Abstract:
Described is a technology by which two or more air moving devices have some of their control lines combined, including a frequency control line from a controller. Along with the combined frequency control line, power voltage lines and ground lines and may be combined, with a separate sensing line for each air moving device. One or more couplers couples the combined lines to air moving device control circuitry.
Abstract:
A computer housing can include a front end and a back end; a back edge; opposing lateral sides; a top side; a base disposed between the front end and the back end and between the opposing lateral sides; and two spherical cap pads attached to the base that define, with respect to the back edge, a maximum tilt angle for downward movement of the back end responsive to upward movement of the front end of the computer housing. Various other apparatuses, systems, methods, etc., are also disclosed.
Abstract:
A method, apparatus, and system are disclosed for a planar adapter card retainer bracket that is removably attachable to a computer chassis and is formed with a plurality of plunger openings. Each plunger opening is configured to receive a respective adapter card retainer plunger. The adapter card retainer plunger is configured to extend from the bracket into the computer chassis to engage an edge of an adapter card thereby retaining the adapter card in a selected slot even if the adapter card is a low-profile adapter card.
Abstract:
A power supply is disposed adjacent a first end of a chassis. The chassis comprises a z axis from the first end to a second end of the chassis and an x axis orthogonal to the z axis. A bay is disposed adjacent the first end of the chassis along the x axis from the power supply. The bay comprises at least one storage device. A chamber is disposed adjacent the first end of the chassis adjacent the bay along the x axis between the bay and the power supply. A first baffle is disposed offset from the power supply, the bay, and the chamber along the z axis toward the second end. The first baffle forms a first section and isolates a first airflow in the first section from a second airflow.
Abstract:
An apparatus, system, and method are disclosed for routing a power cable assembly. A motherboard is disposed in a chassis. A power cable assembly is routed parallel to a plane of the motherboard and comprises a plurality of power cables. Each power cable is in physical and electrical communication with a power supply. The power cable assembly is organized in a 1×n array, wherein n is a positive integer greater than five and the power cable assembly is in electrical communication with the motherboard.
Abstract:
Option cards—one or more as may be installed in a particular computer system—are retained in position against possibly dislodgement due to handling by a frame and cooperating cross bar and depending member elements which may be variously positioned relative to the frame.
Abstract:
A self contained cooling system which is amenable to miniaturization so as to accommodate space and connectivity restrictions implicit in computer and other electronic apparatus while enhancing heat transfer. In use, the cooling systems of this invention use compression/expansion cycles of a refrigerant material to move thermal energy from one location to another. The compressor, condenser, and evaporator are all contained within a volume consistent with mounting directly on a semiconductor device such as a processor.
Abstract:
A chip sandwich includes a heat sink, a retention module, a computer chip mounted in a socket on a mother board, a wave washer spring and a mounting plate. The heat sink is mounted on the retention module using cams, hooks and heat sink tabs to provide an initial orientation of the heat sink over the computer chip. To provide final contact pressure between the heat sink and the computer chip, a wave washer spring oriented beneath the computer chip and under the mother board provides an upward pressure against the bottom of the mother board, and particularly against the center of the computer chip. Thus, by the wave washer spring pushing against the center of the computer chip, secure contact pressure is provided between the heat sink and the computer chip, while minimizing the amount of pressure between the computer chip's pins and the chip socket.
Abstract:
A retention module firmly secures a heat sink for a computer chip. The retention module is oriented about the computer chip on a circuit board. The retention module has a rotatable wire form that has two loops. When the rotatable wire form is rotated, the two loops press against an impingement shelf on the heat sink, forcing the heat sink against the retention module and the computer chip. The two loops are angularly offset to each other, thus compensating for torsion lag between the two loops when the two loops are pressed against the impingement shelf.
Abstract:
A system for holding a device in a computer system, the computer system including a drive cage for holding the device, is disclosed. The system comprises a first rail coupled to one side of the device and adapted to fit into the drive cage and a second rail coupled to the device at a side opposite the one side and adapted to fit into the drive cage, wherein the first and second rails are coupled to the device without requiring a tool. Computer systems utilizing the system in accordance with the present invention, will be better equipped to handle the acoustic vibrations created during the operation of different types of drives such as Direct Access and Storage Devices (DASDs). Accordingly, this will enable computer system manufacturers to incorporate faster DASDs without acoustically coupling the DASD to the chassis. Furthermore, by employing a screw-less rail, PC manufacturers and users will no longer be required to use a tool to remove the attached rails. This facilitates the easy removal and reinstallation of DASDs when interchanging computer components.