公开(公告)号：US20040219375A1

公开(公告)日：2004-11-04

申请号：US10826508

申请日：2004-04-16

Applicant: MEC COMPANY LTD.

Inventor： Mutsuyuki Kawaguchi ,  Satoshi Saito ,  Jun Hisada ,  Toshiko Nakagawa

IPC: B32B015/08 ,  B32B015/04

CPC classification number: H05K3/384 ,  C23C18/48 ,  H01L2924/0002 ,  H05K2201/0355 ,  H05K2203/073 ,  Y10T428/12715 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/265 ,  Y10T428/31678 ,  Y10T428/31681 ,  H01L2924/00

Abstract: A bonding layer for bonding resin is provided that is formed on a copper surface, and contains an alloy of: (a) copper; (b) tin; and (c) at least one type of metal (third metal) selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum. The copper is contained in an amount of 1 to 50 atom %, the tin is contained in an amount of 20 to 98 atom %, and the third metal is contained in an amount of 1 to 50 atom %. The bonding layer has a thickness of not less than 0.001 nullm and not more than 1 nullm. Thus, adhesion between copper and resin can be enhanced.

Abstract translation: 提供了一种用于粘结树脂的接合层，其形成在铜表面上，并且包含以下合金：（a）铜; （b）锡; 和（c）选自银，锌，铝，钛，铋，铬，铁，钴，镍，钯，金和铂中的至少一种金属（第三金属）。 铜的含量为1〜50原子％，锡的含量为20〜98原子％，第3金属含量为1〜50原子％。 接合层的厚度为0.001μm以上1μm以下。 因此，可以提高铜和树脂之间的粘合性。