摘要:
To suppress an increase in the pressure of an ink reservoir caused by the ink reversely flowed from an ink cavity without causing a lead wire to be damaged or to get fatigued. A thin portion 13 which becomes resiliently deformed by the ink reversely flowed from an ink cavity 2 is provided in the area of a compliance plate facing an ink reservoir 4.
摘要:
A wiring member for a liquid ejection head enables reducing the size of the liquid ejection head. A flexible printed circuit has on one end a plurality of individual electrode wiring terminals corresponding to individual element electrode terminals of piezoelectric elements; individual electrode wires corresponding to the individual electrode wiring terminals; a common electrode wiring terminal corresponding to a common electrode terminal of the piezoelectric elements; and a common electrode wire corresponding to the common electrode wiring terminal. The individual electrode wiring terminals, common electrode wiring terminal, and individual electrode wires are disposed on one side of the flexible printed circuit, and the common electrode wire is disposed on the other side of the flexible printed circuit.
摘要:
A liquid ejecting head that can be of reduced size while maintaining reliability of the terminal connection is provided. According to the liquid ejecting head of the invention, individual element electrode terminals and first side individual electrode wiring terminals of a flexible cable, which are connected to the individual element electrode terminals are arrayed in a direction of a row of pressure chambers, and at least one of a side individual element electrode terminals located in a side portion in a terminal row direction X and a first side individual electrode wiring terminals connected to the side individual element electrode terminals are arranged inclined with respect to a center individual element electrode terminals located in the center portion in the terminal row direction.
摘要:
A liquid ejection head includes a flow channel-forming substrate having a plurality of pressure-generating chambers communicated with nozzles for ejecting droplets, the pressure-generating chambers being arranged in parallel with each other; a plurality of pressure-applying units for applying pressure to interiors of the pressure-generating chambers; and a joining substrate joined onto one surface of the flow channel-forming substrate. The flow channel-forming substrate includes a silicon single crystal substrate having a (110) plane orientation and has a side surface extending in a longitudinal direction of the pressure-generating chambers, the side surface being composed of a first (111) plane perpendicular to a (110) plane. The joining substrate includes a silicon single crystal substrate having a (110) plane orientation and is joined onto the flow channel-forming substrate so that a first (111) plane of the joining substrate perpendicular to the (110) plane intersects the first (111) plane of the flow channel-forming substrate.
摘要:
A liquid ejecting head is provided which ejects liquid from nozzle openings by driving pressure generating elements, and includes: at least two rows of lead electrodes that supply an electrical signal to the pressure generating elements; and at least two wiring boards for supplying the electrical signal to the lead electrodes, wherein: the wiring boards respectively have individual wires which are electrically connected to the pressure generating elements, respectively, via the lead electrodes, and common wires which are electrically connected in common to a plurality of pressure generating elements via the lead electrodes; and, the wiring boards are formed such that a spacing between the respective common wires of the two opposing wiring boards is narrower than a spacing between the respective individual wires of the two opposing wiring boards.
摘要:
A method for dividing a wafer into a plurality of chips is provided. The method includes providing recesses in a surface of the wafer at positions along boundaries between regions to become the individual chips, providing fragile portions having a predetermined width inside the wafer at positions along the boundaries by irradiation of the other surface of the wafer with a laser beam whose condensing point is placed inside the wafer, the fragile portions including connected portions at least at one of the surfaces of the wafer, and dividing the wafer at the fragile portions into the individual chips by applying an external force to the wafer.
摘要:
A break pattern is formed on a silicon wafer using an anisotropic etching process. The break pattern includes a plurality of through holes, each of having a first plane perpendicular to a plane defined by the silicon wafer, a second plane opposite to the first plane, a third plane that is perpendicular to the plane of the silicon wafer and intersects the first plane at an acute angle, and a fourth plane that is opposite to the third plane, is perpendicular to the plane of the silicon wafer, and intersects the second plane at an acute angle. The anisotropic etching is performed using a mask pattern having a predetermined shape to form, around the break pattern, a thin portion that has a smaller thickness than other portions of the silicon wafer. The silicon wafer is then divided into a plurality of silicon substrates along the break pattern.
摘要:
A liquid-jet head, comprising: a nozzle plate having nozzle orifices bored therein; a passage-forming substrate provided with recesses including pressure generating chambers communicating with the nozzle orifices; piezoelectric elements provided on a surface of the passage-forming substrate via a vibration plate, each piezoelectric element including a lower electrode, a piezoelectric layer, and an upper electrode; and a joining plate joined to the surface of the passage-forming substrate, where the piezoelectric elements are formed, via an adhesive layer comprising an adhesive agent, wherein a plurality of contact portions and a joining portion are provided in a region where the joining plate is joined to the passage-forming substrate, the plurality of contact portions are protruded at a predetermined height on the vibration plate, and are substantially contacted by the joining plate, and the joining portion has the adhesive layer of a thickness equal to or larger than the height of the contact portions.
摘要:
The present invention includes a passage-forming substrate on which pressure generating chambers communicating with nozzle orifices ejecting a liquid are respectively formed separately from each other, and actuator devices each including a vibration plate provided on the passage-forming substrate, wherein, a protective plate is jointed to a side of the passage-forming substrate, the side facing the actuator devices, and driver circuits for driving the actuator devices are provided on the protective plate, and wherein each of the driver circuits is provided with individual terminals to which individual electrodes of the respective actuator devices are electrically connected, and connection terminals to which an external wiring line is directly connected, and each of the driver circuits is also provided with a common terminal electrically connected to a common electrode common to more than one of the actuator devices, and with a common connection terminal which is connected to the common terminal through a conductive wiring line and to which an external wiring line is directly connected.
摘要:
Disclosed are a liquid-jet apparatus, and the liquid-jet head unit including: a liquid-jet head in which nozzle orifices for ejecting ink droplets are arranged in parallel lines; and a head case fixed to the liquid-jet head. A linear expansion coefficient in a reference direction, which is a direction in which the nozzle orifices of the head case are arranged in parallel lines, is set less than a linear expansion coefficient thereof in a direction orthogonal to the reference direction.