公开(公告)号：US20170347459A1

公开(公告)日：2017-11-30

申请号：US15536851

申请日：2015-12-21

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Kazuhiro MIYATA ,  Issei OKADA ,  Takashi KASUGA ,  Yoshio OKA ,  Yasuhiro OKUDA ,  Jinjoo PARK ,  Hiroshi UEDA ,  Kousuke MIURA

IPC: H05K3/02 ,  H05K3/12 ,  H05K1/09 ,  H05K3/24 ,  H05K1/03

CPC classification number: H05K1/092 ,  C09D11/52 ,  H05K1/03 ,  H05K1/0346 ,  H05K1/09 ,  H05K1/097 ,  H05K3/022 ,  H05K3/064 ,  H05K3/102 ,  H05K3/1208 ,  H05K3/245 ,  H05K3/246 ,  H05K2201/0154 ,  H05K2201/0347 ,  H05K2203/072 ,  H05K2203/1131 ,  H05K2203/1157

Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive layer formed on at least one of surfaces of the base film. In the substrate for a printed circuit board, at least the conductive layer contains titanium in a dispersed manner. The conductive layer preferably contains copper or a copper alloy as a main component. A mass ratio of titanium in the conductive layer is preferably 10 ppm or more and 1,000 ppm or less. The conductive layer is preferably formed by application and heating of a conductive ink containing metal particles. The conductive ink preferably contains titanium or a titanium ion. The metal particles are preferably obtained by a titanium redox process including reducing metal ions using trivalent titanium ions as a reducing agent in an aqueous solution by an action of the reducing agent.

公开(公告)号：US20170099732A1

公开(公告)日：2017-04-06

申请号：US15127203

申请日：2015-03-26

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Takashi KASUGA ,  Yoshio OKA ,  Jinjoo PARK ,  Sumito UEHARA ,  Kousuke MIURA ,  Hiroshi UEDA

IPC: H05K1/09 ,  H05K3/24 ,  H05K3/12

CPC classification number: H05K1/097 ,  H05K1/092 ,  H05K3/12 ,  H05K3/246 ,  H05K3/4069 ,  H05K2201/032

Abstract: A substrate for a printed circuit board according to the present invention includes a base film having an insulating property and including at least one opening; a first conductive layer that is formed on both surfaces of the base film by applying and heat-treating a conductive ink containing metal particles, and that fills the at least one opening; and a second conductive layer formed, by plating, on at least one of surfaces of the first conductive layer. The metal particles preferably have a mean particle size of 1 nm or more and 500 nm or less.