公开(公告)号：US20080054918A1

公开(公告)日：2008-03-06

申请号：US11511285

申请日：2006-08-29

Applicant: Hsin-Hung Lin ,  Shih-Cheng Wu ,  Wei-Cheng Ku ,  Chien-Liang Chen ,  Ming-Chi Chen ,  Hendra Sudin

Inventor： Hsin-Hung Lin ,  Shih-Cheng Wu ,  Wei-Cheng Ku ,  Chien-Liang Chen ,  Ming-Chi Chen ,  Hendra Sudin

IPC: G01R31/02

CPC classification number: G01R1/07371 ,  G01R1/06772

Abstract: A vertical-type probe card includes a circuit board, which has signal circuits and grounding circuits arranged in such a manner that each signal circuit is disposed in parallel and adjacent to one grounding circuit and kept a predetermined distance from the grounding circuit, and a probe assembly, which is arranged at the bottom side of the circuit board and has an upper guide plate, a lower guide plate, a conducting layer provided on the lower guide plate, a plurality of signal probes respectively electrically connected to the signal circuits and adjacent to a plurality of compensation probes, and at least one grounding probe electrically connected to the grounding circuits in a manner that the signal, compensation and grounding probes are vertically inserted through the upper and lower guide plates, and the conducting layer is conducted with the compensation probe and the grounding probe while electrically insulated to the signal probe.

Abstract translation: 垂直型探针卡包括电路板，其具有信号电路和接地电路，其布置成使得每个信号电路并联并且邻近一个接地电路并且与接地电路保持预定距离，并且探针 组件，其布置在电路板的底侧，并具有上引导板，下引导板，设置在下引导板上的导电层，多个信号探头，分别电连接到信号电路并邻近 多个补偿探针和至少一个接地探针，以使得信号，补偿和接地探针垂直插入上，下引导板的方式电连接到接地电路，并且导电层通过补偿探针 和接地探头，同时与信号探头电绝缘。

公开(公告)号：US20080007278A1

公开(公告)日：2008-01-10

申请号：US11583740

申请日：2006-10-20

Applicant: Wei-Cheng Ku ,  Hsin-Hung Lin ,  Chih-Hao Ho ,  Te-Chen Feng

Inventor： Wei-Cheng Ku ,  Hsin-Hung Lin ,  Chih-Hao Ho ,  Te-Chen Feng

IPC: G01R31/02

CPC classification number: G01R31/2889 ,  G01R1/06772

Abstract: A high-frequency probe card includes a circuit board having signal circuits and grounding circuits, transmission lines each having a bi-wire structure including a first lead wire for transmitting high-frequency signal and a second lead wire connected to the grounding circuits, and signal probes. High-frequency test signal provided by a test machine to the signal circuits can be transmitted to the signal probes through the first lead wires. Since the grounding circuits and second lead wires are provided adjacent to the signal circuits and first lead wires respectively, the high-frequency signal can be efficiently transmitted and the characteristic impedance matching can be maintained during high-frequency signal transmission. The bi-wire structure of the transmission lines has a diameter equal to or less than 1 millimeter, thereby allowing installation of a big number of the transmission lines such that the high-frequency test for a big number of electronic elements can be realized.

Abstract translation: 高频探针卡包括具有信号电路和接地电路的电路板，各传输线均具有双线结构，包括用于传输高频信号的第一引线和连接到接地电路的第二引线，以及信号 探针。 由测试机提供的信号电路的高频测试信号可以通过第一个引线传输到信号探头。 由于接地电路和第二引线分别与信号电路和第一引线相邻地设置，所以可以有效地发送高频信号，并且可以在高频信号传输期间保持特性阻抗匹配。 传输线的双线结构的直径等于或小于1毫米，从而可以安装大量的传输线，从而可以实现大量电子元件的高频测试。

公开(公告)号：US20070114204A1

公开(公告)日：2007-05-24

申请号：US11512185

申请日：2006-08-30

Applicant: Chih-Yung Cheng ,  H. Fan ,  Chih-Chung Chen ,  Hsin-Hung Lin

Inventor： Chih-Yung Cheng ,  H. Fan ,  Chih-Chung Chen ,  Hsin-Hung Lin

IPC: C23F1/00

CPC classification number: G01R3/00 ,  G01R1/07357

Abstract: A method for making a guide panel for a vertical probe card in batch includes the steps of a) preparing a non-metal substrate, b) forming a shielding layer having a plurality of openings on the substrate, c) etching a part of the substrate corresponding to the openings of the shielding layer by an anisotropic etching so as to form bind holes with a predetermined depth on the substrate, d) grinding the substrate to open the blind holes by a back side thinning technology so as to form micro feed through holes on the substrate, and e) removing the shielding layer so as to obtain the desired guide panel.

