公开(公告)号：US5068013A

公开(公告)日：1991-11-26

申请号：US471639

申请日：1990-01-29

申请人： Roger F. Bernards ,  Gordon Fischer ,  Wade Sonnenberg

发明人： Roger F. Bernards ,  Gordon Fischer ,  Wade Sonnenberg

IPC分类号： C25D3/38 ,  H05K3/42

CPC分类号： C25D3/38 ,  H05K3/42 ,  H05K2203/162

摘要： A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.

摘要翻译： 一种用于将铜电镀到包含溶液可溶性铜盐和酸性电解质的导电表面上的组合物，所述铜盐以每升溶液约1至10克的浓度存在，并且所述酸以浓度存在，其中酸 铜比优选在约30至1和50至1之间变化。该组合物特别可用于电镀具有至少10比1的高度与直径的比率以及至少0.100英寸的长度的圆柱形开口的壁。