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公开(公告)号：US5068013A
公开(公告)日：1991-11-26
申请号：US471639
申请日：1990-01-29
CPC分类号： C25D3/38 , H05K3/42 , H05K2203/162
摘要： A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.
摘要翻译： 一种用于将铜电镀到包含溶液可溶性铜盐和酸性电解质的导电表面上的组合物，所述铜盐以每升溶液约1至10克的浓度存在，并且所述酸以浓度存在，其中酸 铜比优选在约30至1和50至1之间变化。该组合物特别可用于电镀具有至少10比1的高度与直径的比率以及至少0.100英寸的长度的圆柱形开口的壁。
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2.发明授权Electroplating composition and process for plating through holes in printed circuit boards 失效电镀组合物和电镀印刷电路板上的孔的方法
公开(公告)号：US4897165A
公开(公告)日：1990-01-30
申请号：US235051
申请日：1988-08-23
CPC分类号： C25D3/38 , H05K3/42 , H05K3/423 , H05K2203/162
摘要： A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.Also disclosed is a device for measuring throwing power of a plating solution. The device comprises two anodes and a cathode suspended in a chamber adapted to contain a plating solution. The cathode is suspended between said anodes and comprises two flat electrode portions in electrical contact with each other, in parallel relationship to each other and spaced apart from each other to define a space containing plating solution. Each of said flat electrode portions has electrode portions electrically isolated from a center electrode and means for measuring the current on said first electrode portions and center electrode.
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公开(公告)号：US5051154A
公开(公告)日：1991-09-24
申请号：US471381
申请日：1990-01-29
CPC分类号： H05K3/42 , C25D3/38 , H05K3/423 , H05K2203/162
摘要： The invention discloses the use of an additive for acid copper plating bath which is chosen based on criteria of creating a shift in the charge transfer overpotential of the bath; or alternatively, creating a differential overpotential between the surface of a high aspect ratio circuit board and the recesses of such boards. The additive may be a single or multi-component additive.
摘要翻译： 本发明公开了使用酸性镀铜浴的添加剂，其基于产生电镀液的电荷转移超电位的变化的标准来选择; 或者替代地，在高宽比电路板的表面和这种板的凹部之间产生差分超电势。 添加剂可以是单组分或多组分添加剂。
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4.发明授权Method and apparatus for determining throwing power of an electroplating solution 失效用于确定电镀溶液的投射功率的方法和装置
公开(公告)号：US4932518A
公开(公告)日：1990-06-12
申请号：US438021
申请日：1989-11-20
CPC分类号： H05K3/42 , C25D3/38 , H05K2203/162
摘要： A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.
摘要翻译： 一种用于将铜电镀到包含溶液可溶性铜盐和酸性电解质的导电表面上的组合物，所述铜盐以每升溶液约1至10克的浓度存在，并且所述酸以浓度存在，其中酸 铜比优选在约30至1和50至1之间变化。该组合物特别可用于电镀具有至少10比1的高度与直径的比率以及至少0.100英寸的长度的圆柱形开口的壁。
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公开(公告)号：US5004525A
公开(公告)日：1991-04-02
申请号：US438020
申请日：1989-11-20
CPC分类号： C25D3/38 , H05K3/42 , H05K2203/162
摘要： A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.
摘要翻译： 一种用于将铜电镀到包含溶液可溶性铜盐和酸性电解质的导电表面上的组合物，所述铜盐以每升溶液约1至10克的浓度存在，并且所述酸以浓度存在，其中酸 铜比优选在约30至1和50至1之间变化。该组合物特别可用于电镀具有至少10比1的高度与直径的比率以及至少0.100英寸的长度的圆柱形开口的壁。
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公开(公告)号：US5252196A
公开(公告)日：1993-10-12
申请号：US803281
申请日：1991-12-05
IPC分类号： C25D3/38
CPC分类号： C25D3/38
摘要： Compositions and processes for electrolytic plating. The compositions are characterized by critical amounts of one or more brightening and leveling agents. The compositions are particularly useful for plating through hole walls of printed circuit boards, including through holes having an aspect ratio equal or greater than about ten to one.
