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公开(公告)号：US20200077517A1
公开(公告)日：2020-03-05
申请号：US16182567
申请日：2018-11-06
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： KUN LI , SHIN-WEN CHEN , YU-SHUAI LI , LONG-FEI ZHANG
Abstract: A camera includes a circuit board, an image sensing chip, a package base, a lens module, a flexible circuit board, and a first carrier plate. The circuit board includes a first surface and an opposite second surface. The circuit board defines a window through the first surface and the second surface. The image sensing chip is mounted to the second surface and includes a photosensitive area viewable through the window. The package base is mounted to the first surface and defines a light hole. The lens module is mounted to the package base. The first carrier plate is mounted to the second surface and covers the image sensing chip. The circuit board further includes an end portion not covered by the first carrier plate. The flexible circuit board is mounted to the second surface of the end portion and is electrically coupled to the image sensing chip.
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公开(公告)号：US20200064583A1
公开(公告)日：2020-02-27
申请号：US16182560
申请日：2018-11-06
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： SHENG-JIE DING , SHIN-WEN CHEN , JING-WEI LI , JIAN-CHAO SONG
Abstract: A camera includes a bracket, a lens, a filter, a circuit board, a lens base, and a photosensitive chip. The bracket defines a through hole. The lens is mounted on the bracket. The is filter mounted on a side of the bracket and covers the through hole. The circuit board is mounted on a side of the bracket opposite to the filter. The lens base is mounted on the side of the bracket mounted to the filter. The photosensitive chip is mounted on the circuit board and faces the through hole. One of the bracket and the lens base includes a number of positioning members. The other one of the bracket and the lens base defines a number of positioning holes. Each positioning member is received in a corresponding one of the positioning holes.
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公开(公告)号：US20200041114A1
公开(公告)日：2020-02-06
申请号：US16201946
申请日：2018-11-27
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： SHENG-JIE DING , SHIN-WEN CHEN , JING-WEI LI , JIAN-CHAO SONG
Abstract: An optical projection device with metallic components for heat dissipation and for structural reinforcement includes a holder and two opposing metal components opposite to each other. The holder comprises lens receiving groove, electric component receiving groove, and connecting receiving groove leading to the exterior. The two opposing metal components comprise first and second heat dissipation parts, and a connecting part. The first heat dissipation part is formed on an exterior surface of the holder, the connecting part is received in the connecting receiving groove, and the second heat dissipation part is formed on an inner wall of the electric component receiving groove.
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公开(公告)号：US20200007722A1
公开(公告)日：2020-01-02
申请号：US16116102
申请日：2018-08-29
Inventor： SHIN-WEN CHEN , XIAO-MEI MA , KE-HUA FAN , LONG-FEI ZHANG
Abstract: A lens module with physically stronger foundations and enhanced stability includes a circuit board, an image sensor thereon, a mounting bracket, an optical filter, and a lens unit. The mounting bracket is connected to the surface of the circuit board which has the image sensor. The optical filter is connected to mounting bracket and positioned above the image sensor. The lens unit is connected to the mounting bracket facing away from the circuit board through a frame of adhesive. The surface of the lens unit connected to the mounting bracket has protrusions which are positioned at inner edges of the adhesive layer. The protrusions are taller than the depth of the adhesive layer.
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公开(公告)号：US20190393254A1
公开(公告)日：2019-12-26
申请号：US16201916
申请日：2018-11-27
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： CHIA-WEI CHEN , SHIN-WEN CHEN , DING-NAN HUANG
IPC: H01L27/146
Abstract: An encapsulation structure to protect an image sensor chip at all times includes a printed circuit board, an image sensor chip, a protecting structure, and a package portion. The image sensor chip is mounted on the printed circuit board and the protecting structure is mounted on the image sensor chip. The protecting structure comprises a filter sheet. The package portion is entirely opaque and is formed on the printed circuit board, wrapping side wall of the printed circuit board, side wall of the protecting structure, and a portion of surface of the filter sheet which is away from the image sensor chip.
