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公开(公告)号：US20200169721A1
公开(公告)日：2020-05-28
申请号：US16248996
申请日：2019-01-16
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： SHIN-WEN CHEN , YE-QUANG CHEN , JING-WEI LI , SHENG-JIE DING , CHIA-WEI CHEN
IPC: H04N13/257 , H04N9/07 , H04N5/225 , H04N13/25
Abstract: A 3D sensing device includes a base, an infrared emitting module, a first infrared receiver, a second infrared receiver, a color camera module, a first moving member, a second moving member, a first driving member, and a second driving member. The first moving member and the second moving member are slidably mounted on the base. The first driving member and the second riving member respectively drive the first moving member and the second moving member to slide along the base. The infrared emitting module is mounted on the first moving member. The color camera module is located between the first infrared receiver and the infrared emitter. The second infrared receiver is mounted on the second moving member. The first moving member and the second moving member respectively move the infrared emitting module and the second infrared receiver along the base relative to the first infrared receiver.
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公开(公告)号：US20190393254A1
公开(公告)日：2019-12-26
申请号：US16201916
申请日：2018-11-27
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： CHIA-WEI CHEN , SHIN-WEN CHEN , DING-NAN HUANG
IPC: H01L27/146
Abstract: An encapsulation structure to protect an image sensor chip at all times includes a printed circuit board, an image sensor chip, a protecting structure, and a package portion. The image sensor chip is mounted on the printed circuit board and the protecting structure is mounted on the image sensor chip. The protecting structure comprises a filter sheet. The package portion is entirely opaque and is formed on the printed circuit board, wrapping side wall of the printed circuit board, side wall of the protecting structure, and a portion of surface of the filter sheet which is away from the image sensor chip.
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Patent Agency Ranking
公开(公告)号：US20190393113A1
公开(公告)日：2019-12-26
申请号：US16170038
申请日：2018-10-25
Inventor： CHIA-WEI CHEN , SHIN-WEN CHEN
IPC: H01L23/31 , H01L27/146 , H04N5/225
Abstract: An encapsulation structure to protect an image sensor chip at all times during manufacture and use includes a printed circuit board, an image sensor chip, a supporting portion, a protecting film and a package portion. The image sensor chip is mounted on the printed circuit board and the supporting portion is mounted on the printed circuit board to surround the image sensor chip. The package portion is entirely opaque and is formed on the printed circuit board, the package portion encloses side wall of the supporting portion and the protecting film, and portion of surface of the protecting sheet away from the image sensor chip.
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公开(公告)号：US20200076995A1
公开(公告)日：2020-03-05
申请号：US16170535
申请日：2018-10-25
Inventor： DING-NAN HUANG , CHIA-WEI CHEN , SHIN-WEN CHEN
IPC: H04N5/225
Abstract: A camera module with a strong and stable mounting which is geometrically precise includes a printed circuit board, an optical bearing structure, and an image sensor. The printed circuit board includes a mounting surface, the mounting surface defining a conductive circuit area and a surrounding non-conductive peripheral area. The peripheral area comprises a first contact layer, the first contact layer is frame-like and a size of the first contact layer is same as a size of bottom of the optical bearing structure. The optical bearing structure is on the first contact layer and carries a lens module. The image sensor is mounted on the conductive circuit area.
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公开(公告)号：US20200221065A1
公开(公告)日：2020-07-09
申请号：US16280232
申请日：2019-02-20
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： YE-QUANG CHEN , SHIN-WEN CHEN , JING-WEI LI , CHIA-WEI CHEN , SHENG-JIE DING
IPC: H04N13/239 , G03B35/08 , H04N13/296
Abstract: A three-dimensional image-capturing device includes a first camera, a second camera, a driving member and a sensing member. The second camera is at one side of the first camera and is capable of being moved laterally by the driving member. After depth-sensing and establishing orientations in an image, the driving member is able to drive the second camera to move relative to the first camera, to change a distance between the first camera and the second camera. Such relative movement allows a greater range of three dimensionality for face recognition and other purposes.
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公开(公告)号：US20190393362A1
公开(公告)日：2019-12-26
申请号：US16201959
申请日：2018-11-27
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： CHIA-WEI CHEN , SHIN-WEN CHEN
IPC: H01L31/0203 , H01L31/0216 , H01L31/02 , H01L31/18 , H01L31/0232
Abstract: An encapsulating structure to protect an image sensor chip at all times during manufacture and use includes a printed circuit board, an image sensor chip, a protecting sheet, and a package portion. The image sensor chip is mounted on the printed circuit board and the protecting sheet is mounted on the image sensor chip. The package portion is entirely opaque and is formed on the printed circuit board, the package portion encloses side wall of the image sensor chip, the protecting sheet, and portion of surface of the protecting sheet away from the image sensor chip. A method for manufacturing same is also disclosed.
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公开(公告)号：US20190387157A1
公开(公告)日：2019-12-19
申请号：US16170037
申请日：2018-10-25
Inventor： CHIA-WEI CHEN , SHIN-WEN CHEN , DING-NAN HUANG
Abstract: A camera module comprises a circuit board and a base. A circuit board comprises a first surface and a second surface opposite to the first surface. At least one receiving groove is defined in the first surface. The receiving groove has not extended through the second surface. Each the at least one receiving groove receives an electronic component, and a height of the electronic component is less than a depth of the receiving groove. A base is fixed on the top surface. The at least one receiving groove is covered by the base to seal electronic components. A side surface of the base is aligned with a wall of the receiving groove.
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