公开(公告)号：US20210096967A1

公开(公告)日：2021-04-01

申请号：US16865948

申请日：2020-05-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yonghyuk Choi ,  Sangwan Nam ,  Jaeduk Yu ,  Sangwon Park ,  Bongsoon Lim

IPC: G06F11/20 ,  G11C16/04 ,  G11C16/08

Abstract: A nonvolatile memory device includes a first semiconductor layer, a second semiconductor layer and a control circuit. The memory cell array includes a first vertical structure on the first upper substrate and a second vertical structure on the second upper substrate, the first vertical structure includes first sub-blocks and the second vertical structure includes second sub-blocks. The second semiconductor layer includes a lower substrate that includes address decoders and page buffer circuits. The first vertical structure includes first via areas in which one or more through-hole vias are provided, through-hole vias pass through the first vertical structure. The first sub-blocks are arranged among the first via areas and the second sub-blocks are arranged among the second via areas. The control circuit groups the memory blocks into a plurality of groups based on whether the memory blocks is close to the first via areas and performs address re-mapping.

公开(公告)号：US20210065806A1

公开(公告)日：2021-03-04

申请号：US16935535

申请日：2020-07-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yonghyuk Choi ,  Jae-Duk Yu ,  Kang-Bin Lee ,  Sang-Won Shim ,  Bongsoon Lim

IPC: G11C16/10 ,  G11C16/04 ,  G11C16/08 ,  G11C16/34 ,  H01L25/065 ,  H01L25/18 ,  H01L23/00 ,  H01L27/11556 ,  H01L27/11582

Abstract: Each of memory blocks of a nonvolatile memory device includes a memory cell region including first metal pads, first memory cells of a first portion of pillar, and second memory cells of a second portion of the pillar, and a peripheral circuit region including second metal pads, a row decoder, and a page buffer. When performing program operations based on consecutive addresses at a memory block selected from the memory blocks, the nonvolatile memory device sequentially completes first program operations of non-adjacent memory cells not adjacent to a boundary of the first portion and the second portion from among the first and second memory cells and then completes a second program operation of an adjacent memory cell adjacent to the boundary. The peripheral circuit region is vertically connected to the memory cell region by the first metal pads and the second metal pads directly.