Combined control lines for device cooling fans
    31.
    发明授权
    Combined control lines for device cooling fans 有权
    用于设备冷却风扇的组合控制线

    公开(公告)号:US09020645B2

    公开(公告)日:2015-04-28

    申请号:US13434236

    申请日:2012-03-29

    CPC classification number: G06F1/20 H05K7/20209

    Abstract: Described is a technology by which two or more air moving devices have some of their control lines combined, including a frequency control line from a controller. Along with the combined frequency control line, power voltage lines and ground lines and may be combined, with a separate sensing line for each air moving device. One or more couplers couples the combined lines to air moving device control circuitry.

    Abstract translation: 描述了两种或多种空气移动装置具有组合其一些控制线的技术,包括来自控制器的频率控制线。 除了组合的频率控制线,电源电压线和地线之外,还可以组合使用每个空气移动装置的单独的感测线。 一个或多个耦合器将组合的线耦合到空气移动装置控制电路。

    COMPUTER EQUIPMENT WITH SLIPPERY PADS
    32.
    发明申请
    COMPUTER EQUIPMENT WITH SLIPPERY PADS 有权
    带滑动垫的计算机设备

    公开(公告)号:US20130250511A1

    公开(公告)日:2013-09-26

    申请号:US13430398

    申请日:2012-03-26

    CPC classification number: B32B7/04 G06F1/182

    Abstract: A computer housing can include a front end and a back end; a back edge; opposing lateral sides; a top side; a base disposed between the front end and the back end and between the opposing lateral sides; and two spherical cap pads attached to the base that define, with respect to the back edge, a maximum tilt angle for downward movement of the back end responsive to upward movement of the front end of the computer housing. Various other apparatuses, systems, methods, etc., are also disclosed.

    Abstract translation: 计算机外壳可包括前端和后端; 后缘 相对的侧面; 顶端 设置在前端和后端之间以及相对的横向侧之间的基座; 以及附接到基座的两个球形盖垫,其响应于计算机壳体的前端的向上移动,相对于后边缘限定了用于向后移动的后端的最大倾斜角。 还公开了各种其它装置,系统,方法等。

    APPARATUS, SYSTEM, AND METHOD OF POWER SUPPLY DISPOSITION AND COOLING
    34.
    发明申请
    APPARATUS, SYSTEM, AND METHOD OF POWER SUPPLY DISPOSITION AND COOLING 有权
    设备,系统和电源处理与冷却方法

    公开(公告)号:US20110235261A1

    公开(公告)日:2011-09-29

    申请号:US12729845

    申请日:2010-03-23

    CPC classification number: G06F1/20

    Abstract: A power supply is disposed adjacent a first end of a chassis. The chassis comprises a z axis from the first end to a second end of the chassis and an x axis orthogonal to the z axis. A bay is disposed adjacent the first end of the chassis along the x axis from the power supply. The bay comprises at least one storage device. A chamber is disposed adjacent the first end of the chassis adjacent the bay along the x axis between the bay and the power supply. A first baffle is disposed offset from the power supply, the bay, and the chamber along the z axis toward the second end. The first baffle forms a first section and isolates a first airflow in the first section from a second airflow.

    Abstract translation: 电源设置在底盘的第一端附近。 底盘包括从底盘的第一端到第二端的z轴和与z轴正交的x轴。 沿着x轴从电源将托架设置在机架的第一端附近。 该托架包括至少一个存储装置。 室之间沿着x轴在隔间和电源之间邻近托架邻近底盘的第一端。 第一挡板沿着z轴朝向第二端设置为偏离电源,隔间和腔室。 第一挡板形成第一部分并将第一部分中的第一气流与第二气流隔离。

    APPARATUS, SYSTEM, AND METHOD FOR ROUTING A POWER CABLE ASSEMBLY
    35.
    发明申请
    APPARATUS, SYSTEM, AND METHOD FOR ROUTING A POWER CABLE ASSEMBLY 审中-公开
    用于路由电力电缆组件的装置,系统和方法

    公开(公告)号:US20110228472A1

    公开(公告)日:2011-09-22

    申请号:US12727772

    申请日:2010-03-19

    CPC classification number: G06F1/189

    Abstract: An apparatus, system, and method are disclosed for routing a power cable assembly. A motherboard is disposed in a chassis. A power cable assembly is routed parallel to a plane of the motherboard and comprises a plurality of power cables. Each power cable is in physical and electrical communication with a power supply. The power cable assembly is organized in a 1×n array, wherein n is a positive integer greater than five and the power cable assembly is in electrical communication with the motherboard.

    Abstract translation: 公开了用于布置电力电缆组件的装置,系统和方法。 主板安装在底盘上。 电力电缆组件平行于母板的平面布置,并且包括多个电力电缆。 每个电源线与电源进行物理和电气通信。 电力电缆组件以1×n阵列组织,其中n是大于5的正整数,并且电力电缆组件与主板电连通。

    Cooling Systems
    37.
    发明申请
    Cooling Systems 有权
    冷却系统

    公开(公告)号:US20080295534A1

    公开(公告)日:2008-12-04

    申请号:US11536245

    申请日:2006-09-28

    Abstract: A self contained cooling system which is amenable to miniaturization so as to accommodate space and connectivity restrictions implicit in computer and other electronic apparatus while enhancing heat transfer. In use, the cooling systems of this invention use compression/expansion cycles of a refrigerant material to move thermal energy from one location to another. The compressor, condenser, and evaporator are all contained within a volume consistent with mounting directly on a semiconductor device such as a processor.

