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    SELF-BALLASTED LAMP AND LIGHTING EQUIPMENT
    31.
    发明申请
    SELF-BALLASTED LAMP AND LIGHTING EQUIPMENT 审中-公开
    自封灯和照明设备

    公开(公告)号：US20100327751A1

    公开(公告)日：2010-12-30

    申请号：US12825956

    申请日：2010-06-29

    申请人： Erika Takenaka ,  Shigeru Osawa ,  Yusuke Shibahara ,  Takeshi Hisayasu ,  Kazuto Morikawa ,  Tomohiro Sanpei ,  Mokoto Sakai

    发明人： Erika Takenaka ,  Shigeru Osawa ,  Yusuke Shibahara ,  Takeshi Hisayasu ,  Kazuto Morikawa ,  Tomohiro Sanpei ,  Mokoto Sakai

    IPC分类号： H01J13/32 ,  H05B37/02

    CPC分类号： F21V23/002 ,  F21K9/232 ,  F21K9/233 ,  F21V3/061 ,  F21V3/062 ,  F21V29/773 ,  F21Y2115/10

    摘要： The present invention provides a self-ballasted lamp which efficiently conducts heat of a plurality of LED chips of a light emitting module to its holder, and can prevent the temperature rise of the LED chips. The holder has a base portion, an edge portion provided at one end side of the base portion, which is thick at the base portion side thereof and thin at the distal end side thereof, and heat radiation fins provided at the other end side from the edge part and at the circumference of the base portion. The heat from the semiconductor light emitting elements is conducted from the base portion to the edge part and radiated therefrom. At this time, the edge part is thickened at the base portion side, wherein the thermal capacity is increased, and the heat conduction is improved.

    摘要翻译： 本发明提供了一种自发镇流灯，其有效地将发光模块的多个LED芯片的热量传导到其保持器，并且可以防止LED芯片的温度升高。 保持器具有基部，设置在基部的一端侧的边缘部，其基部侧较厚，其前端侧较薄，并且设置在另一端侧的散热片 边缘部分和基部的圆周处。 来自半导体发光元件的热量从基部传导到边缘部分并从其辐射。 此时，边缘部分在基部侧增厚，其中热容量增加，并且热传导得到改善。

    LAMP DEVICE AND LIGHTING APPARATUS
    33.
    发明申请
    LAMP DEVICE AND LIGHTING APPARATUS 审中-公开
    灯具和照明设备

    公开(公告)号：US20130170233A1

    公开(公告)日：2013-07-04

    申请号：US13496869

    申请日：2011-07-15

    申请人： Kenji Nezu ,  Shigeru Osawa ,  Yuichiro Takahara ,  Takeshi Osada ,  Toshifumi Masuda ,  Hiromichi Nakajima

    发明人： Kenji Nezu ,  Shigeru Osawa ,  Yuichiro Takahara ,  Takeshi Osada ,  Toshifumi Masuda ,  Hiromichi Nakajima

    IPC分类号： F21V15/01

    CPC分类号： F21V15/01 ,  F21K9/20 ,  F21S8/02 ,  F21V23/004 ,  F21V23/006 ,  F21V29/74 ,  F21Y2115/10 ,  H01R33/465

    摘要： A lamp device 14 includes a light-emitting portion 34 in which a semiconductor light-emitting element is used. The light-emitting portion 34 is arranged on the side of one of surfaces of the housing 16. Provided on the side of the other surface of the housing 16 is a metallic cap portion 44 and a lamp pin 46 projecting from the other surface side of the housing 16. The lighting circuit 21 is stored in the housing 16. Then, the lamp device 14 includes lamp pin mounting portions 73 where the lamp pins are to be mounted and the insulating member 47 having an insulating portion 75 interposed between the inner surface of the cap portion 44 and the lighting circuit 21.

    摘要翻译： 灯装置14包括使用半导体发光元件的发光部34。 发光部分34布置在壳体16的一个表面的侧面上。在壳体16的另一个表面侧设置有金属盖部分44和从另一个表面侧突出的灯销46 照明电路21存储在壳体16中。然后，灯装置14包括灯销安装部分73，其中灯销将被安装，并且绝缘部件47具有插入在内表面之间的绝缘部分 盖部44和点亮电路21。

