公开(公告)号：US20040219375A1

公开(公告)日：2004-11-04

申请号：US10826508

申请日：2004-04-16

Applicant: MEC COMPANY LTD.

Inventor： Mutsuyuki Kawaguchi ,  Satoshi Saito ,  Jun Hisada ,  Toshiko Nakagawa

IPC: B32B015/08 ,  B32B015/04

CPC classification number: H05K3/384 ,  C23C18/48 ,  H01L2924/0002 ,  H05K2201/0355 ,  H05K2203/073 ,  Y10T428/12715 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/265 ,  Y10T428/31678 ,  Y10T428/31681 ,  H01L2924/00

Abstract: A bonding layer for bonding resin is provided that is formed on a copper surface, and contains an alloy of: (a) copper; (b) tin; and (c) at least one type of metal (third metal) selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum. The copper is contained in an amount of 1 to 50 atom %, the tin is contained in an amount of 20 to 98 atom %, and the third metal is contained in an amount of 1 to 50 atom %. The bonding layer has a thickness of not less than 0.001 nullm and not more than 1 nullm. Thus, adhesion between copper and resin can be enhanced.

Abstract translation: 提供了一种用于粘结树脂的接合层，其形成在铜表面上，并且包含以下合金：（a）铜; （b）锡; 和（c）选自银，锌，铝，钛，铋，铬，铁，钴，镍，钯，金和铂中的至少一种金属（第三金属）。 铜的含量为1〜50原子％，锡的含量为20〜98原子％，第3金属含量为1〜50原子％。 接合层的厚度为0.001μm以上1μm以下。 因此，可以提高铜和树脂之间的粘合性。

公开(公告)号：US20040219377A1

公开(公告)日：2004-11-04

申请号：US10826091

申请日：2004-04-16

Applicant: MEC COMPANY LTD.

Inventor： Mutsuyuki Kawaguchi ,  Satoshi Saito ,  Jun Hisada ,  Naomi Kanda ,  Toshiko Nakagawa

IPC: B32B015/08 ,  C23C018/31

CPC classification number: C23C18/48 ,  C23C18/31 ,  H01L2924/0002 ,  H05K3/384 ,  H05K2203/072 ,  Y10T428/31681 ,  H01L2924/00

Abstract: A surface of copper is brought into contact with an aqueous solution for forming a bonding layer for bonding resin comprising: (a) at least one type of acid selected from inorganic acid and organic acid; (b) tin salt or tin oxide; (c) salt or oxide of at least one type of metal selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum; (d) a reaction accelerator; and (e) a diffusive retaining solvent, so that an alloy layer of tin and the at least one type of metal selected in (c) is formed on the surface of the copper. Subsequently, a portion of the alloy layer of the tin and the at least one type of metal selected in (c) other than a portion of the alloy layer that is a layer in which the copper, the tin, and the at least one type of metal selected in (c) are diffused is removed, so that a bonding layer for bonding resin containing an alloy of copper, tin, and the at least one type of metal selected in (c) is formed on a surface of copper. Thus, adhesion between copper and resin can be enhanced. The present invention provides the above-mentioned bonding layer forming solution, a method of producing a copper-to-resin bonding layer using the solution, and a layered product obtained thereby.

Abstract translation: 使铜的表面与用于形成粘合树脂的粘合层的水溶液接触，包括：（a）至少一种选自无机酸和有机酸的酸; （b）锡盐或氧化锡; （c）选自银，锌，铝，钛，铋，铬，铁，钴，镍，钯，金和铂中的至少一种金属的盐或氧化物; （d）反应促进剂; 和（e）扩散保持溶剂，使得在铜的表面上形成锡的合金层和（c）中选择的至少一种类型的金属。 随后，在（c）中选择的锡的合金层和至少一种类型的金属的一部分，除了作为铜，锡和至少一种类型的层的合金层的一部分 去除在（c）中选择的金属被扩散，从而在铜的表面上形成用于粘合含有铜，锡的合金的树脂和在（c）中选择的至少一种类型的金属的粘合层。 因此，可以提高铜和树脂之间的粘合性。 本发明提供上述粘合层形成溶液，使用该溶液制备铜 - 树脂粘合层的方法和由此获得的层叠体。