公开(公告)号：US20020192460A1

公开(公告)日：2002-12-19

申请号：US10131771

申请日：2002-04-23

Applicant: MEC COMPANY LTD.

Inventor： Mutsuyuki Kawaguchi ,  Jun Hisada ,  Toshiko Nakagawa

IPC: B32B015/08 ,  B05D001/36 ,  B05D003/10

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B37/0038 ,  B32B38/0012 ,  B32B2311/12 ,  B32B2398/00 ,  B32B2457/08 ,  C23C22/52 ,  H05K3/389 ,  Y10S428/91 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/273 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31529 ,  Y10T428/3154 ,  Y10T428/31681

Abstract: A laminate is made by adhering at least one metal layer selected from the group consisting of copper and a copper alloy to a resin layer. A coating film of an azole-copper complex compound formed by a contact with an aqueous solution containing an azole compound in an range from 0.1 mass % to 15 mass % and an organic acid in a range from 1 mass % to 80 mass % is formed on the metal layer surface, and the metal layer adheres to the resin layer via the coating film of the azole-copper complex compound. Thereby, the present invention provides a laminate with improved adhesion between a surface of copper or a copper alloy and resin in a multilayered printed circuit board, and also a method of manufacturing the laminate.

Abstract translation: 通过将选自铜和铜合金的至少一种金属层粘附到树脂层上来制造层压体。 形成通过与含有0.1质量％-15质量％的唑类化合物的水溶液和1质量％至80质量％范围内的有机酸接触形成的唑 - 铜络合物的涂膜 在金属层表面上，并且金属层通过唑 - 铜络合物的涂膜粘附到树脂层。 因此，本发明提供了一种具有改进的铜或铜合金表面与多层印刷电路板中的树脂之间的粘附性的层压体，以及制造层压体的方法。

公开(公告)号：US20040219377A1

公开(公告)日：2004-11-04

申请号：US10826091

申请日：2004-04-16

Applicant: MEC COMPANY LTD.

Inventor： Mutsuyuki Kawaguchi ,  Satoshi Saito ,  Jun Hisada ,  Naomi Kanda ,  Toshiko Nakagawa

IPC: B32B015/08 ,  C23C018/31

CPC classification number: C23C18/48 ,  C23C18/31 ,  H01L2924/0002 ,  H05K3/384 ,  H05K2203/072 ,  Y10T428/31681 ,  H01L2924/00

Abstract: A surface of copper is brought into contact with an aqueous solution for forming a bonding layer for bonding resin comprising: (a) at least one type of acid selected from inorganic acid and organic acid; (b) tin salt or tin oxide; (c) salt or oxide of at least one type of metal selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum; (d) a reaction accelerator; and (e) a diffusive retaining solvent, so that an alloy layer of tin and the at least one type of metal selected in (c) is formed on the surface of the copper. Subsequently, a portion of the alloy layer of the tin and the at least one type of metal selected in (c) other than a portion of the alloy layer that is a layer in which the copper, the tin, and the at least one type of metal selected in (c) are diffused is removed, so that a bonding layer for bonding resin containing an alloy of copper, tin, and the at least one type of metal selected in (c) is formed on a surface of copper. Thus, adhesion between copper and resin can be enhanced. The present invention provides the above-mentioned bonding layer forming solution, a method of producing a copper-to-resin bonding layer using the solution, and a layered product obtained thereby.

Abstract translation: 使铜的表面与用于形成粘合树脂的粘合层的水溶液接触，包括：（a）至少一种选自无机酸和有机酸的酸; （b）锡盐或氧化锡; （c）选自银，锌，铝，钛，铋，铬，铁，钴，镍，钯，金和铂中的至少一种金属的盐或氧化物; （d）反应促进剂; 和（e）扩散保持溶剂，使得在铜的表面上形成锡的合金层和（c）中选择的至少一种类型的金属。 随后，在（c）中选择的锡的合金层和至少一种类型的金属的一部分，除了作为铜，锡和至少一种类型的层的合金层的一部分 去除在（c）中选择的金属被扩散，从而在铜的表面上形成用于粘合含有铜，锡的合金的树脂和在（c）中选择的至少一种类型的金属的粘合层。 因此，可以提高铜和树脂之间的粘合性。 本发明提供上述粘合层形成溶液，使用该溶液制备铜 - 树脂粘合层的方法和由此获得的层叠体。

公开(公告)号：US20040219375A1

公开(公告)日：2004-11-04

申请号：US10826508

申请日：2004-04-16

Applicant: MEC COMPANY LTD.

Inventor： Mutsuyuki Kawaguchi ,  Satoshi Saito ,  Jun Hisada ,  Toshiko Nakagawa

IPC: B32B015/08 ,  B32B015/04

CPC classification number: H05K3/384 ,  C23C18/48 ,  H01L2924/0002 ,  H05K2201/0355 ,  H05K2203/073 ,  Y10T428/12715 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/265 ,  Y10T428/31678 ,  Y10T428/31681 ,  H01L2924/00

Abstract: A bonding layer for bonding resin is provided that is formed on a copper surface, and contains an alloy of: (a) copper; (b) tin; and (c) at least one type of metal (third metal) selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum. The copper is contained in an amount of 1 to 50 atom %, the tin is contained in an amount of 20 to 98 atom %, and the third metal is contained in an amount of 1 to 50 atom %. The bonding layer has a thickness of not less than 0.001 nullm and not more than 1 nullm. Thus, adhesion between copper and resin can be enhanced.

Abstract translation: 提供了一种用于粘结树脂的接合层，其形成在铜表面上，并且包含以下合金：（a）铜; （b）锡; 和（c）选自银，锌，铝，钛，铋，铬，铁，钴，镍，钯，金和铂中的至少一种金属（第三金属）。 铜的含量为1〜50原子％，锡的含量为20〜98原子％，第3金属含量为1〜50原子％。 接合层的厚度为0.001μm以上1μm以下。 因此，可以提高铜和树脂之间的粘合性。