Abstract translation: 分批制造垂直探针卡的引导面板的方法包括以下步骤：a）制备非金属基底，b）在基底上形成具有多个开口的屏蔽层，c）蚀刻基底的一部分 对应于通过各向异性蚀刻的屏蔽层的开口，以便在基板上形成预定深度的结合孔，d）研磨基板以通过背面薄化技术打开盲孔，以形成微进给通孔 并且e）去除屏蔽层以获得所需的引导面板。

公开(公告)号：US20070037271A1

公开(公告)日：2007-02-15

申请号：US11203311

申请日：2005-08-15

Applicant: Jang-Chi Huang ,  Hsin-Hung Lin

Inventor： Jang-Chi Huang ,  Hsin-Hung Lin

IPC: C12N1/04 ,  C12M1/00

CPC classification number: A01N1/02 ,  A01N1/0242 ,  A01N1/0257

Abstract: An apparatus for microdrop vitrification has a tank and two wings. The tank has a bottom, two side edges, two top edges, two sidewalls, a lowest bottom, a drain and a spout. The drain is defined in one of the sidewalls at the bottom of the tank. The spout is mounted on the bottom of the tank and is connected to the drain. The wings are integrally formed respectively with and extend out from the top edges. The present invention also relates to a microdrop forming device, a method for microdrop vitrification and a method for recovering vitrified cells.

Abstract translation: 用于微滴玻璃化的装置具有罐和两个翼。 罐具有底部，两个侧边缘，两个顶部边缘，两个侧壁，最底部，排水口和喷口。 排水管限定在罐底部的一个侧壁中。 喷嘴安装在罐底部并连接到排水管。 翼部分别与上边缘分别形成并从其延伸出来。 本发明还涉及微滴形成装置，微滴玻璃化方法和回收玻璃化细胞的方法。

公开(公告)号：US06371196B1

公开(公告)日：2002-04-16

申请号：US09552881

申请日：2000-04-20

Applicant: Lang-Fu Tsai ,  Hsin-Hung Lin ,  Yuh-Long Lin ,  Hsuan Peng ,  Chi-Shien Lee ,  Wen-Min Hsu ,  Ming-Lang Chang ,  Wann-Fu Su

Inventor： Lang-Fu Tsai ,  Hsin-Hung Lin ,  Yuh-Long Lin ,  Hsuan Peng ,  Chi-Shien Lee ,  Wen-Min Hsu ,  Ming-Lang Chang ,  Wann-Fu Su

IPC: B22D1700

CPC classification number: B22D17/2015

Abstract: An injection molding apparatus has a barrel for conveying a molten substance, a screw, a first base for supporting the barrel, a power unit, a second base for supporting the power unit, links, a motor, a screw driver, a plurality of injection guide links, and an injection connecting plate. The first base is threadedly secured to the bed. The barrel has one end secured to the first base. The power unit is fixed on the second base. The links each have one end connected to the first base and the other end connected to the second base. The screw driver between the bases is moved under the guidance of the injection guide links. The injection guide links penetrate through the second base, having one end secured to the screw driver with the injection connecting plate provided in the second base. The injection connecting plate is pivotably secured to the power unit. These features are adopted to the deformation caused by heat, and provide a closed loop of force, isolation of deformation, and a modular design that is particularly suitable to high speed injection molding.

Abstract translation: 注射成型装置具有用于输送熔融物质的桶，螺钉，用于支撑筒的第一基座，动力单元，用于支撑动力单元的第二基座，连杆，马达，螺丝刀，多个注射 导向连杆和注射连接板。 第一个基座螺纹固定在床上。 桶的一端固定在第一底座上。 电源单元固定在第二个基座上。 连杆各自具有连接到第一基座的一端，另一端连接到第二基座。 基座之间的螺丝刀在注射导向连杆的引导下移动。 注射导向连杆穿过第二底座，其一端通过设置在第二底座中的注射连接板固定到螺丝刀上。 注射连接板可枢转地固定到动力单元上。 这些特征被用于由热引起的变形，并且提供了一个闭环的力，隔离变形，以及特别适用于高速注射成型的模块化设计。