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Patent Agency Ranking
公开(公告)号：US20190393113A1
公开(公告)日：2019-12-26
申请号：US16170038
申请日：2018-10-25
Inventor： CHIA-WEI CHEN , SHIN-WEN CHEN
IPC: H01L23/31 , H01L27/146 , H04N5/225
Abstract: An encapsulation structure to protect an image sensor chip at all times during manufacture and use includes a printed circuit board, an image sensor chip, a supporting portion, a protecting film and a package portion. The image sensor chip is mounted on the printed circuit board and the supporting portion is mounted on the printed circuit board to surround the image sensor chip. The package portion is entirely opaque and is formed on the printed circuit board, the package portion encloses side wall of the supporting portion and the protecting film, and portion of surface of the protecting sheet away from the image sensor chip.
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公开(公告)号：US20190391465A1
公开(公告)日：2019-12-26
申请号：US16053555
申请日：2018-08-02
Inventor： KUN LI , SHIN-WEN CHEN , HAO-ZHONG LIU , LONG-FEI ZHANG
Abstract: A camera module reinforced against excessive torque forces when being installed includes a lens bracket and a lens barrel. The lens bracket includes an internally-threaded receiving barrel, the lens bracket having external threads around its circumference. The external threads match the internal threads, and lower end of the lens bracket includes an annular groove, a resilient ring being received in the annular groove.
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公开(公告)号：US20190387142A1
公开(公告)日：2019-12-19
申请号：US16040855
申请日：2018-07-20
Inventor： LONG-FEI ZHANG , SHIN-WEN CHEN , KUN LI , XIAO-MEI MA
Abstract: A lens module with compact appearance includes a circuit board, an image sensor, a package bracket, an optical filter, and a lens unit. The circuit board defines a first receiving groove for receiving the image sensor. The circuit board has electronic components and gold fingers on one surface. Metallic wires are arranged on edges of a surface of the image sensor. The package bracket is integrally formed on the circuit board to wrap the electronic components, the gold fingers, and the metallic wires therein. The optical filter is connected to surface of the package bracket facing away from the circuit board. The lens unit includes a hollow lens holder and a lens mounted in the lens holder. The lens holder is connected to the surface of the mounting frame facing away from the circuit board.
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公开(公告)号：US20190246490A1
公开(公告)日：2019-08-08
申请号：US15907435
申请日：2018-02-28
Inventor： JING-WEI LI , SHIN-WEN CHEN , KUN LI , SHENG-JIE DING
CPC classification number: H05K1/0206 , H04N5/2253 , H04N5/2254 , H04N5/2258 , H05K1/0274 , H05K1/181 , H05K2201/10121 , H05K2201/10151
Abstract: The present invention relates to a camera module. The camera module includes a circuit board; an image sensor electrically connected to the circuit board; at least one lens holder disposed on the circuit board; at least one lens module received in the at least one lens holder; wherein the circuit board comprises a heat dissipation area in the central thereof and a wiring area besides the heat dissipation area, the wiring area being electrically insulated from the heat dissipation area, the wiring area comprises a plurality of conducting traces, the heat dissipation area defines a plurality of dissipating holes, each dissipating hole is provided with a thermally conductive pillar; and the image sensor is mounted on the heat dissipation area, heat generated by the image sensor is able to dissipate via the thermally conductive pillar.
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40.发明公开公开(公告)号：US20230388634A1
公开(公告)日：2023-11-30
申请号：US17897577
申请日：2022-08-29
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： JIAN-CHAO SONG , DING-NAN HUANG , SHIN-WEN CHEN , KUN LI
CPC classification number: H04N5/23296 , H04N5/2254 , G02B7/09
Abstract: A zoom lens assembly for periscope use which is effectively soundless in operation includes a lens barrel defined with a through hole, a plurality of optical lenses disposed within the through hole, and a focusing member disposed between any two of the plurality of optical lenses. The focusing member in a camera module includes a bottom plate, a cover plate, a piezoelectric element, and a variable transparent body. The variable transparent body is between the bottom plate and the cover plate, the piezoelectric element is disposed on a surface of the cover plate that faces away from the variable transparent body. Electricity fed to the piezoelectric element causes movement of the element which deforms the variable transparent body and changes the focal length of the camera module.
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