公开(公告)号：US20200058687A1

公开(公告)日：2020-02-20

申请号：US16664091

申请日：2019-10-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yun Ki Lee

IPC: H01L27/146 ,  H04N5/361

Abstract: An image sensor includes a substrate including a light-receiving region and a light-shielding region, a device isolation pattern in the substrate of the light-receiving region to define active pixels, and a device isolation region in the substrate of the light-shielding region to define reference pixels. An isolation technique of the device isolation pattern is different from that of the device isolation region.

公开(公告)号：US10418403B2

公开(公告)日：2019-09-17

申请号：US16026265

申请日：2018-07-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yun Ki Lee ,  Minwook Jung

IPC: H01L27/146 ,  H01L29/06

Abstract: An image sensor includes a substrate including a plurality of pixel regions and having a trench between the pixel regions, a photoelectric conversion part in the substrate of each of the pixel regions, and a device isolation pattern in the trench. The device isolation pattern defines an air gap. The device isolation pattern has an intermediate portion and an upper portion narrower than the intermediate portion.

公开(公告)号：US09520423B2

公开(公告)日：2016-12-13

申请号：US14966587

申请日：2015-12-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yun Ki Lee ,  Joonkyoung Lee

IPC: H01L27/00 ,  H01L27/146

CPC classification number: H01L27/14645 ,  H01L27/14605 ,  H01L27/14607 ,  H01L27/14609 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/1463 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464

Abstract: An image sensor includes a substrate including a first surface and a second surface, a first device isolation layer disposed in the substrate and defining a plurality of pixels in the substrate, and having a lower surface adjacent the first surface of the substrate and an upper surface adjacent the second surface of the substrate. Each of the pixels includes a photoelectric conversion element, a floating diffusion region adjacent the first surface of the substrate, and a grid pattern on the second surface of the substrate. At least one of the grid patterns is not vertically aligned with the first device isolation layer.

Abstract translation: 图像传感器包括：衬底，包括第一表面和第二表面;第一器件隔离层，设置在衬底中并限定衬底中的多个像素，并且具有邻近衬底的第一表面的下表面; 邻近衬底的第二表面。 每个像素包括光电转换元件，与衬底的第一表面相邻的浮动扩散区域和在衬底的第二表面上的栅格图案。 栅格图案中的至少一个不与第一器件隔离层垂直对准。

公开(公告)号：US20250056909A1

公开(公告)日：2025-02-13

申请号：US18932805

申请日：2024-10-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bomi Kim ,  BumSuk Kim ,  Jung-Saeng Kim ,  Yun Ki Lee ,  Taesub Jung

IPC: H01L27/146 ,  H04N25/40

Abstract: Image sensors are provided. The image sensors may include a plurality of unit pixels and a color filter array on the plurality of unit pixels. The color filter array may include a color filter unit including four color filters that are arranged in a two-by-two array, and the color filter unit may include two yellow color filters, a cyan color filter, and one of a red color filter or a green color filter.

公开(公告)号：US20250048757A1

公开(公告)日：2025-02-06

申请号：US18790612

申请日：2024-07-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyungeun Yoo ,  Dongmin Keum ,  Jung-Saeng Kim ,  Bumsuk Kim ,  Yun Ki Lee

IPC: H01L27/146 ,  H04N25/77 ,  H04N25/78

Abstract: An image sensor is provided. The image sensor image sensor includes: a first pixel group including a first pixel, a second pixel, a third pixel and a fourth pixel; a second pixel group including a fifth pixel, a sixth pixel, a seventh pixel and an eighth pixel, wherein the second pixel group is provided adjacent to the first pixel in a first direction; a first lens corresponding to the first pixel and the second pixel; a second lens corresponding to the third pixel and the fourth pixel; a device isolation pattern electrically isolating the first pixel group from the second pixel group; and a readout circuit configured to: output phase data based on at least a portion of phase signals received from the first pixel group; and output image data based on at least a portion of color signals received from the second pixel group.

