公开(公告)号：US20230022189A1

公开(公告)日：2023-01-26

申请号：US17866837

申请日：2022-07-18

Applicant: TDK CORPORATION

Inventor： Hokuto EDA ,  Hitoshi OHKUBO ,  Masazumi ARATA ,  Masataro SAITO ,  Kohei TAKAHASHI ,  Takamasa IWASAKI

IPC: H01F27/28 ,  H01F27/32 ,  H01F27/29

Abstract: In a coil component, heat radiation around a through conductor is improved. In the coil component, since the cross-sectional area of the inner end portion of the planar coil is designed to be relatively large, heat generated in the through conductor is easily transferred to the inner end portion. Since heat is efficiently transferred from the through conductor to the inner end portion, high heat radiation around the through conductor is achieved.

公开(公告)号：US20220189682A1

公开(公告)日：2022-06-16

申请号：US17545629

申请日：2021-12-08

Applicant: TDK CORPORATION

Inventor： Masataro SAITO ,  Hokuto EDA ,  Kohei TAKAHASHI ,  Takamasa IWASAKI ,  Masazumi ARATA

IPC: H01F27/29 ,  H01F27/32 ,  H01F17/04

Abstract: By overlapping the protruding portion of the first insulator and the protruding portion of the second insulator via the protruding portion of the substrate, the DC superposition characteristic of the coil component is improved.

公开(公告)号：US20210183566A1

公开(公告)日：2021-06-17

申请号：US17115311

申请日：2020-12-08

Applicant: TDK CORPORATION

Inventor： Hitoshi OHKUBO ,  Miyuki ASAI ,  Masazumi ARATA ,  Hokuto EDA

IPC: H01F27/32 ,  H01F17/04

Abstract: In a coil component, the pressure resistance is improved by main surfaces and of a main body portion being covered with an insulating layer. The main body portion has a surface part, the resin ratio of the surface part is higher than the internal resin ratio, and insulation is enhanced at the surface part. As a result, the pressure resistance on the surface of the main body portion is further improved and the pressure resistance of the entire coil component is further improved.

公开(公告)号：US20210166858A1

公开(公告)日：2021-06-03

申请号：US17108023

申请日：2020-12-01

Applicant: TDK CORPORATION

Inventor： Masataro SAITO ,  Masazumi ARATA ,  Hokuto EDA ,  Kohei TAKAHASHI ,  Takamasa IWASAKI

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32

Abstract: In a coil component, a double coil is configured of a first coil portion and a second coil portion, and a first through conductor of the first coil portion and a second through conductor of the second coil portion are adjacent to each other. Thus, the first coil portion and the second coil portion have enhanced magnetic coupling at locations (that is, the first through conductor and the second through conductor) at which planar coil patterns of upper and lower surfaces of an insulating substrate are connected, in addition to magnetic coupling in the planar coil patterns wound around a through hole. Therefore, according to the coil component, a high coupling coefficient between the first coil portion and the second coil portion is realized.

公开(公告)号：US20200303116A1

公开(公告)日：2020-09-24

申请号：US16811610

申请日：2020-03-06

Applicant: TDK CORPORATION

Inventor： Takahiro KAWAHARA ,  Manabu OHTA ,  Kenei ONUMA ,  Yuuya KANAME ,  Ryo FUKUOKA ,  Hokuto EDA ,  Masataro SAITO ,  Kohei TAKAHASHI

IPC: H01F27/29 ,  H01F17/00 ,  H01F17/04 ,  H01F27/28 ,  H01F41/04 ,  H05K1/18

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

公开(公告)号：US20190013148A1

公开(公告)日：2019-01-10

申请号：US16027639

申请日：2018-07-05

Applicant: TDK CORPORATION

Inventor： Hitoshi OHKUBO ,  Masazumi ARATA ,  Takahiro KAWAHARA ,  Hokuto EDA ,  Hiroki TSUJIAI

IPC: H01F41/04 ,  H01F17/00 ,  H01F27/29 ,  H01F27/28 ,  H01F27/32

Abstract: In a planar coil element, since an overlapping portion of a fourth resin wall of a first conductor pattern protrudes from an end surface of a main body portion, restriction on a width of the overlapping portion is relaxed, and the wide overlapping portion is realized. Therefore, an improvement in a withstand voltage between the second external terminal electrode formed on the end surface and an outermost turn of the first conductor pattern is realized. Similarly, regarding the second conductor pattern, the improvement in the withstand voltage between the first external terminal electrode formed on the end surface and an outermost turn of the second conductor pattern is realized.

公开(公告)号：US20190013145A1

公开(公告)日：2019-01-10

申请号：US16027742

申请日：2018-07-05

Applicant: TDK CORPORATION

Inventor： Hitoshi OHKUBO ,  Masazumi ARATA ,  Takahiro KAWAHARA ,  Hokuto EDA ,  Hiroki TSUJIAI

IPC: H01F27/32 ,  H01F41/04 ,  H01F27/28 ,  H01F27/29

Abstract: In a planar coil element, a dead space in a non-overlapping region is reduced by designing a total width of a first resin wall and a first turn located in the non-overlapping region to be narrow, more specifically, by designing the total width to be narrower than a total width of a second turn outside the first turn and a second resin wall located inside the turn and also than a total width of a third turn on the outer side and a third resin wall located inside the turn. As a result, a volume of a magnetic element body in a magnetic core portion of a coil can be increased, and an, inductance value, which is a magnetic characteristic, can also be improved.