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公开(公告)号：US20180233280A1
公开(公告)日：2018-08-16
申请号：US15895039
申请日：2018-02-13
Applicant: TDK CORPORATION
Inventor： Yuya ISHIMA , Shinichi KONDO , Shunji AOKI , Yasushi MATSUYAMA , Yusuke ONEZAWA , Hajime AZUMA
CPC classification number: H01F41/043 , B32B37/025 , B32B38/0036 , B32B2307/202 , H01F27/2804 , H01F41/02 , H01F2027/2809
Abstract: A method for manufacturing a laminated coil component including an element and a conductor configuring a coil in the element includes a step of forming a conductor pattern including a configuration material of the conductor on a first base material by a photolithography method, a step of forming an element pattern including a configuration material of the element on a second base material by a photolithography method, the element pattern being formed such that a shape corresponding to a shape of the conductor pattern has been removed, a step of laminating the conductor pattern and the element pattern in a predetermined direction by repeatedly transferring the conductor pattern and the element pattern onto a support, and a step of performing thermal treatment for a laminate obtained by the step of laminating.
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公开(公告)号：US20180240591A1
公开(公告)日：2018-08-23
申请号：US15892784
申请日：2018-02-09
Applicant: TDK CORPORATION
Inventor： Yuya ISHIMA , Yasushi MATSUYAMA , Yuto SHIGA , Shunji AOKI , Shinichi KONDO
CPC classification number: H01F41/04 , H01F17/0013 , H01F27/28 , H01F27/292 , H01F27/323
Abstract: An electronic component includes an element provided with a first recess, and a mounting conductor including a first conductor portion disposed in the first recess. The first conductor portion has a first face opposed to a bottom face of the first recess, a second face opposed to the first face, and a third face connecting the first face and the second face. The third face has a region overlapping with the second face as viewed from an opposing direction of the bottom face of the first recess and the first face.
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