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公开(公告)号：US11950378B2
公开(公告)日：2024-04-02
申请号：US17401810
申请日：2021-08-13
发明人： Sergio Ramirez , Benjamin Norris , Paul Diehl , Chris Cuda
CPC分类号： H05K3/462 , G01R3/00 , H01R12/523 , H05K3/0032 , H05K3/4069 , H05K3/4638 , H05K2203/068 , H05K2203/1131
摘要： A method for attaching two electronics boards, e.g., a testing PCB and a space transformer, comprises rack welding resin prepreg and a mylar film to a testing PCB; laser drilling via holes in the resin prepreg and mylar film such that the holes are aligned on one side of the resin prepreg with connection/capture pads on the testing PCB and aligned (after attachment) on the other side of the resin prepreg with connection capture pads on a space transformer, filling the via holes with sintering paste; applying a pressure treatment to remove air, bubbles, and voids from the sintering paste; removing the mylar film; and using a lamination press cycle to attach a space transformer to the resin prepreg.
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公开(公告)号：US11937381B2
公开(公告)日：2024-03-19
申请号：US17309699
申请日：2019-12-30
发明人： Ankit Mahajan , Mikhail L Pekurovsky , Saagar A. Shah , Kayla C. Niccum , Kara A. Meyers , Christopher G. Walker
IPC分类号： H05K3/32 , H01L21/48 , H01L23/00 , H01L23/498 , H01R12/62 , H05K3/12 , H05K3/36 , H05K3/40 , H01R4/04
CPC分类号： H05K3/321 , H01L21/486 , H01L23/49827 , H01L23/4985 , H01L24/32 , H01R12/62 , H05K3/1258 , H05K3/1283 , H05K3/361 , H05K3/4069 , H01L2224/32235 , H01R4/04 , H05K2203/1545
摘要： A method for manufacturing an electronic device includes providing a substrate with a first major surface having a microchannel, wherein the microchannel has a first end and a second end; dispensing a conductive liquid in the microchannel to cause the conductive liquid to move, primarily by capillary pressure, in a first direction toward the first end of the microchannel and in a second direction toward the second end of the microchannel; and solidifying the conductive liquid to form an electrically conductive trace electrically connecting a first electronic device at the first end of the microchannel to a second electronic device at the second end of the microchannel.
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公开(公告)号：US11856713B2
公开(公告)日：2023-12-26
申请号：US17471219
申请日：2021-09-10
发明人： Masanori Okamoto , Takeshi Osuga
IPC分类号： H05K1/02 , H05K1/03 , H05K1/11 , H05K3/00 , H05K3/12 , H05K3/40 , H05K3/16 , H01L23/12 , H01L23/528 , H01L23/538 , H01L23/488 , H05K3/46
CPC分类号： H05K3/4632 , H05K3/4069 , H05K3/4614 , H05K2201/0129
摘要： A multilayer resin substrate includes a stacked body including resin layers stacked on each other, a first planar conductor on a resin layer, and an interlayer connection conductor on a resin layer. The interlayer connection conductor includes a first interlayer connection conductor connected to an external conductor, and a second interlayer connection conductor bonded to the first interlayer connection conductor and a planar conductor. The first and second interlayer connection conductors are made of different materials. The second interlayer connection conductor includes a constricted portion including a smaller planar cross-sectional area than a different portion, between a bonding portion to which the first interlayer connection conductor is bonded and a bonding portion to which the planar conductor is bonded.
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公开(公告)号：US20180242464A1
公开(公告)日：2018-08-23
申请号：US15756745
申请日：2016-08-08
申请人： DENSO CORPORATION
CPC分类号： H05K3/462 , H01L21/4857 , H01L21/486 , H01L23/49822 , H01L23/49838 , H01L24/16 , H01L24/48 , H01L2224/16227 , H01L2224/48227 , H05K1/0271 , H05K1/113 , H05K1/115 , H05K1/116 , H05K3/0014 , H05K3/4069 , H05K3/4617 , H05K3/4623 , H05K3/4638 , H05K2201/09454 , H05K2201/09527 , H05K2201/09627 , H05K2201/09709 , H05K2201/09827
摘要： Before a laminated body is subjected to hot pressing, at least two or more land electrodes are displaced from each other as viewed in the lamination direction, whereby at least two or more gaps disposed in the lamination direction are displaced from each other as viewed in the lamination direction. The hot pressing on the laminated body causes resin materials that compose resin films to flow and fill the gaps in the laminated body. Consequently, the planarity of a multilayer substrate can be improved to a greater extent than in a case where a plurality of gaps disposed in the lamination direction is located at the same position as viewed in the lamination direction.