    LUMINAIRE
    34.
    发明申请
    LUMINAIRE 有权

    公开(公告)号：US20130155701A1

    公开(公告)日：2013-06-20

    申请号：US13497101

    申请日：2011-07-05

    申请人： Shigeru Osawa ,  Takeshi Osada

    发明人： Shigeru Osawa ,  Takeshi Osada

    IPC分类号： F21V29/00

    CPC分类号： F21V29/70 ,  F21K9/20 ,  F21V19/006 ,  F21V23/06 ,  F21V29/004 ,  F21V29/15 ,  F21V29/75 ,  F21V29/773 ,  F21Y2115/10

    摘要： A luminaire 1 of an embodiment has a radiator 3 which comes into surface-contact with a cap abutment surface 6C of a lamp unit 6 and conducts and radiates heat generated by the lamp unit 6, and a terminal board 7 which is attached to the upper side of the radiator 3 on the lateral outside of the cap abutment surface 6C.

    摘要翻译： 实施方式的照明装置1具有散热器3，其与灯单元6的盖抵接面6C进行表面接触，并且导通和照射由灯单元6产生的热;以及端子板7，其附接到上部 散热器3的侧面位于盖邻接表面6C的外侧。

    Luminaire having radiator
    38.
    发明授权
    Luminaire having radiator 有权
    灯具有散热器

    公开(公告)号：US08814399B2

    公开(公告)日：2014-08-26

    申请号：US13497101

    申请日：2011-07-05

    申请人： Shigeru Osawa ,  Takeshi Osada

    发明人： Shigeru Osawa ,  Takeshi Osada

    IPC分类号： F21V7/00

    CPC分类号： F21V29/70 ,  F21K9/20 ,  F21V19/006 ,  F21V23/06 ,  F21V29/004 ,  F21V29/15 ,  F21V29/75 ,  F21V29/773 ,  F21Y2115/10

    摘要： A luminaire 1 of an embodiment has a radiator 3 which comes into surface-contact with a cap abutment surface 6C of a lamp unit 6 and conducts and radiates heat generated by the lamp unit 6, and a terminal board 7 which is attached to the upper side of the radiator 3 on the lateral outside of the cap abutment surface 6C.

    摘要翻译： 实施方式的照明装置1具有散热器3，其与灯单元6的盖抵接面6C进行表面接触，并且导通和照射由灯单元6产生的热;以及端子板7，其附接到上部 散热器3的侧面位于盖邻接表面6C的外侧。

    LAMP UNIT AND LIGHTING FIXTURE
    39.
    发明申请
    LAMP UNIT AND LIGHTING FIXTURE 审中-公开
    灯具和灯具

    公开(公告)号：US20120127741A1

    公开(公告)日：2012-05-24

    申请号：US13298899

    申请日：2011-11-17

    申请人： Takeshi Osada ,  Yuichiro Takahara ,  Shigeru Osawa ,  Toshifumi Masuda ,  Hiromichi Nakajima

    发明人： Takeshi Osada ,  Yuichiro Takahara ,  Shigeru Osawa ,  Toshifumi Masuda ,  Hiromichi Nakajima

    IPC分类号： F21V29/00

    CPC分类号： F21V23/006 ,  F21K9/20 ,  F21K9/68 ,  F21S8/02 ,  F21V7/048 ,  F21V7/09 ,  F21V7/22 ,  F21V19/04 ,  F21V29/00 ,  F21V29/507 ,  F21V29/713 ,  F21V29/773 ,  F21V29/85 ,  F21Y2105/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  F21Y2115/20

    摘要： According to one embodiment, a lamp unit includes a light-emitting module, a housing, a lighting circuit, and a heat conductive sheet. The light-emitting module includes a light emitting portion having a semiconductor light-emitting element formed thereon. The housing includes a case opening in the direction of irradiation of light, and a base on a side of the case opposite from the direction of irradiation of the light. The light-emitting module is mounted on a surface of the base on the case side. A base surface is formed on an outer surface of the base on the side opposite from the case side, and a depressed portion is formed on the base surface. The lighting circuit is accommodated in the housing. The heat conductive sheet allows resilient deformation, and is disposed in the depressed portion.

    摘要翻译： 根据一个实施例，灯单元包括发光模块，壳体，点亮电路和导热片。 发光模块包括在其上形成有半导体发光元件的发光部分。 壳体包括在照射光的方向上的壳体开口，以及位于壳体的与光的照射方向相反的一侧的基部。 发光模块安装在基座的壳体侧的表面上。 在基体的与壳体侧相反的一侧的外表面上形成基面，在基面上形成有凹部。 照明电路容纳在壳体中。 导热片允许弹性变形，并且设置在凹陷部分中。