公开(公告)号：US20180286565A1

公开(公告)日：2018-10-04

申请号：US15937313

申请日：2018-03-27

Applicant: TDK CORPORATION

Inventor： Shunji AOKI ,  Yuya ISHIMA ,  Masaki TAKAHASHI ,  Yuki OKAZAKI ,  Takeshi SASAKI

IPC: H01F27/28 ,  H01F41/04

Abstract: An electronic component includes an element body, a conductor provided on the element body, a plating layer provided on the conductor, and a glass layer provided on the conductor along an outer edge of the plating layer.

公开(公告)号：US20180233280A1

公开(公告)日：2018-08-16

申请号：US15895039

申请日：2018-02-13

Applicant: TDK CORPORATION

Inventor： Yuya ISHIMA ,  Shinichi KONDO ,  Shunji AOKI ,  Yasushi MATSUYAMA ,  Yusuke ONEZAWA ,  Hajime AZUMA

IPC: H01F41/04 ,  H01F41/02 ,  H01F27/28

CPC classification number: H01F41/043 ,  B32B37/025 ,  B32B38/0036 ,  B32B2307/202 ,  H01F27/2804 ,  H01F41/02 ,  H01F2027/2809

Abstract: A method for manufacturing a laminated coil component including an element and a conductor configuring a coil in the element includes a step of forming a conductor pattern including a configuration material of the conductor on a first base material by a photolithography method, a step of forming an element pattern including a configuration material of the element on a second base material by a photolithography method, the element pattern being formed such that a shape corresponding to a shape of the conductor pattern has been removed, a step of laminating the conductor pattern and the element pattern in a predetermined direction by repeatedly transferring the conductor pattern and the element pattern onto a support, and a step of performing thermal treatment for a laminate obtained by the step of laminating.