摘要翻译： 电解电镀的组成和工艺。 组合物的特征在于临界量的一种或多种增亮剂和流平剂。 所述组合物特别可用于通过印刷电路板的孔壁进行电镀，包括具有等于或大于约十比一的纵横比的通孔。
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公开(公告)号：US06773573B2
公开(公告)日：2004-08-10
申请号：US09970224
申请日：2001-10-02
申请人： David R. Gabe , Andrew J. Cobley , Leon R. Barstad , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Thomas Buckley
发明人： David R. Gabe , Andrew J. Cobley , Leon R. Barstad , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Thomas Buckley
IPC分类号： C25D338
摘要： A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.
摘要翻译： 含有抑制或延缓电镀浴添加剂消耗的醇化合物的金属电镀液。 添加剂是改善电镀金属的亮度，电镀金属的物理性质，特别是相对于延展性和微投能力以及电镀液的宏投射功率的化学化合物。 抑制或延缓添加剂消耗的酒精化合物会增加镀液的使用寿命，并提高电镀工艺的效率。 可以使用含有抑制或延迟添加剂消耗的醇化合物的电镀浴来镀铜，金，银，钯，铂，钴，镉，铬，铋，铟，铑，钌和铱。
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公开(公告)号：US06652731B2
公开(公告)日：2003-11-25
申请号：US09970271
申请日：2001-10-02
申请人： Andrew J. Cobley , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Leon R. Barstad , Thomas Buckley
发明人： Andrew J. Cobley , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Leon R. Barstad , Thomas Buckley
IPC分类号： C25D338
摘要： A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The Metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.
摘要翻译： 金属镀液和金属电镀工艺，含有醛类化合物，可防止或减少金属电镀浴添加剂的消耗。 金属电镀浴提供有效的电镀方法，因为不需要中断电镀工艺以补充镀液。 金属镀液可以用于镀铜，金，银，钯，钴，铬，镉，铋，铟，铑，铱和钌等金属。
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9.发明授权Conductive polymer colloidal compositions with selectivity for non-conductive surfaces 有权导电聚合物胶体组合物，对非导电表面具有选择性公开(公告)号：US06899829B2
公开(公告)日：2005-05-31
申请号：US09998117
申请日：2001-11-30
摘要： A conductive polymer colloidal composition that selectively forms a coating on a non-conductive surface. The conductive polymer colloidal composition is composed of a polymer and a sulfonate dopant. The conductive polymer colloidal composition may also contain conductive colloidal particles such as conductive carbon or metal salt particles, oxidants, stabilizers, and preservatives. The conductive polymer colloidal composition may be employed to selectively coat the non-conductive parts of printed wiring boards such that a uniform metal layer can be deposited on the conductive polymer coat. In addition to a uniform metal layer being formed over the conductive polymer, adhesion between the metal layer and the printed wiring board is improved.
摘要翻译： 导电聚合物胶体组合物，其选择性地在非导电表面上形成涂层。 导电聚合物胶体组合物由聚合物和磺酸盐掺杂剂组成。 导电聚合物胶体组合物还可以含有导电胶体颗粒，例如导电碳或金属盐颗粒，氧化剂，稳定剂和防腐剂。 可以使用导电聚合物胶体组合物来选择性地涂覆印刷线路板的非导电部分，使得可以在导电聚合物涂层上沉积均匀的金属层。 除了在导电聚合物上形成均匀的金属层之外，还提高了金属层和印刷线路板之间的粘附性。
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公开(公告)号：US06174647B1
公开(公告)日：2001-01-16
申请号：US09013364
申请日：1998-01-26
申请人： John P. Cahalen , Wade Sonnenberg
发明人： John P. Cahalen , Wade Sonnenberg
IPC分类号： G03F726
CPC分类号： H05K3/4661 , G03F7/095 , G03F7/40 , G03F7/405 , H05K3/0023 , H05K2203/0716 , H05K2203/121
摘要： This invention is directed to a process for the selective metallization which utilizes multiple photoresist layers, using a buried palladium ligand which is then catalyzed using a PdBr selective catalyst. The Pd in the catalyst is then reduced to Pd0 and metallized using for example electroless copper.
摘要翻译： 本发明涉及一种利用多个光致抗蚀剂层的选择性金属化方法，该方法是使用掩埋的钯配体，然后使用PdBr选择性催化剂进行催化。 然后将催化剂中的Pd还原为Pd0，并使用例如无电解铜进行金属化。
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