公开(公告)号：US20180233280A1

公开(公告)日：2018-08-16

申请号：US15895039

申请日：2018-02-13

Applicant: TDK CORPORATION

Inventor： Yuya ISHIMA ,  Shinichi KONDO ,  Shunji AOKI ,  Yasushi MATSUYAMA ,  Yusuke ONEZAWA ,  Hajime AZUMA

IPC: H01F41/04 ,  H01F41/02 ,  H01F27/28

CPC classification number: H01F41/043 ,  B32B37/025 ,  B32B38/0036 ,  B32B2307/202 ,  H01F27/2804 ,  H01F41/02 ,  H01F2027/2809

Abstract: A method for manufacturing a laminated coil component including an element and a conductor configuring a coil in the element includes a step of forming a conductor pattern including a configuration material of the conductor on a first base material by a photolithography method, a step of forming an element pattern including a configuration material of the element on a second base material by a photolithography method, the element pattern being formed such that a shape corresponding to a shape of the conductor pattern has been removed, a step of laminating the conductor pattern and the element pattern in a predetermined direction by repeatedly transferring the conductor pattern and the element pattern onto a support, and a step of performing thermal treatment for a laminate obtained by the step of laminating.

公开(公告)号：US20240207893A1

公开(公告)日：2024-06-27

申请号：US17907891

申请日：2022-01-31

Applicant: TDK CORPORATION

Inventor： Hajime AZUMA

IPC: B05D3/10

CPC classification number: B05D3/105 ,  B05D3/101 ,  B05D2201/02 ,  B05D2401/10 ,  B05D2503/00 ,  B05D2505/50

Abstract: This resin composite laminate includes a urethane resin layer containing a urethane resin which has a urethane bond and a siloxane bond, has a weight average molecular weight of 52,200 to 260,000, and is soluble in a solvent, and a polyimide resin layer containing a polyimide resin having an imide bond, and a peel strength between the urethane resin layer and the polyimide resin layer is 1.6 N or more per 10 mm in width.

公开(公告)号：US20230096711A1

公开(公告)日：2023-03-30

申请号：US17794816

申请日：2021-03-31

Applicant: TDK CORPORATION

Inventor： Hajime AZUMA ,  Tatsuya ABE ,  Junichi HOSHINO

IPC: C08F299/08 ,  C09D183/10

Abstract: A resin composition, wherein a resin component in the resin composition has a group represented by the following General Formula (11), (21) or (31) and a urethane bond: (in the formulae, Z1 is an alkyl group, and one or more hydrogen atoms in the alkyl group may be substituted with a cyano group, a carboxy group or a methoxycarbonyl group, and two or more of the substituents may be the same as or different from each other; Z2 is an alkyl group; Z3 is an aryl group; R4 is a hydrogen atom or a halogen atom; and the bond with the symbol * is formed with the bonding destination of the group represented by General Formula (11), (21) or (31)).