公开(公告)号：US12211874B2

公开(公告)日：2025-01-28

申请号：US17550294

申请日：2021-12-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae Han Kim ,  Dong Min Keum ,  Bum Suk Kim ,  Yun Ki Lee

IPC: H01L27/146 ,  H04N25/704

Abstract: An image sensor includes different first and second focus pixels in a substrate; a first adjacent pixel in the substrate and adjacent to the first focus pixel in a positive first direction, a pixel being absent between the first focus pixel and the first adjacent pixel; a first micro-lens covering the first adjacent pixel; a second adjacent pixel in the substrate and adjacent to the second focus pixel in a positive first direction, a pixel being absent between the second focus pixel and the second adjacent pixel; and a second micro-lens covering the second adjacent pixel, and an area of the first micro-lens being different from an area of the second micro-lens.

公开(公告)号：US20250022896A1

公开(公告)日：2025-01-16

申请号：US18430333

申请日：2024-02-01

Applicant: Samsung Electronics Co., LTD

Inventor： Junsung Park ,  Jonghoon Park ,  Yun Ki Lee

IPC: H01L27/146

Abstract: An image sensor includes: a semiconductor substrate including a pixel array region, the pixel array region including a center pixel region and an edge pixel region enclosing the center pixel region in a plan view; color filter groups on the pixel array region, each color filter group of the color filter groups including color filters arranged in a same number of rows and columns; and micro lenses covering the color filter groups, respectively, wherein the color filter groups include center color filter groups on the center pixel region and edge color filter groups on the edge pixel region, and at least two color filters of the color filters in each of the edge color filter groups have thicknesses that are different from each other.

公开(公告)号：US20240170522A1

公开(公告)日：2024-05-23

申请号：US18491204

申请日：2023-10-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chulsoo Choi ,  Bumsuk Kim ,  Yun Ki Lee ,  Junghun Kim ,  Jonghoon Park

IPC: H01L27/146

CPC classification number: H01L27/1463 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14636

Abstract: An image sensor includes a substrate having a first surface and a second surface which are opposite to each other, the substrate comprising a plurality of pixel regions arranged in a first direction and a second direction which are parallel to the first surface and intersect each other, a deep device isolation pattern extending into the substrate and between the plurality of pixel regions, and a color separating lens array on the second surface of the substrate. The color separating lens array includes a spacer layer on the second surface of the substrate, and a plurality of nano-posts horizontally spaced apart from each other on the spacer layer.

公开(公告)号：US11894409B2

公开(公告)日：2024-02-06

申请号：US17409048

申请日：2021-08-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yun Ki Lee ,  Jong Hoon Park ,  Jun Sung Park

IPC: H01L27/146 ,  H10K59/13

CPC classification number: H01L27/1464 ,  H01L27/1461 ,  H01L27/1463 ,  H01L27/14612 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14645 ,  H10K59/13

Abstract: In some example embodiments, a back side illumination (BSI) image sensor may include a pixel configured to generate electrical signals in response to light incident on a back side of a substrate. In some example embodiments, the pixel includes, a photodiode, a device isolation film adjacent to the photodiode, a dark current suppression layer above the photodiode, a light shield grid above the photodiode and including an opening area of 1 to 15% of an area of the pixel, a light shielding filter layer above the light shield grid, a planarization layer above the light shielding filter layer, a lens above the planarization layer, and/or an anti-reflective film between the photodiode and the lens.

公开(公告)号：US20240014235A1

公开(公告)日：2024-01-11

申请号：US18470972

申请日：2023-09-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yun Ki Lee ,  Jung-Saeng Kim ,  Hyungeun Yoo

IPC: H01L27/146

CPC classification number: H01L27/14623 ,  H01L27/1463 ,  H01L27/14643 ,  H01L27/14636 ,  H01L27/14621 ,  H01L27/14685 ,  H01L27/14627 ,  H01L27/14612

Abstract: An image sensor includes a semiconductor layer including a first section and a second section, the semiconductor layer having a first surface and a second surface that face each other, a device isolation layer in the semiconductor layer and defining a plurality of pixels; a first grid pattern on the first surface of the semiconductor layer over the first section; and a light-shield pattern on the first surface of the semiconductor layer over the second section. A top surface of the first grid pattern is located at a first level, a top surface of the light-shield pattern is located at a second level, the first level is lower than the second level, and the first and second levels are defined with respect to the first surface of the semiconductor layer.