    Abstract translation: 一种独立的冷却系统,其适于小型化,以便在增强热传递的同时适应计算机和其他电子设备中的空间和连接限制。 在使用中,本发明的冷却系统使用制冷剂材料的压缩/膨胀循环将热能从一个位置移动到另一个位置。 压缩机,冷凝器和蒸发器都包含在直接安装在诸如处理器的半导体器件上的体积内。

    Heat sink and chip sandwich system
    38.
    发明授权
    Heat sink and chip sandwich system 有权
    散热片和芯片夹心系统

    公开(公告)号:US07224587B2

    公开(公告)日:2007-05-29

    申请号:US10871719

    申请日:2004-06-18

    Abstract: A chip sandwich includes a heat sink, a retention module, a computer chip mounted in a socket on a mother board, a wave washer spring and a mounting plate. The heat sink is mounted on the retention module using cams, hooks and heat sink tabs to provide an initial orientation of the heat sink over the computer chip. To provide final contact pressure between the heat sink and the computer chip, a wave washer spring oriented beneath the computer chip and under the mother board provides an upward pressure against the bottom of the mother board, and particularly against the center of the computer chip. Thus, by the wave washer spring pushing against the center of the computer chip, secure contact pressure is provided between the heat sink and the computer chip, while minimizing the amount of pressure between the computer chip's pins and the chip socket.

    Abstract translation: 芯片夹层包括散热器,保持模块,安装在母板上的插座中的计算机芯片,波形垫圈弹簧和安装板。 散热器使用凸轮,钩和散热片安装在保持模块上,以提供散热器在计算机芯片上的初始定向。 为了在散热器和计算机芯片之间提供最终的接触压力,在计算机芯片下方和母板下方定向的波形垫圈弹簧提供抵抗母板底部,特别是抵靠计算机芯片中心的向上压力。 因此,通过波形垫圈弹簧推靠着计算机芯片的中心,在散热器和计算机芯片之间提供牢固的接触压力,同时最小化计算机芯片的引脚和芯片插座之间的压力量。

    Wire form heat sink retention module
    39.
    发明授权
    Wire form heat sink retention module 有权
    线形散热片固定模块

    公开(公告)号:US07009844B2

    公开(公告)日:2006-03-07

    申请号:US10871661

    申请日:2004-06-18

    Abstract: A retention module firmly secures a heat sink for a computer chip. The retention module is oriented about the computer chip on a circuit board. The retention module has a rotatable wire form that has two loops. When the rotatable wire form is rotated, the two loops press against an impingement shelf on the heat sink, forcing the heat sink against the retention module and the computer chip. The two loops are angularly offset to each other, thus compensating for torsion lag between the two loops when the two loops are pressed against the impingement shelf.

    Abstract translation: 保持模块可牢固地固定计算机芯片的散热片。 保持模块围绕电路板上的计算机芯片定向。 保持模块具有可旋转的线形,其具有两个环。 当可旋转线形式旋转时,两个环路压靠在散热器上的冲击架上,迫使散热器抵靠保持模块和计算机芯片。 两个回路相互成角度地偏移,从而补偿当两个回路压靠冲击架时两个回路之间的扭转滞后。

    System for holding a device in a computer system
    40.
    发明授权
    System for holding a device in a computer system 失效
    用于在计算机系统中保持设备的系统

    公开(公告)号:US06719385B1

    公开(公告)日:2004-04-13

    申请号:US09483614

    申请日:2000-01-14

    CPC classification number: G11B33/128 G06F1/184 G06F1/187 G11B33/08

    Abstract: A system for holding a device in a computer system, the computer system including a drive cage for holding the device, is disclosed. The system comprises a first rail coupled to one side of the device and adapted to fit into the drive cage and a second rail coupled to the device at a side opposite the one side and adapted to fit into the drive cage, wherein the first and second rails are coupled to the device without requiring a tool. Computer systems utilizing the system in accordance with the present invention, will be better equipped to handle the acoustic vibrations created during the operation of different types of drives such as Direct Access and Storage Devices (DASDs). Accordingly, this will enable computer system manufacturers to incorporate faster DASDs without acoustically coupling the DASD to the chassis. Furthermore, by employing a screw-less rail, PC manufacturers and users will no longer be required to use a tool to remove the attached rails. This facilitates the easy removal and reinstallation of DASDs when interchanging computer components.

    Abstract translation: 公开了一种用于将设备保持在计算机系统中的系统,该系统包括用于保持设备的驱动器仓。 该系统包括耦合到该装置的一侧并适于装配到驱动器笼中的第一轨道和在与该一侧相对的一侧相对于该装置的第二轨道,并适于装配到驱动器笼中,其中第一和第二 轨道耦合到设备而不需要工具。 利用根据本发明的系统的计算机系统将更好地配备以处理在诸如直接访问和存储设备(DASD)的不同类型的驱动器的操作期间产生的声音振动。 因此,这将使计算机系统制造商能够将更快的DASD并入DASD,而无需将DASD与机箱进行声学耦合。 此外,通过使用无螺丝钢轨,PC制造商和用户将不再需要使用工具来卸下连接的导轨。 这有助于在交换计算机组件时轻松删除和重新安装DASD。

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