摘要:
A socket connector (1) for connecting an IC package to a printed circuit board includes a base (10) mounting a plurality of conductive terminals therein. A cover (13) assembled on the base (10) and sliding along a first direction relative to the base defines a pair of sidewalls (132, 133) extending downwardly therefrom. An actuating lever (14) drives the cover (13) sliding on the base (10). The sidewalls (132, 133) of the cover (13) are fitly engaging with corresponding sides (111, 112) of the base (10) except a releasing slot (1110, 1120) defined between part portion of the sidewall and the side.
摘要:
An IC socket (1) includes a base (2), a cover (5) slidably engaged upon the base, and a lever (4) for driving the cover to slide on the base. The lever includes a lateral rod (41) and a longitudinal rod (42) connected to the lateral rod. The lateral rod is received in between the cover and the base. The longitudinal rod is exposed out of the cover and the base, with a connecting section (421) of the longitudinal rod parallel to one side face of the cover, and an acting section (423) joined to the connecting section and configured to be laterally tilted towards the one side face of the cover. Thus, this configuration of the acting section of the longitudinal rod will occupy less room on a printed circuit board, and enables the lever to be engagably retained on the cover side face so as to prevent the lever from being removed by accidental touching or vibration.
摘要:
An electrical connector (10) includes a base (101), and a cover (102) locatable above the base. The base has a major surface (1011) with a plurality of terminal receiving passageways (1010) extending therefrom. The cover has a major face (1025) opposite the major surface and spaced apart from the major surface of the base. A plurality of discrete protrusions (1012) is arranged extending longitudinally from one of said major face and said major surface towards the other, and positionable adjacent the passageways. Thus, a plurality of voids is located laterally adjacent the discrete protrusions and between the major surface of the base and the major face of the cover, thereby allowing the heat from pin-like conductive elements (21) of a CPU chip (20) to be dissipated through the plurality of laterally voids around the pin-like conductive elements.
摘要:
An IC socket (1) includes a base (2), a cover (5) slidably engaged upon the base, and a lever (4) for driving the cover to slide on the base. The lever includes a lateral rod (41) and a longitudinal rod (42) connected to the lateral rod. The lateral rod is received in between the cover and the base. The longitudinal rod is exposed out of the cover and the base, with a connecting section (421) of the longitudinal rod parallel to one side face of the cover, and an acting section (423) joined to the connecting section and configured to be laterally tilted towards the one side face of the cover. Thus, this configuration of the acting section of the longitudinal rod will occupy less room on a printed circuit board, and enables the lever to be engagably retained on the cover side face so as to prevent the lever from being removed by accidental touching or vibration.
摘要:
A socket connector (5) includes a base (6), a cover (7) slidably assembled onto the base and capable being moved with respect to the base along a first direction, an actuator (8) for actuating the cover to slide on the base between a contact insert position and a second engagement position, and guiding and latching arrangement (621) arranged between the base and the cover and adjacent to the actuator so as to balance a movement of the cover along a second direction substantially traverse to the first direction.
摘要:
An electrical connector (1) for connecting a land grid array (LGA) chip with a printed circuit board (PCB) includes a housing (10), and terminals (11) received in passageways (102) of the housing. The housing defines a base (100) and four sidewalls (12), the base and the sidewalls cooperatively defining a space therebetween for receiving the LGA chip. The base has a multiplicity of passageways along a length thereof, for receiving the corresponding terminals therein. Two adjacent sidewalls each define a resilient beam (13) with an incline surface and joining the sidewall at two ends. A space (15) is defined between the beam and the sidewall. When the LGA chip is placed on the base, the two resilient beams can resiliently act on the chip to ensure reliable engagement between the LGA chip and the connector.
摘要:
A socket connector (9) includes an insulative base (10), a plurality of contacts (20) and a flexible beam (120) for securing the electronic element in the base. The base includes sidewalls (12), and a recessed portion (13) being defined in the sidewalls for receiving the electronic element therein. A plurality of receiving passageways (110) are defined in the recessed portion and extend through upper and lower surfaces of the recessed portion. Each contact includes a retaining portion retained in the base, a flexible contact portion (200) extending laterally from an upper portion of the retaining portion beyond upper surface of the recessed portion, and a connecting porting (202) extending from a lower portion of the retaining portion adapted for electrically connecting with the PCB. The beam is secured with one sidewall of the base. The sidewall defines a slot (121) adjacent to the beam. The beam has a flexible portion (120A) extending into the recessed portion and deflectable into said slot in an opposite direction to the extending direction of the contact portions of the contacts.
摘要:
The infrasound generating device based on a displacement-feedback type vibration exciter comprises a displacement-feedback type vibration exciter system, an infrasound generating chamber (3) and a laser vibrometer (1); the displacement feedback mechanism is adopted in the vibration exciter (2). The piston (31) is driven by the vibration exciter to move in a sinusoidal manner in the cavity (35) of the airtight infrasound generating chamber (3) and the standard infrasonic pressure signal with low harmonic distortion can be achieved. The displacement of the moving part (22) of the vibration exciter (2) can be measured by the laser vibrometer (1) through the measurement beam (15) injecting into the vibration exciter (2) through the optical channel running through the vibration exciter and the standard infrasonic pressure can also be obtained. The value of the standard sound pressure produced by the infrasound generating chamber is calculated. Such value is used as the calibration reference for the infrasound sensors (4) to be calibrated in order to achieve the primary calibration of the infrasound sensors. The standard infrasonic sensor can be installed inside the infrasound generating chamber (3) and the output of the standard infrasonic sensor can be used as the reference for the infrasonic sensor (4) to be calibrated in order to achieve the secondary calibration of the infrasound sensors. This invention has the advantages of technical maturity, high feasibility, easy to realize, high calibration accuracy and so on.
摘要:
A precision tilting platform used for static calibration of seismometers includes a base, a worktable, a rotary part, a driving part, a measuring part and supporting frames. The rotary part includes a shaft, a driving arm, a rotary table and a clump weight. The driving part includes a linear motor, a sliding table, a pair of linear guides and sliders and a grating scale. The readhead of the grating scale is fixed with the base and sends out a signal of zero position when the worktable is horizontal. The sliding table contacts the driving arm. When the linear motor is moving forward, the rotary part rotates toward the positive direction. When the linear motor is moving backward, the rotary part rotates toward the negative direction under gravity of the clump weight. The measuring part includes a laser interferometer and a reflector to obtain the tilting angle of the worktable.