摘要:
A power coupling device comprises a driving coupler mounted in the driving unit having a first connection part and a first positioning part; and a driven coupler mounted in the driven part having a second connection part and a second positioning part, respectively. The driven coupler having a first coupler member fixed to the driven part; a second coupler member having the second connection part and the second positioning part for connection with the first coupler member; and a connection means for connecting the first coupler member with the second coupler member to control the connecting position. The connection means has a plurality of projections formed at one of the first and the second coupler members; and a plurality of depressions formed at the other one of the first and the second coupler members.
摘要:
Disclosed is a ceramic package mounted with a crystal oscillator. The structure of the ceramic package is improved in order to reduce its size while minimizing thermal influence to a crystal wafer mounted on the ceramic package. The crystal oscillator ceramic package has a bottom sheet, a buffer sheet disposed on a periphery of the bottom sheet and having internal terminals on a top thereof, a crystal wafer mounted on the buffer sheet, a supporting sheet formed on a periphery of the buffer sheet and spaced from the internal terminal on the buffer sheet at a designated interval and a lib covering the supporting sheet for sealing a portion of the ceramic package for receiving the crystal wafer.
摘要:
A temperature compensated crystal includes a crystal package including a package board and a crystal oscillating piece, conductive patterns for constituting a temperature compensating circuit formed on a surface of the package board, exterior terminals formed at corners of the board, temperature compensating components formed on the surface of the board, and resin molded part enveloping the surface of the board. With a lower surface of a crystal package serving as a component mounting area, it is not necessary to provide an additional printed circuit board required for mounting of temperature compensating components, and it is possible to provide a compact TCXO having a surface area corresponding to that of a crystal package.
摘要:
A sensor module comprising: a sensor unit for measuring a physical value; a reference input switch for receiving a command of a user; a memory for storing reference information; and a control unit for comparing the physical value measured by the sensor unit with the reference information stored in the memory and generating a control signal, where if the reference input switch is activated, the control unit updates the reference information by storing the physical value measured by the sensor unit in the memory.
摘要:
A data processing apparatus and method for allocating data to processors, allowing the processors to process the data efficiently. The data processing apparatus may predict a result of processing data, based on a workload for the data, according to a number of processors, and may determine the number of processors to be allocated with the data, using the predicted processing result.
摘要:
A liquid crystal display for recognizing a flicker with the naked eyes in a step of inspecting a flicker in the case where a liquid crystal display is driven with a frame frequency of 120 Hz is disclosed.In the liquid crystal display, a timing controller supplies a first frame inversion polarity signal which is used at a first frame inversion and, at the same time supplies a gate start pulse which indicates a supply of a scanning pulse. A frame polarity signal converting means converts a first frame inversion polarity signal into a second frame inversion polarity signal in response to the gate start pulse. And a data driver changes the inputted frame into a second frame inversion in response to the second frame inversion polarity signal.
摘要:
A connector receives first and second differential signals. First and second signal lines are connected to the connector, and transmit the first and second differential signals, respectively. First and second differential capacitors have first and second end terminals to remove noise components of the first and second differential signals. Each of the first end terminals is connected to ground potential. The second end terminals are connected to the first and second differential lines, respectively. A differential resistor is connected to the first and second signal lines to remove the noise components of the first and second differential signals. A receiving part is connected to the first and second signal lines to receive the first and second differential signals through the differential resistor and the first and second differential capacitors.
摘要:
A method of making an assembly package having an air tight cavity for housing an electronic element such as a GaAs semiconductor chip. The method includes the formation of a dielectric base by placing a placing a conductive lead frame comprising a frame pad and a plurality of conductive leads inside a die having a top interior surface and a bottom interior surface, injecting a thermally setting liquefied epoxy into die cavity, curing the epoxy and removing the die. The die includes at least one post which protrudes toward the die's top interior surface such that the top surface of the post presses the inner end of each of said plurality of conductive leads against the top interior surface of the die, and also includes a pin protruding from the die's top interior surface toward the post's top surface. The post firmly holds the conductive leads in a common level plane during the injection of the epoxy into the cavity while the use of the pin results in a the formation of a pin hole in the dielectric base. Once the dielectric base is formed, the conductive leads and frame pad are plated and bonded to the electronic element. A thermally setting liquefied epoxy thereafter is dispensed onto the conductive leads and the dielectric frame disposed between the leads and a shell is positioned onto the dispensed epoxy and the epoxy is cured at an elevated temperature to form a seal between the shell and the conductive leads and dielectric base. Following the bonding of the shell, the pin hole is filled with a thermally setting liquefied epoxy and the epoxy is cured. The resulting assembly package comprises an air tight cavity housing the electronic element.
摘要:
The present invention is regarding a structure for fastening decking lumber woods for a wooden deck. The present invention includes a first deck wood (10a) and a second deck wood (10b) with a form of a certain thickness and extended to a certain length and the cross member, the joist, placed underneath and perpendicular to the deck lumber woods, and the bracket (100) that allows to fix the first deck wood (10a) and the second deck wood (10b) onto the cross member with a fastening material through the gap space between the deck woods without touching them so the deck wood can breath freely thus, preventing them from splitting.
摘要:
An operation replay module comprises: a manipulation command input unit that receives a manipulation command from a user; an output unit that outputs a control signal corresponding to the manipulation command from the manipulation command input unit; a memory that stores history of the manipulation command; a replay command input unit that receives a replay command from the user; and a micom that outputs a control signal corresponding to the history of the manipulation command stored in the memory to the output unit, if the micom receives the replay command from the replay command input unit.