slot and a fourth region coming in contact with the third region and facing the second region, and at least one wireless communication circuitry electrically connected to the first conductive layer or the second conductive layer and configured to transmit and/or receive a signal having a frequency in a range of 3 GHz to 100 GHz. Other various embodiments are possible.

公开(公告)号：US11024943B2

公开(公告)日：2021-06-01

申请号：US16884513

申请日：2020-05-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongjin Park ,  Dongyeon Kim ,  Hosaeng Kim ,  Sumin Yun ,  Myunghun Jeong ,  Jehun Jong ,  Jaehoon Jo

IPC: H01Q1/24 ,  H01Q9/04 ,  H01Q9/16 ,  H01Q1/38

Abstract: An electronic device including a housing, a display, an antenna structure positioned inside the housing, and a wireless communication circuit connected to the antenna structure, is provided. The antenna structure includes a dipole antenna element interposed between s-patch elements not to overlap with s-patch elements.