公开(公告)号：US11742296B2

公开(公告)日：2023-08-29

申请号：US17134925

申请日：2020-12-28

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Wei-Jhen Chen ,  Chih-Hsun Hsu ,  Yuan-Hung Hsu ,  Chih-Nan Lin ,  Chang-Fu Lin ,  Don-Son Jiang ,  Chih-Ming Huang ,  Yi-Hsin Chen

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L23/5386 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3157 ,  H01L23/5381 ,  H01L23/5383 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2224/16227 ,  H01L2924/18161

Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.

公开(公告)号：US11610850B2

公开(公告)日：2023-03-21

申请号：US17160749

申请日：2021-01-28

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsun Hsu ,  Chi-Jen Chen ,  Hsi-Chang Hsu ,  Yuan-Hung Hsu ,  Rui-Feng Tai ,  Don-Son Jiang

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/31 ,  H01L25/00 ,  H01L21/48 ,  H01L21/56

Abstract: An electronic package is provided and includes at least one protective structure positioned between a first electronic element and a second electronic element on a carrier for reducing stresses generated inside the first electronic element and the second electronic element when a filling material is formed on the carrier, encapsulates the protective structure and comes into contact with the first electronic element and the second electronic element, thereby preventing cracking of the first electronic element and the second electronic element and improving the reliability of the electronic package.

公开(公告)号：US20220336323A1

公开(公告)日：2022-10-20

申请号：US17854241

申请日：2022-06-30

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Yuan-Hung Hsu

IPC: H01L23/433 ,  H01L21/48 ,  H01L23/00

Abstract: An electronic package is provided and includes an electronic element, an intermediary structure disposed on the electronic element, and a heat dissipation element bonded to the electronic element through the intermediary structure. The intermediary structure has a flow guide portion and a permanent fluid combined with the flow guide portion so as to be in contact with the electronic element, thereby achieving a preferred heat dissipation effect and preventing excessive warping of the electronic element or the heat dissipation element due to stress concentration.