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公开(公告)号：US20180233429A1
公开(公告)日：2018-08-16
申请号：US15952279
申请日：2018-04-13
发明人： Kuniaki YOSUI , Takahiro BABA , Yoshiyuki MASHIMO
IPC分类号： H01L23/367 , H01L23/538 , H01L23/00
CPC分类号： H01L23/3675 , H01L23/12 , H01L23/36 , H01L23/3677 , H01L23/4334 , H01L23/5383 , H01L23/5389 , H01L24/24 , H01L24/25 , H01L24/32 , H01L24/33 , H01L24/73 , H01L25/0655 , H01L25/105 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/16227 , H01L2224/19 , H01L2224/2402 , H01L2224/24141 , H01L2224/24265 , H01L2224/25171 , H01L2224/32057 , H01L2224/32227 , H01L2224/32245 , H01L2224/33051 , H01L2224/33519 , H01L2224/73267 , H01L2225/1035 , H01L2924/15311 , H01L2924/19105 , H05K1/0204 , H05K1/021 , H05K1/141 , H05K1/186 , H05K3/4069 , H05K3/4632 , H05K3/4697 , H05K2201/10416
摘要： A multilayer board includes a base including insulating layers stacked in a stacking direction, and a mounting surface at an end of the base in a first direction along the stacking direction, an electronic component inside the base, and a first heat dissipator extending through at least one of the insulating layers from a surface of the electronic component located at an end of the electronic component in the first direction to the mounting surface. When a section of the first heat dissipator is defined as a first section, and a section of the first heat dissipator located farther in a second direction along the layer stacking direction than the first section is defined as a second section, there is a combination of a first section and a second section in which the second section extends farther outward than the first section when viewed from the layer stacking direction.
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公开(公告)号：US10021785B2
公开(公告)日：2018-07-10
申请号：US14966442
申请日：2015-12-11
发明人： Myung-Sam Kang , Young-Gwan Ko , Sang-Hoon Kim , Kang-Wook Bong , Hye-Won Jung , Yong-Wan Ji
CPC分类号： H05K1/113 , H05K3/0023 , H05K3/4069 , H05K3/4644 , H05K2203/0502 , H05K2203/0514
摘要： A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first circuit layer disposed on an upper surface of a substrate, an insulating layer disposed on the substrate and the first circuit layer, a second circuit layer disposed on an upper surface of the insulating layer, and a via configured to connect between the first circuit layer and the second circuit layer, and a lower part of the via is in contact with the upper surface of the substrate.
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公开(公告)号：US20180139855A1
公开(公告)日：2018-05-17
申请号：US15580078
申请日：2016-06-22
发明人： Matthew S. Stay , Shawn C. Dodds , Ann M. Gilman , Mikhail L. Pekurovsky , Daniel J. Theis , Matthew R. D. Smith
CPC分类号： H05K3/4679 , G06F3/041 , G06F2203/04102 , G06F2203/04103 , H05K1/0274 , H05K1/028 , H05K1/0283 , H05K1/0393 , H05K1/097 , H05K1/115 , H05K3/0091 , H05K3/0097 , H05K3/10 , H05K3/4038 , H05K3/4069 , H05K3/4644 , H05K3/4664 , H05K2201/026 , H05K2203/1173 , H05K2203/1545 , H05K2203/166
摘要： A composite article includes a conductive layer with nanowires on at least a portion of a flexible substrate, wherein the conductive layer has a conductive surface. A patterned layer of a low surface energy material is on a first region of the conductive surface. An overcoat layer free of conductive particulates is on a first portion of a second region of the conductive surface unoccupied by the patterned layer. A via is in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer. A conductive material is in the via to provide an electrical connection to the conductive surface.
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公开(公告)号：US09918381B2
公开(公告)日：2018-03-13
申请号：US14588614
申请日：2015-01-02
发明人： Satoru Noda
IPC分类号： H05K1/18 , H05K1/02 , H01L23/498 , H01L23/50 , H05K3/28 , H05K3/46 , H05K1/03 , H05K3/34 , H05K3/40
CPC分类号： H05K1/0271 , H01L23/49822 , H01L23/50 , H01L2224/16 , H01L2224/16227 , H01L2924/3511 , H05K1/036 , H05K1/0373 , H05K1/186 , H05K3/284 , H05K3/3442 , H05K3/4069 , H05K3/4602 , H05K3/4623 , H05K3/4626 , H05K3/4652 , H05K3/4673 , H05K2201/0195 , H05K2201/0209 , H05K2201/0269 , H05K2201/0347 , H05K2201/09136 , H05K2201/10636 , H05K2203/0126 , H05K2203/0465 , H05K2203/085 , H05K2203/1316 , H05K2203/1322 , Y02P70/611
摘要： A component-embedded substrate includes a substrate portion, an embedded electronic component, and a resin portion. The substrate portion has inner electrodes on an inner principal surface. The embedded electronic component has terminal electrodes and is mounted to the substrate portion via solder fillets adhering to the respective terminal electrodes and the respective inner electrodes. The resin portion is stacked on the substrate portion, with the embedded electronic component embedded therein. The resin portion includes a no-filler-added layer and a filler-added layer. The no-filler-added layer extends from the inner principal surface to a height which allows at least the solder fillets to be covered. The filler-added layer contains an inorganic filler and extends from an interface with the no-filler-added layer to a height which allows at least the embedded electronic component to be covered.
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9.发明申请公开(公告)号：US20170367197A1
公开(公告)日：2017-12-21
申请号：US15691866
申请日：2017-08-31
申请人： NIPPON MEKTRON, LTD.
发明人： Shoji Takano , Fumihiko Matsuda
CPC分类号： H05K3/4069 , H05K1/0298 , H05K1/092 , H05K1/115 , H05K3/06 , H05K3/4617 , H05K3/4623 , H05K2201/0355 , H05K2203/1383 , Y10T29/49128 , Y10T29/49165
摘要： A wiring substrate is manufactured by attaching an adhesive protective film to a metal-foiled laminate sheet, forming bottomed via holes by partially removing the film and an insulating film, filling conductive pastes into the holes, and peeling the film. A wiring substrate is manufactured by forming an adhesive protective layer so as to cover a patterned metal foil on a metal-foiled laminate sheet, forming bottomed step via holes by partially removing the layer and an insulating film, filling conductive pastes into the holes, and peeling off a protective film. The wiring substrate and the second wiring substrate are laminated in such a way that protruding parts of the pastes come into contact with respective protruding parts of the pastes.
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公开(公告)号：US20170135215A1
公开(公告)日：2017-05-11
申请号：US15346847
申请日：2016-11-09
发明人： Bashir I. Morshed
IPC分类号： H05K1/18 , H05K1/11 , H05K3/40 , H05K3/46 , H05K1/03 , H05K3/12 , H05K1/09 , H05K1/02 , H05K3/30
CPC分类号： H05K1/181 , H05K1/028 , H05K1/0353 , H05K1/0393 , H05K1/097 , H05K1/113 , H05K1/118 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/125 , H05K3/303 , H05K3/4007 , H05K3/4053 , H05K3/4069 , H05K3/4664 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10106 , H05K2201/10143 , H05K2201/10151 , H05K2201/10166 , H05K2201/10174 , H05K2203/0759 , H05K2203/1131
摘要： A multilayer printed circuit as well as printed passive and active electronic components using additive printing technology is provided. The fabrication process includes a substrate and a first conductive layer that is printed with conductive ink on the substrate. An insulation layer that has uniform thickness is printed on the first conductive layer and the substrate, less via cavities, test point cavities, and a surface mount component contact point and mounting cavities. The insulation layer is replaceable with resistive layer or semi-conductive layer to fabricate electronic components. The vias are printed with conductive ink inside of the via cavities. Additionally, a second conductive layer is printed on the vias and over the insulation layer. The insulation, resistive, or semi-conducting layer, the vias, and the conductive layers are repeatedly printed in sequence to thus form the multilayer printed circuit.
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